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1. 发明申请

US20050104176A1 High temperature electronic devices 有权
标题翻译：高温电子设备
公开(公告)号：US20050104176A1
公开(公告)日：2005-05-19
申请号：US10992145
申请日：2004-11-18
申请人： Paul Rodney , James Masino , Christopher Golla , Roger Schultz , James Freeman
发明人： Paul Rodney , James Masino , Christopher Golla , Roger Schultz , James Freeman
IPC分类号： B81B7/00 , E21B20060101 , E21B7/00 , E21B45/00 , G01V20060101 , G01V3/08 , H01L20060101 , H01L21/86 , H01L23/02 , H01L27/12 , H01Q20060101
CPC分类号： E21B47/0002 , B81B2207/115 , E21B47/011 , G01V1/40 , H01L21/86 , H01L23/3157 , H01L27/12 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/13091 , H01L2924/3011 , H01L2924/00
摘要： In at least some embodiments, electronic devices suitable for use at temperatures in excess of 200 C. may comprise an integrated circuit fabricated on a silicon carbide substrate, and a thick passivation layer. In other embodiments, electronic devices suitable for use at temperatures in excess of 200 C. may comprise an integrated circuit formed from silicon located on a sapphire substrate, and a thick passivation layer. The electronic devices may be implemented in the context of hydrocarbon drilling and production operations.
摘要翻译：在至少一些实施例中，适于在超过200℃的温度下使用的电子器件可以包括在碳化硅衬底上制造的集成电路和厚钝化层。在其它实施例中，适于在超过200℃的温度下使用的电子器件可以包括由位于蓝宝石衬底上的硅形成的集成电路和厚钝化层。电子设备可以在碳氢化合物钻探和生产操作的背景下实现。

2. 发明申请

US20060086506A1 Downhole cooling system 审中-公开
标题翻译：井下冷却系统
公开(公告)号：US20060086506A1
公开(公告)日：2006-04-27
申请号：US10973133
申请日：2004-10-26
申请人： Christopher Golla , James Masino , Roger Schultz
发明人： Christopher Golla , James Masino , Roger Schultz
IPC分类号： E21B43/24
CPC分类号： E21B47/011
摘要： Apparatus and methods for operating an electronics assembly of a downhole tool. A method comprises disposing a temperature-sensitive electronic component within an insulated chamber contained within a downhole tool. The temperature of the temperature-sensitive electronic component is monitored and a temperature control system is selectively activated to regulate the temperature of the temperature-sensitive electronic component. A downhole electronic assembly comprises a temperature-sensitive electronic component and a temperature-tolerant electronic component in electrical communication with the temperature-sensitive electronic component. An insulating chamber provides a thermal barrier between the temperature-sensitive electronic component and the temperature-tolerant electronic component. A temperature control apparatus in thermal communication with the temperature-sensitive component.
摘要翻译：用于操作井下工具的电子组件的装置和方法。一种方法包括将温度敏感的电子部件设置在包含在井下工具内的绝热室内。监测温度敏感的电子元件的温度，选择性地激活温度控制系统以调节温度敏感的电子部件的温度。井下电子组件包括温度敏感电子部件和与温度敏感电子部件电连通的耐温电子部件。绝缘室在温度敏感的电子部件和耐温电子部件之间提供热障碍。与温度敏感部件热连通的温度控制装置。

3. 发明申请

US20060060964A1 Method and apparatus for high temperature operation of electronics 有权
标题翻译：电子元件高温运行的方法和装置
公开(公告)号：US20060060964A1
公开(公告)日：2006-03-23
申请号：US10946813
申请日：2004-09-22
申请人： Christopher Golla , Roger Schultz , James Masino
发明人： Christopher Golla , Roger Schultz , James Masino
IPC分类号： H01L21/44 , H01L23/34
CPC分类号： H01L25/18 , E21B47/011 , H01L23/34 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are coupled to a surface of the substrate. A lid is positioned above the substrate facing the surface. One or more pieces of compliant and thermally conductive material are compressed between at least one of the integrated circuits and the lid. The lid defines in part an enclosed volume containing the compliant and thermally conductive material.
摘要翻译：公开了用于根据本发明的电子设备的高温操作的方法和装置的实施例。本发明的一个实施例通常包括具有基板的集成电路封装。多个集成电路耦合到衬底的表面。盖子位于面向表面的基板上。一个或多个顺应性和导热材料在至少一个集成电路和盖子之间被压缩。盖子部分地限定包含顺从性和导热材料的封闭容积。

4. 发明授权

US07268019B2 Method and apparatus for high temperature operation of electronics 有权
标题翻译：电子元件高温运行的方法和装置
公开(公告)号：US07268019B2
公开(公告)日：2007-09-11
申请号：US10946813
申请日：2004-09-22
申请人： Christopher Golla , Roger L. Schultz , James Masino
发明人： Christopher Golla , Roger L. Schultz , James Masino
IPC分类号： H01L21/00 , H01L23/34
CPC分类号： H01L25/18 , E21B47/011 , H01L23/34 , H01L23/38 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of methods and apparatus for high temperature operation of electronics according to the invention are disclosed. One embodiment of the invention generally includes an integrated circuit package having a substrate. A plurality of integrated circuits are coupled to a surface of the substrate. A lid is positioned above the substrate facing the surface. One or more pieces of compliant and thermally conductive material are compressed between at least one of the integrated circuits and the lid. The lid defines in part an enclosed volume containing the compliant and thermally conductive material.
摘要翻译：公开了用于根据本发明的电子设备的高温操作的方法和装置的实施例。本发明的一个实施例通常包括具有基板的集成电路封装。多个集成电路耦合到衬底的表面。盖子位于面向表面的基板上。一个或多个顺应性和导热材料在至少一个集成电路和盖子之间被压缩。盖子部分地限定包含顺从性和导热材料的封闭容积。

5. 发明申请

US20060227024A1 Temperature compensation apparatus, systems, and methods 有权
标题翻译：温度补偿装置，系统和方法
公开(公告)号：US20060227024A1
公开(公告)日：2006-10-12
申请号：US11102119
申请日：2005-04-08
申请人： James Masino , Roger Schultz
发明人： James Masino , Roger Schultz
IPC分类号： H03M1/00
CPC分类号： H03M1/089 , H03M1/12
摘要： In some embodiments, apparatus and systems, as well as methods, may include providing an analog temperature output responsive to a combination signal comprising a combination of an analog compensation output and a reference signal, and converting the analog temperature output to a digital temperature output responsive to an analog reference signal output, perhaps according to a polynomial function. Providing a digital compensation output corresponding to the digital temperature output, and converting the digital compensation output to the analog compensation output responsive to the analog reference signal output may also be included.
摘要翻译：在一些实施例中，装置和系统以及方法可以包括响应于包括模拟补偿输出和参考信号的组合的组合信号提供模拟温度输出，并且将模拟温度输出转换为响应于数字温度输出到模拟参考信号输出，可能根据多项式函数。提供对应于数字温度输出的数字补偿输出，以及响应于模拟参考信号输出将数字补偿输出转换为模拟补偿输出。

6. 发明申请

US20050107079A1 Wireless telemetry systems and methods for real time transmission of electromagnetic signals through a lossy environment 审中-公开
标题翻译：无线遥测系统和方法，用于通过有损环境实时传输电磁信号
公开(公告)号：US20050107079A1
公开(公告)日：2005-05-19
申请号：US10714332
申请日：2003-11-14
申请人： Roger Schultz , Craig Zitterich , James Masino
发明人： Roger Schultz , Craig Zitterich , James Masino
IPC分类号： E21B47/12 , H04Q7/20
CPC分类号： E21B47/122
摘要： The current invention relates to novel systems and methods for communicating with equipment and sensors located within a lossy environment. In particular, the current invention provides a wireless telemetry system suitable for use in a lossy environment. The wireless telemetry system provides essentially “real-time” communication between subsurface devices and the surface. Additionally, the current invention provides a method for positioning wireless transceivers used in the telemetry systems of the current invention.
摘要翻译：本发明涉及用于与位于有损环境内的设备和传感器进行通信的新型系统和方法。特别地，本发明提供了适用于有损环境的无线遥测系统。无线遥测系统在地下设备和地面之间提供基本的“实时”通信。此外，本发明提供了一种用于定位在本发明的遥测系统中使用的无线收发器的方法。

7. 发明申请

US20050098318A1 High-temperature circuits 有权
标题翻译：高温电路
公开(公告)号：US20050098318A1
公开(公告)日：2005-05-12
申请号：US10702836
申请日：2003-11-06
申请人： Paul Rodney , James Masino , Roger Schultz
发明人： Paul Rodney , James Masino , Roger Schultz
IPC分类号： E21B36/00 , E21B43/24 , E21B49/00 , H01L23/34 , H05K20060101 , H05K1/02
CPC分类号： E21B36/003 , E21B47/011 , H01L23/34 , H01L2924/0002 , H05K1/0212 , H01L2924/00
摘要： Methods and systems for operating integrated circuits at temperatures higher than expected ambient temperatures. The heating may be of entire circuit boards, portions of the circuit boards (such as the components within a multiple-chip module) and/or single devices. Methods and related systems may be used in any high temperature environment such as downhole logging tools, and the devices so heated are preferably of silicon on insulator semiconductor technology.
摘要翻译：在高于预期环境温度的温度下运行集成电路的方法和系统。加热可以是整个电路板，电路板的部分（例如多芯片模块内的组件）和/或单个设备。方法和相关系统可以在诸如井下测井工具的任何高温环境中使用，并且如此加热的装置优选地是绝缘体上硅半导体技术。

8. 发明申请

US20060077602A1 Synchronous multi-phase AC-TO-DC converter 有权
标题翻译：同步多相交流 - 直流转换器
公开(公告)号：US20060077602A1
公开(公告)日：2006-04-13
申请号：US10962849
申请日：2004-10-12
申请人： James Masino , Roger Schultz
发明人： James Masino , Roger Schultz
IPC分类号： H02H3/42
CPC分类号： H02J1/10
摘要： Disclosed herein are various embodiments of power conversion systems and methods employing synchronous multi-phase AC-to-DC conversion. In one embodiment, a power converter comprises a transistor bridge and a switching controller that operates the transistor bridge in response to AC voltage threshold crossings. The switching controller may include a period counter to measure times between threshold crossings, and a delay counter to trigger a delayed state transition for the transistor bridge. One disclosed method embodiment comprises: receiving multiple phased alternating voltages; comparing each phased alternating voltage to a threshold; determining a period associated with voltage threshold crossings; triggering state transitions at some fraction of the period after each threshold crossing; and placing a transistor bridge into a configuration associated with a current state. For each state, the transistor bridge configuration is designed to couple phased alternating voltages to two output terminals in a sequence that produces a non-alternating voltage difference.
摘要翻译：这里公开了使用同步多相AC-DC转换的功率转换系统和方法的各种实施例。在一个实施例中，功率转换器包括晶体管桥接器和开关控制器，其响应于AC电压阈值交叉而操作晶体管桥接器。切换控制器可以包括用于测量阈值交叉之间的时间的周期计数器和用于触发晶体管桥的延迟状态转换的延迟计数器。一种公开的方法实施例包括：接收多个相控交流电压; 将每个相控交流电压与阈值进行比较; 确定与电压阈值交叉相关联的周期; 在每个阈值交叉后的一段时间内触发状态转换; 并将晶体管桥放置在与当前状态相关联的配置中。对于每个状态，晶体管桥结构被设计成以产生非交流电压差的顺序将相控交流电耦合到两个输出端。

9. 发明授权

US07750808B2 Data retrieval tags 有权
标题翻译：数据检索标签
公开(公告)号：US07750808B2
公开(公告)日：2010-07-06
申请号：US11124030
申请日：2005-05-06
申请人： James Masino , Li Gao , Chris Golla , Paul F. Rodney
发明人： James Masino , Li Gao , Chris Golla , Paul F. Rodney
IPC分类号： G08B13/14 , E21B47/01
CPC分类号： E21B47/12 , E21B47/124
摘要： Data retrieval tags, drillstring communications systems and methods, and computer programs are disclosed. The data retrieval tag includes an insulator substrate, at least one analog memory cell disposed on the insulator substrate and an antenna coupled to the analog memory.
摘要翻译：公开了数据检索标签，钻柱通信系统和方法以及计算机程序。数据检索标签包括绝缘体衬底，设置在绝缘体衬底上的至少一个模拟存储器单元和耦合到模拟存储器的天线。

10. 发明申请

US20060250243A1 Data retrieval tags 有权
标题翻译：数据检索标签
公开(公告)号：US20060250243A1
公开(公告)日：2006-11-09
申请号：US11124030
申请日：2005-05-06
申请人： James Masino , Li Gao , Chris Golla , Paul Rodney
发明人： James Masino , Li Gao , Chris Golla , Paul Rodney
IPC分类号： G08B13/14
CPC分类号： E21B47/12 , E21B47/124
摘要： Data retrieval tags, drillstring communications systems and methods, and computer programs are disclosed. The data retrieval tag includes an insulator substrate, at least one analog memory cell disposed on the insulator substrate and an antenna coupled to the analog memory.
摘要翻译：公开了数据检索标签，钻柱通信系统和方法以及计算机程序。数据检索标签包括绝缘体衬底，设置在绝缘体衬底上的至少一个模拟存储器单元和耦合到模拟存储器的天线。

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