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    • 10. 发明授权
    • CMP method for noble metals
    • 贵金属的CMP方法
    • US06527622B1
    • 2003-03-04
    • US10054059
    • 2002-01-22
    • Vlasta BrusicFrancesco M. De RegeKevin J. MoeggenborgIsaac K. CherianRenjie Zhou
    • Vlasta BrusicFrancesco M. De RegeKevin J. MoeggenborgIsaac K. CherianRenjie Zhou
    • B24B100
    • H01L21/3212B24B37/044C09G1/02C09K3/1463C23F3/04C23F3/06H01L28/65
    • The invention provides a method of polishing a substrate comprising a noble metal comprising (i) contacting the substrate with a CMP system and (ii) abrading at least a portion of the substrate to polish the substrate. The CMP systems each comprise an abrasive and/or polishing pad, a liquid carrier, and optionally one or more polishing additives. In a first embodiment, the polishing additives are selected from the group consisting of diketones, diketonates, heterocyclic nitrogen-containing compounds, heterocyclic oxygen-containing compounds, heterocyclic phosphorus-containing compounds, urea compounds, nitrogen-containing compounds that can be zwitterionic compounds, salts thereof, and combinations thereof. In a second embodiment, the polishing additive is a metal compound with two or more oxidation states and is used in conjunction with a peroxy-type oxidizer. In a third embodiment, the CMP system comprises &agr;-alumina and fumed alumina, wherein the weight ratio of &agr;-alumina to fumed alumina is about 0.6:1 to about 9:1.
    • 本发明提供一种抛光包括贵金属的基材的方法,包括(i)使基板与CMP系统接触,以及(ii)研磨基材的至少一部分以抛光基材。 CMP系统各自包括磨料和/或抛光垫,液体载体和任选的一种或多种抛光添加剂。 在第一实施方案中,抛光添加剂选自二酮,二酮,杂环含氮化合物,含杂环氧的化合物,含杂环的化合物,尿素化合物,可以是两性离子化合物的含氮化合物, 其盐,及其组合。 在第二实施方案中,抛光添加剂是具有两种或更多种氧化态的金属化合物,并与过氧型氧化剂结合使用。 在第三个实施方案中,CMP系统包括α-氧化铝和热解氧化铝,其中α-氧化铝与热解氧化铝的重量比为约0.6:1至约9:1。