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1. 发明授权

US08394460B2 Method for mask-free localized organic grafting on conductive or semiconductive portions of composite surfaces 有权
标题翻译：在复合表面的导电或半导体部分上进行无掩模的局部有机接枝的方法
公开(公告)号：US08394460B2
公开(公告)日：2013-03-12
申请号：US10614516
申请日：2003-07-08
申请人： Christophe Bureau , Serge Palacin , Jean-Philippe Bourgoin , Sami Ameur , Julienne Charlier
发明人： Christophe Bureau , Serge Palacin , Jean-Philippe Bourgoin , Sami Ameur , Julienne Charlier
IPC分类号： B05D1/04 , B05D3/02
CPC分类号： C09D5/4476 , B05D1/007 , B05D1/18
摘要： A process for mask-free localized grafting of organic molecules capable of being electrically activated, onto a composite surface comprising conductive and/or semiconductive portions, by placing said organic molecules in contact with said composite surface, in which said grafting is performed electrochemically in a single step on chosen, defined areas of said conductive and/or semiconductive portions, said areas being brought to a potential higher than or equal to a threshold electrical potential determined relative to a reference electrode, said threshold electrical potential being the potential above which grafting of said organic molecules takes place.
摘要翻译：通过将所述有机分子与所述复合表面接触而将能够电激活的有机分子的无掩模局部接枝到包含导电和/或半导体部分的复合表面上的方法，其中所述接枝在电化学在所述导电和/或半导体部分的选定的限定区域上的单步骤，所述区域被置于高于或等于相对于参考电极确定的阈值电位的电位，所述阈值电势是其上表示有机分子发生。

2. 发明申请

US20100279900A1 SOLID SUPPORT COMPRISING A FUNCTIONALIZED ELECTRICITY CONDUCTOR OR SEMICONDUCTOR SURFACE, METHOD FOR PREPARING SAME AND USES THEREOF 审中-公开
标题翻译：包括功能电导体或半导体表面的固体支持，其制备方法及其用途
公开(公告)号：US20100279900A1
公开(公告)日：2010-11-04
申请号：US12571739
申请日：2009-10-01
申请人： Christophe Bureau , Brigitte Mouanda , Sami Ameur , Julienne Charlier , Serge Palacin
发明人： Christophe Bureau , Brigitte Mouanda , Sami Ameur , Julienne Charlier , Serge Palacin
IPC分类号： C40B50/18
CPC分类号： C09D5/4476
摘要： The present invention provides a method for encapsulating biocompatible polymers. The method comprises using a solid support comprising at least one electrically conducting and/or semiconducting region containing a reducible oxide on its surface, wherein at least one zone of this surface is functionalized with an electrografted organic film obtained from electroactive organic precursors each comprising at least one functional group of interest, and wherein the number of functional groups of interest accessible for the formation of a covalent, ionic or hydrogen bond with a complementary group within said film represents at least 90% of the total number of functional organic groups of interest, and wherein the density of the accessible functional groups of interest is between 104/μm2 and 1010/μm2. The method further comprises attaching molecules of interest or objects bearing a complementary function to the solid support.
摘要翻译：本发明提供一种包封生物相容性聚合物的方法。该方法包括使用包含在其表面上含有可还原氧化物的至少一个导电和/或半导电区域的固体支持物，其中该表面的至少一个区域被电活性有机前体获得的电移植有机膜功能化，每个电活性有机前体至少包含一个感兴趣的官能团，并且其中可用于在所述膜内与互补基团形成共价键，离子键或氢键的可用官能团的数目代表感兴趣的官能有机基团总数的至少90％并且其中感兴趣的可及官能团的密度在104 /μm2和1010 /μm2之间。该方法还包括将感兴趣的分子或具有互补功能的物质附着到固体支持物上。

3. 发明申请

US20050272143A1 Solid support comprising a functionalized electricity conductor or semiconductor surface, method for preparing same and uses thereof 审中-公开
标题翻译：固体支持体，其包含功能化电导体或半导体表面，其制备方法及其应用
公开(公告)号：US20050272143A1
公开(公告)日：2005-12-08
申请号：US10518923
申请日：2003-06-16
申请人： Christophe Bureau , Brigitte Mouanda , Sami Ameur , Julienne Charlier , Serge Palacin
发明人： Christophe Bureau , Brigitte Mouanda , Sami Ameur , Julienne Charlier , Serge Palacin
IPC分类号： C08F2/00 , C08F2/58 , C08F8/00 , C08G85/00 , C09D5/44 , C12M1/34
CPC分类号： C09D5/4476
摘要： The invention concerns a solid support comprising a functionalized electricity conductor or semiconductor surface coated with a functionalized electrografted organic layer wherein at least 90% of the number of functional groups of interest is accessible. The invention also concerns the method for preparing such a support and uses thereof, in particular as adhesive primer for fixing molecules of interest or objects bearing a complementary function (molecular adhesive).
摘要翻译：本发明涉及一种固体支持物，其包含官能化的电导体或涂覆有官能化的电接枝有机层的半导体表面，其中感兴趣的官能团数量的至少90％是可接近的。本发明还涉及制备这种载体及其用途的方法，特别是作为用于固定感兴趣的分子或具有互补功能的物质（分子粘合剂）的粘合剂底漆。

4. 发明授权

US07605050B2 Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same 有权
标题翻译：将聚合物表面粘结到导电或半导体表面上的方法及其应用
公开(公告)号：US07605050B2
公开(公告)日：2009-10-20
申请号：US10525592
申请日：2003-08-25
申请人： Christophe Bureau , Julienne Charlier
发明人： Christophe Bureau , Julienne Charlier
IPC分类号： H01L21/30
CPC分类号： C09D5/4476 , C08J5/121 , C08J5/122
摘要： The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: a) the electrografting of an organic film onto the conductive or semiconductive surface; and then b) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted. It also relates to applications of this method and to structures obtained by its implementation.
摘要翻译：本发明涉及一种将聚合物表面粘合到导电或半导体表面上的方法，该方法的特征在于其包括：a）将有机膜电解到导电或半导体表面上; 然后b）将聚合物表面粘合到由此接枝的导电或半导体表面上的操作。它还涉及该方法的应用和通过其实现获得的结构。

5. 发明申请

US20050255631A1 Method of soldering a polymer surface to a conducting or semiconducting surface and applications of same 有权
标题翻译：将聚合物表面焊接到导电或半导体表面的方法及其应用
公开(公告)号：US20050255631A1
公开(公告)日：2005-11-17
申请号：US10525592
申请日：2003-08-25
申请人： Christophe Bureau , Julienne Charlier
发明人： Christophe Bureau , Julienne Charlier
IPC分类号： C08J5/12 , C09D5/44 , C09J5/02 , C09J157/00 , C09J201/00 , H01L21/30 , H01L21/44
CPC分类号： C09D5/4476 , C08J5/121 , C08J5/122
摘要： The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: a) the electrografting of an organic film onto the conductive or semiconductive surface; and then b) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted. It also relates to applications of this method and to structures obtained by its implementation.
摘要翻译：本发明涉及一种将聚合物表面粘合到导电或半导体表面上的方法，该方法的特征在于其包括：a）将有机膜电解到导电或半导体表面上; 然后b）将聚合物表面粘合到由此接枝的导电或半导体表面上的操作。它还涉及该方法的应用和通过其实现获得的结构。

6. 发明授权

US08298946B2 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits 失效
标题翻译：使用所述方法和集成电路选择性地涂覆微电子互连的复合表面生产的方法
公开(公告)号：US08298946B2
公开(公告)日：2012-10-30
申请号：US10599214
申请日：2005-03-22
申请人： Christophe Bureau , Sami Ameur
发明人： Christophe Bureau , Sami Ameur
IPC分类号： H01L21/44
CPC分类号： C23C18/1844 , C23C18/1608 , C23C18/1834 , C23C18/1882 , C23C18/1893 , C23C18/30 , C23C18/31 , C23C18/32 , H01L21/76849 , H01L21/76874 , Y10T29/49155
摘要： The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also to processes and methods for fabricating microsystems and connectors.
摘要翻译：本发明涉及用导电膜选择性地涂覆复合表面的某些区域的方法，以及用于制造微电子学中的互连的工艺，以及用于制造集成电路的工艺和方法，更具体地涉及形成金属网络互连，以及制造微系统和连接器的过程和方法。

7. 发明授权

US08263488B2 Surface-coating method 有权
标题翻译：表面涂布法
公开(公告)号：US08263488B2
公开(公告)日：2012-09-11
申请号：US10545400
申请日：2004-02-13
申请人： Pascal Viel , Sami Ameur , Christophe Bureau
发明人： Pascal Viel , Sami Ameur , Christophe Bureau
IPC分类号： H01L21/00 , H01L21/283 , H01L21/4763 , B32B15/00 , C25D11/00
CPC分类号： C25D15/00 , C09D5/4407 , C23C26/00 , C25D3/38 , C25D5/34 , C25D5/54 , Y10T428/12493
摘要： The invention relates to the deposition or attachment of materials to surfaces. It relates to a process for coating a surface with a first material and a second material, comprising the following steps: placing the first material on the said surface, inserting into the first material placed on the said surface precursor molecules of the second material, converting the said precursor molecules of the second material inserted into the first material into the said second material such that this second material becomes formed on the said surface to be coated and within the said first material placed on the said surface. The object of the process of the invention is to allow the deposition of materials of any type onto surfaces of any type.
摘要翻译：本发明涉及材料沉积或附着到表面上。它涉及一种用第一材料和第二材料涂覆表面的方法，包括以下步骤：将第一材料放置在所述表面上，将第一材料插入放置在所述表面上的第一材料中，将第二材料的前体分子转化将所述第二材料的所述前体分子插入到所述第二材料中，使得所述第二材料变得形成在所述待涂覆的所述表面上并且位于所述表面上的所述第一材料内。本发明方法的目的是允许将任何类型的材料沉积在任何类型的表面上。

8. 发明申请

US20090095507A1 METHOD OF SELECTIVE COATING OF A COMPOSITE SURFACE PRODUCTION OF MICROELECTRONIC INTERCONNECTIONS USING SAID METHOD AND INTEGRATED CIRCUITS 失效
标题翻译：使用方法和集成电路选择性地涂覆微电子互连复合表面的方法
公开(公告)号：US20090095507A1
公开(公告)日：2009-04-16
申请号：US10599214
申请日：2005-03-22
申请人： Christophe Bureau , Sami Ameur
发明人： Christophe Bureau , Sami Ameur
IPC分类号： H05K3/10 , H05K1/00 , B05D5/12 , H01L21/44
CPC分类号： C23C18/1844 , C23C18/1608 , C23C18/1834 , C23C18/1882 , C23C18/1893 , C23C18/30 , C23C18/31 , C23C18/32 , H01L21/76849 , H01L21/76874 , Y10T29/49155
摘要： The present invention relates to a process for selectively coating certain areas of a composite surface with a conductive film, to a process for fabricating interconnects in microelectronics, and to processes and methods for fabricating integrated circuits, and more particularly to the formation of networks of metal interconnects, and also to processes and methods for fabricating microsystems and connectors.
摘要翻译：本发明涉及用导电膜选择性地涂覆复合表面的某些区域的方法，以及用于制造微电子学中的互连的工艺，以及用于制造集成电路的工艺和方法，更具体地涉及形成金属网络互连，以及制造微系统和连接器的过程和方法。

9. 发明申请

US20060141156A1 Surface-coating method 有权
标题翻译：表面涂布法
公开(公告)号：US20060141156A1
公开(公告)日：2006-06-29
申请号：US10545400
申请日：2004-02-13
申请人： Pascal Viel , Sami Ameur , Christophe Bureau
发明人： Pascal Viel , Sami Ameur , Christophe Bureau
IPC分类号： B05D5/00
CPC分类号： C25D15/00 , C09D5/4407 , C23C26/00 , C25D3/38 , C25D5/34 , C25D5/54 , Y10T428/12493
摘要： The invention relates to the deposition or attachment of materials to surfaces. It relates to a process for coating a surface with a first material and a second material, comprising the following steps: placing the first material on the said surface, inserting into the first material placed on the said surface precursor molecules of the second material, converting the said precursor molecules of the second material inserted into the first material into the said second material such that this second material becomes formed on the said surface to be coated and within the said first material placed on the said surface. The object of the process of the invention is to allow the deposition of materials of any type onto surfaces of any type.
摘要翻译：本发明涉及材料沉积或附着到表面上。它涉及一种用第一材料和第二材料涂覆表面的方法，包括以下步骤：将第一材料放置在所述表面上，将第一材料插入放置在所述表面上的第一材料中，将第二材料的前体分子转化将所述第二材料的所述前体分子插入到所述第二材料中，使得所述第二材料变得形成在所述待涂覆的所述表面上并且位于所述表面上的所述第一材料内。本发明方法的目的是允许将任何类型的材料沉积在任何类型的表面上。

10. 发明授权

US07119030B2 Process for lining a surface using an organic film 有权
标题翻译：使用有机膜衬里表面的方法
公开(公告)号：US07119030B2
公开(公告)日：2006-10-10
申请号：US10523641
申请日：2003-08-25
申请人： Christophe Bureau , Guy Deniau , Serge Palacin
发明人： Christophe Bureau , Guy Deniau , Serge Palacin
IPC分类号： H01L21/469 , H01L21/31
CPC分类号： C09D5/4476 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165
摘要： The present invention relates to a method for cladding a simple or complex surface, electrically conducting or semiconducting, by means of an organic film from at least one precursor of said organic film, characterized in that the cladding of the surface by the organic film is carried out by electro-initiated grafting of said, at least one, precursor of said surface by applying at least one potential sweep on this surface carried out in such a way that at any point of said surface the maximum potential of each potential sweep, in absolute value and relative to a reference electrode, is greater than or equal to the value of the potential (vbloc) from which the curves of a graph expressing the quantity of electro-grafted precursor on a surface identical to said surface in function of the number of potential sweeps are all superposed and independent of this vbloc potential.
摘要翻译：本发明涉及一种通过有机膜从有机膜的至少一种前体包覆简单或复杂的表面，导电或半导体的方法，其特征在于，通过有机膜包覆表面通过在该表面上施加至少一个电位扫描，使得在所述表面的任何点处具有绝对的每个电位扫描的最大电位，使所述表面的至少一个前体电接触，值和相对于参比电极的电流值大于或等于表示电接枝前体的量在与表面相同的表面上的电位（v _{所述表面的电势扫描次数的函数全部叠加并且独立于该电势。}

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