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    • 1. 发明申请
    • SELF REFERENCING SENSE AMPLIFIER FOR SPIN TORQUE MRAM
    • 自适应感应放大器用于旋转扭矩MRAM
    • US20130301346A1
    • 2013-11-14
    • US13872993
    • 2013-04-29
    • Chitra K. SubramanianSyed M. Alam
    • Chitra K. SubramanianSyed M. Alam
    • G11C11/16
    • G11C11/1673
    • Circuitry and a method provide self-referenced sensing of a resistive memory cell by using its characteristic of resistance variation with applied voltage in one state versus a relatively constant resistance regardless of the applied voltage in its opposite state. Based on an initial bias state with equalized resistances, a current comparison at a second bias state between a mock bit line and a bit line is used to determine the state of the memory cell, since a significant difference in current implies that the memory cell state has a significant voltage coefficient of resistance. An offset current applied to the mock bit line optionally may be used to provide symmetry and greater sensing margin.
    • 电路和方法通过使用其在一个状态下的施加电压与相对恒定电阻的电阻变化的特性来提供电阻式存储器单元的自参考感测,而不管其相反状态下的施加电压如何。 基于具有均衡电阻的初始偏置状态,使用模拟位线和位线之间的第二偏置状态下的电流比较来确定存储器单元的状态,因为电流的显着差异意味着存储单元状态 具有显着的电阻系数。 施加到模拟位线的偏移电流可选地可以用于提供对称性和更大的感测余量。
    • 4. 发明申请
    • PROGRAMMABLE ROM USING TWO BONDED STRATA AND METHOD OF OPERATION
    • 可编程ROM使用两个绑定的条纹和操作方法
    • US20090086524A1
    • 2009-04-02
    • US11865991
    • 2007-10-02
    • Syed M. AlamRobert E. Jones
    • Syed M. AlamRobert E. Jones
    • G11C17/00H01S4/00
    • G11C17/14H01L25/18H01L27/112H01L27/11226H01L2225/06513H01L2225/06527H01L2924/0002Y10T29/49002H01L2924/00
    • A read only memory implemented as a 3D integrated device has a first stratum, a second stratum, and bonded inter-strata connections for coupling the first stratum to the second stratum. The physical bonding between the two strata implements the programming of the read only memory. The stratum may be in wafer form or in die form. The first stratum includes functional active devices and at least one non-programmed active device. The second stratum includes at least conductive routing to be associated with the at least one non-programmed active device. The bonded inter-strata connections include at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for providing conductive routing to the programmed active device. The two strata thus form a programmed ROM. Other types of programmable storage devices may be implemented by bonding the two strata.
    • 实现为3D集成设备的只读存储器具有用于将第一层耦合到第二层的第一层,第二层和粘结层间连接。 两层之间的物理绑定实现了只读存储器的编程。 层可以是晶片形式或模具形式。 第一层包括功能性有源器件和至少一个非编程有源器件。 第二层包括至少与至少一个非编程的有源设备相关联的导电路由。 所述接合的层间连接包括用于对所述至少一个非编程的有源器件进行编程以及为所述编程的有源器件提供导电路由的至少一个结合的可编程层间连接。 因此,这两个层由此形成一个编程的ROM。 其他类型的可编程存储设备可以通过键合两个层来实现。
    • 10. 发明授权
    • Programmable ROM using two bonded strata
    • 可编程ROM使用两个粘结层
    • US07715227B2
    • 2010-05-11
    • US11865991
    • 2007-10-02
    • Syed M. AlamRobert E. Jones
    • Syed M. AlamRobert E. Jones
    • G11C11/50
    • G11C17/14H01L25/18H01L27/112H01L27/11226H01L2225/06513H01L2225/06527H01L2924/0002Y10T29/49002H01L2924/00
    • A read only memory implemented as a 3D integrated device has a first stratum, a second stratum, and bonded inter-strata connections for coupling the first stratum to the second stratum. The physical bonding between the two strata implements the programming of the read only memory. The stratum may be in wafer form or in die form. The first stratum includes functional active devices and at least one non-programmed active device. The second stratum includes at least conductive routing to be associated with the at least one non-programmed active device. The bonded inter-strata connections include at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for providing conductive routing to the programmed active device. The two strata thus form a programmed ROM. Other types of programmable storage devices may be implemented by bonding the two strata.
    • 实现为3D集成设备的只读存储器具有用于将第一层耦合到第二层的第一层,第二层和粘结层间连接。 两层之间的物理绑定实现了只读存储器的编程。 层可以是晶片形式或模具形式。 第一层包括功能性有源器件和至少一个非编程有源器件。 第二层包括至少与至少一个非编程的有源设备相关联的导电路由。 所述接合的层间连接包括用于对所述至少一个非编程的有源器件进行编程以及为所述编程的有源器件提供导电路由的至少一个结合的可编程层间连接。 因此,这两个层由此形成一个编程的ROM。 其他类型的可编程存储设备可以通过键合两个层来实现。