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1. 发明授权

US07068363B2 Systems for inspection of patterned or unpatterned wafers and other specimen 有权
标题翻译：用于检查图案或未图案化晶片和其他样品的系统
公开(公告)号：US07068363B2
公开(公告)日：2006-06-27
申请号：US10456203
申请日：2003-06-06
申请人： Christopher F. Bevis , Mike Kirk , Mehdi Vaez-Iravani
发明人： Christopher F. Bevis , Mike Kirk , Mehdi Vaez-Iravani
IPC分类号： G01N21/88
CPC分类号： G01N21/956 , G01N21/474 , G01N21/94 , G01N21/9501
摘要： Systems for inspection of patterned and unpatterned wafers are provided. One system includes an illumination system configured to illuminate the specimen. The system also includes a collector configured to collect light scattered from the specimen. In addition, the system includes a segmented detector configured to separately detect different portions of the light such that azimuthal and polar angular information about the different portions of light is preserved. The detector may also be configured to produce signals representative of the different portions of the light. The system may also include a processor configured to detect defects on the specimen from the signals. In another embodiment, the system may include a stage that is configured to rotate and translate the specimen. In one such embodiment, the system may also include an illumination system configured to scan the specimen in a wide scan path during rotation and translation of the specimen.
摘要翻译：提供了用于图案化和未图案化晶片检查的系统。一个系统包括被配置为照亮样本的照明系统。该系统还包括收集器，用于收集从样品散射的光。此外，该系统包括分段检测器，其被配置为分别检测光的不同部分，使得保持关于光的不同部分的方位角和极坐标信息。检测器还可以被配置为产生表示光的不同部分的信号。该系统还可以包括处理器，其配置成从信号中检测样本上的缺陷。在另一个实施例中，系统可以包括被配置为旋转和平移样本的台。在一个这样的实施例中，系统还可以包括被配置为在样本的旋转和平移期间以宽扫描路径扫描样本的照明系统。

2. 发明申请

US20100235114A1 SYSTEMS AND METHODS FOR DETERMINING ONE OR MORE CHARACTERISTICS OF A SPECIMEN USING RADIATION IN THE TERAHERTZ RANGE 审中-公开
标题翻译：用于确定在TERAHERTZ范围内使用辐射的样本的一个或多个特征的系统和方法
公开(公告)号：US20100235114A1
公开(公告)日：2010-09-16
申请号：US12401029
申请日：2009-03-10
申请人： Ady Levy , Samuel Ngai , Christopher F. Bevis , Stefano Concina , John Fielden , Walter Mieher , Dieter Mueller , Neil Richardson , Dan Wack , Larry Wagner
发明人： Ady Levy , Samuel Ngai , Christopher F. Bevis , Stefano Concina , John Fielden , Walter Mieher , Dieter Mueller , Neil Richardson , Dan Wack , Larry Wagner
IPC分类号： G06F19/00 , G01N21/47 , G01N21/59 , G01N21/55
CPC分类号： G01N21/9505 , G01N21/3581 , H01L22/12
摘要： Systems and methods for determining one or more characteristics of a specimen using radiation in the terahertz range are provided. One system includes an illumination subsystem configured to illuminate the specimen with radiation. The system also includes a detection subsystem configured to detect radiation propagating from the specimen in response to illumination of the specimen and to generate output responsive to the detected radiation. The detected radiation includes radiation in the terahertz range. In addition, the system includes a processor configured to determine the one or more characteristics of the specimen using the output.
摘要翻译：提供了使用太赫兹范围内的辐射来确定样本的一个或多个特征的系统和方法。一个系统包括被配置为用辐射照射样本的照明子系统。该系统还包括检测子系统，该检测子系统被配置为响应于样本的照射来检测从样本传播的辐射，并响应于检测到的辐射产生输出。检测到的辐射包括太赫兹范围内的辐射。另外，该系统包括配置成使用该输出来确定样本的一个或多个特性的处理器。

3. 发明授权

US07505619B2 System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface 有权
标题翻译：用于进行自适应傅立叶滤波以检测检查表面的密集逻辑区域中的缺陷的系统和方法
公开(公告)号：US07505619B2
公开(公告)日：2009-03-17
申请号：US11314779
申请日：2005-12-20
申请人： Evan R. Mapoles , Grace H. Chen , Christopher F. Bevis , David W. Shortt
发明人： Evan R. Mapoles , Grace H. Chen , Christopher F. Bevis , David W. Shortt
IPC分类号： G06K9/00
CPC分类号： G01N21/95607 , G01N21/47 , G01N21/95623 , G01N2021/8822
摘要： A dark field surface inspection tool and system are disclosed herein. The tool includes an illumination source capable of scanning a light beam onto an inspection surface. Light scattered by each inspection point is captured as image data by a photo detector array arranged at a fourier plane. The images captured are adaptively filtered to remove a portion of the bright pixels from the images to generate filtered images. The filtered images are then analyzed to detect defects in the inspection surface. Methods of the invention include using die-to-die comparison to identify bright portions of scattering patterns and generate unique image filters associated with those patterns. The associated images are then filtered to generate filtered images which are then used to detect defects. Also, data models of light scattering behavior can be used to generate filters.
摘要翻译：本文公开了一种暗场表面检查工具和系统。该工具包括能够将光束扫描到检查表面上的照明源。由每个检查点散射的光通过布置在傅立叶平面上的光检测器阵列捕获为图像数据。捕获的图像被自适应地滤波以从图像中去除一部分亮像素以产生滤波图像。然后分析滤波图像以检测检查表面中的缺陷。本发明的方法包括使用管芯到管芯的比较来识别散射图案的亮部分并且生成与这些图案相关联的独特的图像滤波器。然后将相关联的图像过滤以产生滤波图像，然后将其用于检测缺陷。此外，可以使用光散射行为的数据模型来生成滤波器。

4. 发明申请

US20080207089A1 METHODS AND SYSTEMS FOR MONITORING A PARAMETER OF A MEASUREMENT DEVICE DURING POLISHING, DAMAGE TO A SPECIMEN DURING POLISHING, OR A CHARACTERISTIC OF A POLISHING PAD OR TOOL 有权
标题翻译：用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样品的损害，或抛光抛光或工具的特性
公开(公告)号：US20080207089A1
公开(公告)日：2008-08-28
申请号：US12032112
申请日：2008-02-15
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.
摘要翻译：提供了用于在抛光期间监测测量装置的参数的方法和系统，在抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。该方法还包括确定输出信号是否在输出信号的范围之外。超出范围的输出信号可能表示测量设备的参数失控。在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。该方法还包括从输出信号确定抛光垫的特性。

5. 发明授权

US07385699B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
公开(公告)号：US07385699B2
公开(公告)日：2008-06-10
申请号：US10785396
申请日：2004-02-23
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Anatoly Fabrikant , Christopher F. Bevis , Mark Ghinovker
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Anatoly Fabrikant , Christopher F. Bevis , Mark Ghinovker
IPC分类号： G01B11/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. An imaging optical system is used to measure a plurality of measured optical signals from a plurality of periodic targets on the sample. The targets each have a first structure in a first layer and a second structure in a second layer. There are predefined offsets between the first and second structures. A scatterometry overlay technique is then used to analyze the measured optical signals of the periodic targets and the predefined offsets of the first and second structures of the periodic targets to thereby determine an overlay error between the first and second structures of the periodic targets.

6. 发明授权

US07317531B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
标题翻译：使用散射法检测重叠误差的装置和方法
公开(公告)号：US07317531B2
公开(公告)日：2008-01-08
申请号：US10729838
申请日：2003-12-05
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael Adel , Anatoly Fabrikant , Christopher F. Bevis , John Fielden , Noah Bareket , Kenneth P. Gross , Piotr Zalicki , Dan Wack , Paola Dececco , Thaddeus G. Dziura , Mark Ghinovker
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael Adel , Anatoly Fabrikant , Christopher F. Bevis , John Fielden , Noah Bareket , Kenneth P. Gross , Piotr Zalicki , Dan Wack , Paola Dececco , Thaddeus G. Dziura , Mark Ghinovker
IPC分类号： G01B11/00 , G01J4/00 , G01N21/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed are techniques, apparatus, and targets for determining overlay error between two layers of a sample. In one embodiment, a method for determining overlay between a plurality of first structures in a first layer of a sample and a plurality of second structures in a second layer of the sample is disclosed. Targets A, B, C and D that each include a portion of the first and second structures are provided. Target A is designed to have an offset Xa between its first and second structures portions; target B is designed to have an offset Xb between its first and second structures portions; target C is designed to have an offset Xc between its first and second structures portions; and target D is designed to have an offset Xd between its first and second structures portions. Each of the offsets Xa, Xb, Xc and Xd is preferably different from zero; Xa is an opposite sign and differ from Xb; and Xc is an opposite sign and differs from Xd. The targets A, B, C and D are illuminated with electromagnetic radiation to obtain spectra SA, SB, SC, and SD from targets A, B, C, and D, respectively. Any overlay error between the first structures and the second structures is then determined using a linear approximation based on the obtained spectra SA, SB, SC, and SD.
摘要翻译：公开了用于确定样品的两层之间的重叠误差的技术，装置和目标。在一个实施例中，公开了一种用于确定样品的第一层中的多个第一结构与样品的第二层中的多个第二结构之间的叠层的方法。提供了各自包括第一和第二结构的一部分的目标A，B，C和D。目标A设计成在其第一和第二结构部分之间具有偏移Xa; 目标B设计成在其第一和第二结构部分之间具有偏移Xb; 目标C被设计成在其第一和第二结构部分之间具有偏移Xc; 并且目标D被设计成在其第一和第二结构部分之间具有偏移Xd。偏移量Xa，Xb，Xc和Xd中的每一个优选地不同于零; Xa是相反的符号，不同于Xb; Xc是相反的符号，与Xd不同。目标A，B，C和D用电磁辐射照射，以获得光谱S A，B，C，S和S，分别来自目标A，B，C和D的SUB> D

7. 发明授权

US07242477B2 Apparatus and methods for detecting overlay errors using scatterometry 有权
标题翻译：使用散射法检测重叠误差的装置和方法
公开(公告)号：US07242477B2
公开(公告)日：2007-07-10
申请号：US10785430
申请日：2004-02-23
申请人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Mark Ghinovker , Christopher F. Bevis , Noam Knoll , Moshe Baruch
发明人： Walter D. Mieher , Ady Levy , Boris Golovanesky , Michael Friedmann , Ian Smith , Michael E. Adel , Mark Ghinovker , Christopher F. Bevis , Noam Knoll , Moshe Baruch
IPC分类号： G01B11/00
CPC分类号： G03F9/7088 , G01N21/956 , G01N2021/213 , G03F7/70625 , G03F7/70633 , G03F7/70683 , G03F9/7049 , G03F9/7084
摘要： Disclosed is a method for determining an overlay error between at least two layers in a multiple layer sample. A sample having a plurality of periodic targets that each have a first structure in a first layer and a second structure in a second layer is provided. There are predefined offsets between the first and second structures. Using a scatterometry overlay metrology, scatterometry overlay data is obtained from a first set of the periodic targets based on one or more measured optical signals from the first target set on the sample. Using an imaging overlay metrology, imaging overlay data is obtained from a second set of the periodic targets based on one or more image(s) from the second target set on the sample.
摘要翻译：公开了一种用于确定多层样品中至少两层之间的覆盖误差的方法。提供具有多个周期性靶的样品，每个周期性靶在第一层中具有第一结构，在第二层中具有第二结构。在第一和第二结构之间有预定义的偏移。使用散射测绘重叠测量，基于来自样品上的第一目标组的一个或多个测量光信号，从第一组周期性目标获得散点测绘覆盖数据。使用成像覆盖度量，基于来自样品上的第二目标集的一个或多个图像，从第二组周期性目标获得成像覆盖数据。

8. 发明授权

US07175503B2 Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device 有权
标题翻译：用于从涡流装置的组合输出信号确定样品上的区域内的抛光特性的方法和系统
公开(公告)号：US07175503B2
公开(公告)日：2007-02-13
申请号：US10358069
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Systems and methods for characterizing polishing of a specimen are provided. One method includes scanning a specimen with an eddy current device during polishing to generate output signals at measurement spots across the specimen. The method also includes combining a portion of the output signals generated at the measurement spots located within a zone on the specimen. In addition, the method includes determining a characteristic of polishing within the zone from the combined portion of the output signals. In some instances, a zone may include a predetermined range of radial and azimuthal positions on the specimen. In one embodiment, the method may include determining a characteristic of polishing within more than one zone on the specimen. Some embodiments may include determining an additional characteristic of polishing from the characteristic of polishing within more than one zone on the specimen.
摘要翻译：提供了用于表征样品抛光的系统和方法。一种方法包括在抛光过程中用涡流装置扫描样品，以在样品上的测量点产生输出信号。该方法还包括组合在位于样品上的区域内的测量点处产生的输出信号的一部分。此外，该方法包括从输出信号的组合部分确定该区域内的抛光特性。在一些情况下，区域可以包括样品上的径向和方位位置的预定范围。在一个实施例中，该方法可以包括确定在样本上的多于一个区域内的抛光的特性。一些实施例可以包括从样品上的多于一个区域内的抛光特性确定抛光的附加特性。

9. 发明授权

US07052369B2 Methods and systems for detecting a presence of blobs on a specimen during a polishing process 有权
公开(公告)号：US07052369B2
公开(公告)日：2006-05-30
申请号：US10358104
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the blobs may include unwanted material disposed upon a contiguous portion of the measurement spots. In some instances, the blobs may include copper. In some embodiments, scanning the measurement spots may include measuring an optical property and/or an electrical property of the specimen at the measurement spots. Another embodiment includes dynamically determining a signal threshold distinguishing a presence of the blobs from an absence of the blobs. An additional embodiment includes determining an endpoint of polishing if, for example, blobs are not determined to be present on the specimen.

10. 发明授权

US06884146B2 Systems and methods for characterizing a polishing process 有权
标题翻译：表征抛光过程的系统和方法
公开(公告)号：US06884146B2
公开(公告)日：2005-04-26
申请号：US10358105
申请日：2003-02-04
申请人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
发明人： Kurt Lehman , Charles Chen , Ronald L. Allen , Robert Shinagawa , Anantha Sethuraman , Christopher F. Bevis , Thanassis Trikas , Haiguang Chen , Ching Ling Meng
IPC分类号： B24B37/04 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12 , B24D49/00
CPC分类号： B24B37/013 , B24B37/042 , B24B41/04 , B24B49/04 , B24B49/10 , B24B49/12
摘要： Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.
摘要翻译：提供了表征抛光工艺的系统和方法。一种方法包括在抛光期间用两个或更多个测量装置扫描样品。在一个实施例中，两个或更多个测量装置可以包括反射计和电容探针。在另一个实施例中，两个或更多个测量装置可以包括光学装置和涡流装置。另外的实施例涉及用于在抛光期间扫描试样的测量装置。该装置包括光源和扫描组件。扫描组件被配置为在抛光期间扫描来自光源的光穿过样品。另一测量装置包括耦合到第一光纤束的激光光源和耦合到第二光纤束的检测器。另外的方法包括在抛光过程的不同步骤期间用不同的测量装置扫描试样。

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