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1. 发明授权

US09228133B2 Method for refining oil 有权
标题翻译：炼油方法
公开(公告)号：US09228133B2
公开(公告)日：2016-01-05
申请号：US13458144
申请日：2012-04-27
申请人： Chiung-Fang Liu , Ching-I Juch , Chih-Hao Chen , Chih-Ching Chen , Ju-Shiou Chen , Ying-Hsi Chang , Hou-Peng Wan , Hom-Ti Lee
发明人： Chiung-Fang Liu , Ching-I Juch , Chih-Hao Chen , Chih-Ching Chen , Ju-Shiou Chen , Ying-Hsi Chang , Hou-Peng Wan , Hom-Ti Lee
IPC分类号： C07C1/00 , C10G3/00
CPC分类号： C10G3/45 , C10G3/50 , C10G2300/1007 , C10G2300/1011 , C10G2300/1062 , C10G2300/4018 , Y02E50/13 , Y02P30/20
摘要： A method for refining oil includes contacting an oil with hydrogen to perform a hydrodeoxygenation reaction using iron oxide as a catalyst. The iron oxide comprises ferrous oxide (FeO), ferrum dioxide (FeO2), ferric oxide (Fe2O3), ferroferric oxide (Fe3O4), or combinations thereof.
摘要翻译：精炼油的方法包括使油与氢接触以使用氧化铁作为催化剂进行加氢脱氧反应。氧化铁包括氧化亚铁（FeO），二氧化碳（FeO 2），氧化铁（Fe 2 O 3），氧化铁（Fe 3 O 4）或其组合。

2. 发明申请

US20120215044A1 METHOD FOR REFINING OIL 有权
标题翻译：精炼油的方法
公开(公告)号：US20120215044A1
公开(公告)日：2012-08-23
申请号：US13458144
申请日：2012-04-27
申请人： Chiung-Fang Liu , Ching-I Juch , Chih-Hao Chen , Chih-Ching Chen , Ju-Chiou Chen , Ying-Hsi Chang , Hou-Peng Wan , Hom-Ti Lee
发明人： Chiung-Fang Liu , Ching-I Juch , Chih-Hao Chen , Chih-Ching Chen , Ju-Chiou Chen , Ying-Hsi Chang , Hou-Peng Wan , Hom-Ti Lee
IPC分类号： C10G1/00
CPC分类号： C10G3/45 , C10G3/50 , C10G2300/1007 , C10G2300/1011 , C10G2300/1062 , C10G2300/4018 , Y02E50/13 , Y02P30/20
摘要： In one embodiment of the disclosure, a method for refining oil is provided. The method includes contacting an oil with hydrogen to perform a hydrodeoxygenation reaction using iron oxide as a catalyst, wherein the iron oxide comprises ferrous oxide (FeO), ferrum dioxide (FeO2), ferric oxide (Fe2O3), ferroferric oxide (Fe3O4), or combinations thereof.
摘要翻译：在本公开的一个实施方案中，提供了一种精炼油的方法。该方法包括使油与氢气接触以使用氧化铁作为催化剂进行加氢脱氧反应，其中氧化铁包括氧化亚铁（FeO），二氧化碳（FeO 2），氧化铁（Fe 2 O 3），氧化铁（Fe 3 O 4）或其组合。

3. 发明授权

US08956954B2 Method of processing wafers for saving material and protecting environment 有权
标题翻译：处理晶圆以节省材料和保护环境的方法
公开(公告)号：US08956954B2
公开(公告)日：2015-02-17
申请号：US13400587
申请日：2012-02-21
申请人： Chih-Hao Chen
发明人： Chih-Hao Chen
IPC分类号： H01L21/78
CPC分类号： H01L21/67271 , H01L21/67092 , H01L21/67288 , H01L22/20
摘要： A method of processing wafers for saving material and protecting environment is implemented to collect defective or incomplete wafers and perform cutting operation to create a plurality of separate dies. According to the requirement of a specification, the backs of the dies are grinded to allow each die to have a predetermined thickness. Thereafter, the grinded dies with completeness are sequentially placed onto a carrying means. With the method, the defective or incomplete wafers, which would be discarded in general wafer manufacturing, may be reclaimed to go through cutting, grinding, and selecting operations, so that the dies with completeness on the defective wafers can be picked out and processed again, so as to increase the yield, lower the manufacturing cost, reduce the amount of the wafer waste, increase the wafer utilization, and meet the demands of energy saving, carbon reduction, and environmental protection.
摘要翻译：实施用于处理用于节省材料和保护环境的晶片的方法以收集有缺陷或不完整的晶片并执行切割操作以创建多个单独的模具。根据说明书的要求，研磨模具的背面以允许每个模具具有预定的厚度。此后，将具有完整性的研磨的模具依次放置在承载装置上。通过该方法，可以回收在通常的晶片制造中丢弃的有缺陷或不完整的晶片，以进行切割，研磨和选择操作，使得可以挑选并处理有缺陷晶片的完整性的模具，从而提高产量，降低制造成本，减少晶圆浪费，提高晶圆利用率，满足节能减排和环保要求。

4. 发明授权

US08724852B2 Method for sensing motion and device for implementing the same 有权
标题翻译：用于感测运动的方法和用于实现其的装置
公开(公告)号：US08724852B2
公开(公告)日：2014-05-13
申请号：US13470466
申请日：2012-05-14
申请人： Meng-Kun Chen , Chih-Hao Chen
发明人： Meng-Kun Chen , Chih-Hao Chen
IPC分类号： G06K9/00
CPC分类号： G06F3/005 , G06T7/136 , G06T7/246 , G06T2207/10152
摘要： A method for sensing a motion of an object is to be implemented by a motion recognition device that includes an image acquiring unit and a processor. In the method, the image acquiring unit is configured to acquire a series of image frames by detecting intensity of light received thereby. The processor is configured to receive at least one of the image frames and to determine whether an object is detected in the at least one of the image frames. When an object is detected, the processor is further configured to receive the image frames from the image acquiring unit, and to determine a motion of the object with respect to a three-dimensional coordinate system according to the image frames thus received.
摘要翻译：用于感测物体的运动的方法将由包括图像获取单元和处理器的运动识别装置来实现。在该方法中，图像获取单元被配置为通过检测由此接收的光的强度来获取一系列图像帧。处理器被配置为接收至少一个图像帧并且确定在所述至少一个图像帧中是否检测到对象。当检测到对象时，处理器还被配置为从图像获取单元接收图像帧，并且根据如此接收的图像帧来确定对象相对于三维坐标系的运动。

5. 发明授权

US08576550B2 Keyboard fixing structure for fixing a keyboard and portable electronic device therewith 有权
标题翻译：用于固定键盘和便携式电子设备的键盘固定结构
公开(公告)号：US08576550B2
公开(公告)日：2013-11-05
申请号：US13343722
申请日：2012-01-05
申请人： Yu-Hsien Huang , Chi-Chun Chiang , Chih-Hao Chen , Chia-Hsiung Hsueh
发明人： Yu-Hsien Huang , Chi-Chun Chiang , Chih-Hao Chen , Chia-Hsiung Hsueh
IPC分类号： G06F1/16
CPC分类号： G06F1/1662
摘要： A keyboard fixing structure for fixing a keyboard in an opening of a housing is disclosed. The keyboard fixing structure includes an engaging portion, a first fixing portion, a first flexible connecting portion, a second fixing portion and a second flexible connecting portion. The engaging portion presses a first side of the keyboard in the opening. The first fixing portion is fixed on the housing, and the first flexible connecting portion is connected to the first fixing portion and the engaging portion. The second fixing portion is fixed on the housing, and the second flexible connecting portion is connected to the second fixing portion and the engaging portion. The first flexible connecting portion and the second flexible connecting portion cooperatively provide resilient force to the engaging portion in a first direction for driving the engaging portion to press the first side of the keyboard.
摘要翻译：公开了一种用于将键盘固定在壳体的开口中的键盘固定结构。键盘固定结构包括接合部分，第一固定部分，第一柔性连接部分，第二固定部分和第二柔性连接部分。接合部在开口部中按压键盘的第一侧。第一固定部分固定在壳体上，第一柔性连接部分连接到第一固定部分和接合部分。第二固定部分固定在壳体上，第二柔性连接部分连接到第二固定部分和接合部分。第一柔性连接部分和第二柔性连接部分在第一方向上协同地向接合部分提供弹性力，用于驱动接合部分按压键盘的第一侧。

6. 发明申请

US20070060657A1 Method of preparing a copolymer and using such as a dispersing agent for titanate-based ceramic colloids 有权
标题翻译：共聚物的制备方法，使用分散剂等钛酸系陶瓷胶体
公开(公告)号：US20070060657A1
公开(公告)日：2007-03-15
申请号：US11397579
申请日：2006-04-05
申请人： Kung-Chung Hsu , Chih-Hao Chen , Yu-Ping Tsai , Wen-Cheng Wei
发明人： Kung-Chung Hsu , Chih-Hao Chen , Yu-Ping Tsai , Wen-Cheng Wei
IPC分类号： B01F3/12 , B01F17/00 , B22F1/00
CPC分类号： B01F17/0057 , B01J13/0056 , C04B35/4682 , C04B35/63424 , C04B35/6344 , C04B35/63444 , C04B35/63488 , C04B2235/3236 , C04B2235/5445 , C04B2235/608
摘要： This invention relates to the preparation of a copolymer which is used as a dispersing agent for titanate-based ceramic colloids. This copolymer has the following structure: Wherein R1 is H, NH4, alkali metals; R2 is H, NH4, alkali metals; R3 is H, NH4, alkali metals; a is an integer from 1 to 2000; b is an integer from 1 to 5000; and c is an integer from 1 to 1000; n is an integer from 1 to 500.
摘要翻译：本发明涉及一种用作钛酸盐系陶瓷胶体分散剂的共聚物的制备方法。该共聚物具有以下结构：其中R 1是H，NH 4，碱金属; R 2是H，NH 4，碱金属; R 3是H，NH 4，碱金属; a是从1到2000的整数; b为1〜5000的整数; 且c为1至1000的整数; n为1〜500的整数。

7. 发明申请

US20060077975A1 Checking method for applying in the field of network packet contents of network security switch 审中-公开
标题翻译：网络安全交换机网络报文内容应用检查方法
公开(公告)号：US20060077975A1
公开(公告)日：2006-04-13
申请号：US11006583
申请日：2004-12-08
申请人： Nen-Fu Huang , Chih-Hao Chen
发明人： Nen-Fu Huang , Chih-Hao Chen
IPC分类号： H04L12/56 , H04L12/28
CPC分类号： H04L63/0236 , H04L12/4645 , H04L49/602 , H04L63/0281
摘要： A checking method for applying in the field of network packet contents of network security switch, specially, it focus on a specific designed IDP (intrusion detection/prevention) can cooperate with any L2 switch that matched some popular specifications and provide security service on the network traffic through the L2 switch. The applicant abstract the security concept from the security switch. Thus, under this architecture, we developing and improving the network security domain can focus on the security technology without take care what the L2 switch have already been well done. and the additional benefit of the proposed architecture is the cost will relatively lower than the current, and the enterprises using this solution do not need to replace the L2 switch with security switch, we can only plug the spcific designed IDP to the L2 switch we have already had, and play what we original want with security service.
摘要翻译：一种在网络安全交换机的网络分组内容领域应用的检查方法，特别是专注于特定设计的IDP（入侵检测/防御），可以与任何符合一些流行规范的L2交换机配合，并在网络上提供安全服务通过L2交换机的流量。申请人从安全交换机抽象出安全概念。因此，在这种体系结构下，我们开发和改进网络安全领域可以专注于安全技术，而不用担心L2交换机已经做得很好。并且所提出的架构的额外好处是成本将相对较低，而使用该解决方案的企业不需要用安全交换机替换L2交换机，我们只能将特殊设计的IDP插入到我们拥有的L2交换机已经有了，并且发挥我们原来想要的安全服务。

8. 发明授权

US09662812B2 Methods for molding integrated circuits 有权
公开(公告)号：US09662812B2
公开(公告)日：2017-05-30
申请号：US13485307
申请日：2012-05-31
申请人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： B29C43/18 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： B29C43/18 , H01L21/565 , H01L23/3121 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2924/1531 , H01L2924/157 , H01L2924/00012 , H01L2224/81
摘要： A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.

9. 发明授权

US09489905B2 Display device driving method 有权
标题翻译：显示设备驱动方式
公开(公告)号：US09489905B2
公开(公告)日：2016-11-08
申请号：US13366528
申请日：2012-02-06
申请人： Kuo-Yang Tseng , Chih-Hao Chen , Cheng-Lung Chiang
发明人： Kuo-Yang Tseng , Chih-Hao Chen , Cheng-Lung Chiang
IPC分类号： G09G3/36 , G02F1/1362
CPC分类号： G09G3/3648 , G02F1/136286 , G09G2320/0223
摘要： A display device driving method is provided. The display device driving method comprises the steps outlined below. A display device is provided, in which each of the first gate lines of a driving circuit of the display device has a first RC value and each of the second gate lines of the drive circuit has a second RC value smaller than the first RC value. A first gate driving signal having a first pulse width is generated to each of the first gate lines to drive corresponding first pixel rows. A second gate driving signal having a second pulse width is generated to each of the second gate lines to drive corresponding second pixel rows, wherein the second pulse width is smaller than the first pulse width.
摘要翻译：提供一种显示装置驱动方法。显示装置驱动方法包括以下所述的步骤。提供了一种显示装置，其中显示装置的驱动电路的每个第一栅极线具有第一RC值，并且驱动电路的每个第二栅极线具有小于第一RC值的第二RC值。产生具有第一脉冲宽度的第一栅极驱动信号到每个第一栅极线以驱动对应的第一像素行。产生具有第二脉冲宽度的第二栅极驱动信号到每个第二栅极线以驱动对应的第二像素行，其中第二脉冲宽度小于第一脉冲宽度。

10. 发明授权

US08772929B2 Package for three dimensional integrated circuit 有权
标题翻译：三维集成电路封装
公开(公告)号：US08772929B2
公开(公告)日：2014-07-08
申请号：US13297992
申请日：2011-11-16
申请人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
摘要： A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.
摘要翻译：晶片级封装包括结合在支撑晶片上的半导体管芯。半导体管芯在其衬底上至少有一个台阶凹槽。在半导体管芯和支撑晶片之间形成底部填充层。此外，底部填充层的高度受到台阶凹槽的限制。在晶片级封装的制造过程中，台阶凹槽有助于减小晶片级封装上的应力。

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