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1. 发明授权

US06884525B2 Red light emitting materials 有权
标题翻译：红色发光材料
公开(公告)号：US06884525B2
公开(公告)日：2005-04-26
申请号：US10191145
申请日：2002-07-09
申请人： Chin-Ti Chen , Hsiu-Chih Yeh , Wei-Ching Wu , Li-Hsin Chan
发明人： Chin-Ti Chen , Hsiu-Chih Yeh , Wei-Ching Wu , Li-Hsin Chan
IPC分类号： C09K11/06 , H01L51/00 , H01L51/30 , H01L51/50 , H05B33/14
CPC分类号： H01L51/006 , C09K11/06 , H01L51/0058 , H01L51/0072 , H01L51/5012 , H05B33/14 , Y10S428/917
摘要： This invention features a compound having the formula: X is O or NR1; and each of Y and Z, independently, is in which each of R1, R2, R3, and R4, independently, is alkyl, cyclyl, heterocyclyl, aralkyl, aryl, or heteroaryl; Ar1 is aralkyl, aryl, or heteroaryl; and Ar2 is cyclyl, heterocyclyl, aralkyl, aryl, or heteroaryl; or Ar1 and Ar2 taken together is heterocyclyl, aralkyl, or heteroaryl. This compound can be used as a red light emitting material in an electro-luminescence device.
摘要翻译：本发明的特征在于具有下式的化合物：X是O或NR 1 N; Y和Z各自独立地为R 1，R 2，R 3和R 4中的每一个独立地是烷基，环基，杂环基，芳烷基，芳基或杂芳基; Ar 1是芳烷基，芳基或杂芳基; 并且Ar 2是环，杂环基，芳烷基，芳基或杂芳基; 或Ar 1和Ar 2一起是杂环基，芳烷基或杂芳基。该化合物可以用作电致发光器件中的红色发光材料。

2. 发明授权

US07052783B2 Oxadiazole tetramers 失效
标题翻译：恶二唑四聚体
公开(公告)号：US07052783B2
公开(公告)日：2006-05-30
申请号：US09996202
申请日：2001-11-28
申请人： Chin-Ti Chen , Hsiu-Chih Yeh , Li-Hsin Chan , Rong-Ho Lee
发明人： Chin-Ti Chen , Hsiu-Chih Yeh , Li-Hsin Chan , Rong-Ho Lee
IPC分类号： H05B33/12 , C09K11/08
CPC分类号： C07D271/06 , C07D251/24 , H01L51/0059 , H01L51/007 , H01L51/0081 , H01L51/5012 , H01L2251/308 , Y10S428/917
摘要： This invention relates to tetraphenylmethane-based oxadiazole molecules that act as electron transporting materials to be used in electroluminescent devices. The oxadiazole compounds are of the following formula. Each variable is defined in the specification.
摘要翻译：本发明涉及作为用于电致发光器件的电子传输材料的四苯基甲烷基恶二唑分子。恶二唑化合物具有下式。每个变量在规范中定义。

3. 发明申请

US20060041120A1 TETRAAZAPORPHYRIN COMPOUNDS 失效
标题翻译：四氮唑啉化合物
公开(公告)号：US20060041120A1
公开(公告)日：2006-02-23
申请号：US10922138
申请日：2004-08-18
申请人： Chin-Ti Chen , Hsiu-Chih Yeh
发明人： Chin-Ti Chen , Hsiu-Chih Yeh
IPC分类号： C07D487/22
CPC分类号： C07D487/22
摘要： This invention relates to a method of preparing a compound of formula (I): The method includes reacting one or more compounds of formula (II): in the presence of a base and a halogenating agent. In formulas (I) and (II) above, each A, independently, is aryl or heteroaryl; each n, independently, is 0-3; and each R1, independently, is C1-C10 alkyl, C3-C20 cycloalkyl, C3-C20 heterocycloalkyl, aryl, heteroaryl, halo, cyano, nitro, ORa, NRaRb, SiRaRbRc, COORa, OC(O)Ra, C(O)NRaRb, N(Ra)—C(O)Rb, or SO3Ra; wherein each of Ra, Rb, and Rc, independently, is H, C1-C10 alkyl, C3-C20 cycloalkyl, C3-C20 heterocycloalkyl, aryl, or heteroaryl; thereby producing the compound of formula (I) in a one-pot reaction. This invention also relates to the compounds prepared by the method described above.
摘要翻译：本发明涉及一种制备式（I）化合物的方法：该方法包括使一种或多种式（II）化合物在碱和卤化剂存在下反应。在上述式（I）和（II）中，每个A独立地是芳基或杂芳基; 每个n独立地为0-3; 且每个R 1独立地是C 1 -C 10烷基，C 3 -C 3烷基， 20个环烷基，C 3 -C 20杂环烷基，芳基，杂芳基，卤素，氰基，硝基，OR a， a，b，b，b，b，b，b，b，b，b，c， OC（O）R a a，C（O）NR a R b，N（R a a） C（O）R b，或SO 3 R a a; 其中R a，R b和R c C各自独立地为H，C 1 -C C 1 -C 10烷基，C 3 -C 20环烷基，C 3 -C 20烷基，C 3 -C 20环烷基，C 3 -C 20烷基，杂环烷基，芳基或杂芳基; 从而在一锅反应中制备式（I）化合物。本发明还涉及通过上述方法制备的化合物。

4. 发明授权

US07005519B1 Tetraazaporphyrin compounds 失效
标题翻译：四氮杂卟啉化合物
公开(公告)号：US07005519B1
公开(公告)日：2006-02-28
申请号：US10922138
申请日：2004-08-18
申请人： Chin-Ti Chen , Hsiu-Chih Yeh
发明人： Chin-Ti Chen , Hsiu-Chih Yeh
IPC分类号： C07B47/00 , A61B5/055 , A61B10/00 , C07F5/10 , A61K31/555
CPC分类号： C07D487/22
摘要： This invention relates to a method of preparing a compound of formula (I): The method includes reacting one or more compounds of formula (II): in the presence of a base and a halogenating agent. In formulas (I) and (II) above, each A, independently, is aryl or heteroaryl; each n, independently, is 0–3; and each R1, independently, is C1–C10 alkyl, C3–C20 cycloalkyl, C3–C20 heterocycloalkyl, aryl, heteroaryl, halo, cyano, nitro, ORa, NRaRb, SiRaRbRc, COORa, OC(O)Ra, C(O)NRaRb, N(Ra)—C(O)Rb, or SO3Ra; wherein each of Ra, Rb, and Rc, independently, is H, C1–C10 alkyl, C3–C20 cycloalkyl, C3–C20 heterocycloalkyl, aryl, or heteroaryl; thereby producing the compound of formula (I) in a one-pot reaction. This invention also relates to the compounds prepared by the method described above.
摘要翻译：本发明涉及制备式（I）化合物的方法：化学式id =“CHEM-US-00001”num =“000

5. 发明授权

US07786568B2 Window BGA semiconductor package 有权
标题翻译：窗口BGA半导体封装
公开(公告)号：US07786568B2
公开(公告)日：2010-08-31
申请号：US12242315
申请日：2008-09-30
申请人： Chin-Ti Chen
发明人： Chin-Ti Chen
IPC分类号： H01L23/04 , H01L23/48
CPC分类号： H01L24/83 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L2224/06136 , H01L2224/27013 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/8385 , H01L2224/85 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A WBGA semiconductor package primarily comprises a substrate, a chip, a chip-bonding adhesive, a plurality of bonding wires electrically connecting the chip and the substrate, an encapsulant to encapsulate the chip and the bonding wires, and a plurality of external terminals disposed under the substrate. The substrate has a depression for accommodating the chip-bonding adhesive and a slot for passing through bonding wires. The chip is partially embedded in the depression to dispose on the substrate. During the chip bonding step, the chip-bonding adhesive is confined in the depression in a manner to fill the gaps between the sides of the first chip and the inwalls around the depression to generate a non-planar adhering interface by partially covering the sides of the first chip. Therefore, the total package thickness is reduced, the delamination of the passivation layer and the fractures at the sides of the chip are avoided.
摘要翻译： WBGA半导体封装主要包括衬底，芯片，芯片粘合粘合剂，电连接芯片和衬底的多个接合线，封装芯片和接合线的密封剂，以及设置在其下的多个外部端子底物。基板具有用于容纳芯片粘合粘合剂的凹陷部和用于通过接合线的槽。芯片部分地嵌入凹陷中以配置在基板上。在芯片接合步骤期间，芯片粘合粘合剂被限制在凹陷中，以填充第一芯片的侧面和凹陷周围的内壁之间的间隙，以通过部分覆盖第二芯片的侧面以产生非平面粘附界面第一个芯片。因此，总封装厚度减小，避免了钝化层的分层和芯片侧面的断裂。

6. 发明申请

US20080303130A1 Package on package structure 审中-公开
标题翻译：封装结构封装
公开(公告)号：US20080303130A1
公开(公告)日：2008-12-11
申请号：US12007064
申请日：2008-01-07
申请人： Chin-Ti Chen
发明人： Chin-Ti Chen
IPC分类号： H01L23/48 , H01L23/02
CPC分类号： H01L25/105 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2225/1029 , H01L2225/1041 , H01L2924/00014
摘要： A package on package structure includes a first chip package, a second chip package and a conductive film. The first chip package has a portion of first conductive lead which is exposed to the encapsulation body of the first chip package. The conductive film is arranged between the first chip package and the second chip package to adhere to them and electrically connect the first conductive lead and the second chip package. The above-mentioned package on package structure can improve short-circuit phenomenon between leads.
摘要翻译：封装结构的封装包括第一芯片封装，第二芯片封装和导电膜。第一芯片封装具有暴露于第一芯片封装的封装体的第一导电引线的一部分。导电膜布置在第一芯片封装和第二芯片封装之间以粘附到它们并电连接第一导电引线和第二芯片封装。上述包装封装结构可以改善导线之间的短路现象。

7. 发明申请

US20070173657A1 Tetraphenylsilane-carbazole compound, its preparation method and its use as host material for dopants of organic light emitting diode 审中-公开
标题翻译：四苯基硅烷 - 咔唑化合物，其制备方法及其作为有机发光二极管掺杂剂的主体材料
公开(公告)号：US20070173657A1
公开(公告)日：2007-07-26
申请号：US11339487
申请日：2006-01-26
申请人： Chin-Ti Chen , Min-Fei Wu , Shi-Jay Yeh
发明人： Chin-Ti Chen , Min-Fei Wu , Shi-Jay Yeh
IPC分类号： H01L51/54 , C07F7/10
CPC分类号： C07F7/0812 , H01L51/0072 , H01L51/0085 , H01L51/0094 , H01L51/5016
摘要： The tetraphenylsilane-carbazole compound of this invention has the following general formula: wherein R1 and R2 are H, halogen or carbazole having the formula of with at least one of R1 and R2 being carbazole; n=1, 2, 3 or 4; and wherein Si and N substituents are in meta positions on the benzene ring; or wherein R3, R4, R5 and R6 are H, halogen or tetraphenylsilane having the formula of with at least one of R3, R4, R5 and R6 being tetraphenylsilane; and wherein Si and N substituents are in meta positions on the benzene ring. The invented tetraphenylsilane-carbazole compounds are prepared by mixing selected tetraphenylsilane with carbazole in the existence of additives and reacting them under heated conditions, or by mixing selected carbazole with butyl metallic and reacting them under relatively lower temperature. The products may be used as host material for dopants for organic light emitting diode (OLED).
摘要翻译：本发明的四苯基硅烷 - 咔唑化合物具有以下通式：其中R 1和R 2是H，具有下式的卤素或咔唑，其中R 1和R 2中的至少一个是咔唑; n = 1,2,3或4; 并且其中Si和N取代基位于苯环上的间位; 或其中R 3，R 4，R 5和R 6为H，具有下式的卤素或四苯基硅烷：其中R 3，R 4，R 5和R 6中的至少一个为四苯基硅烷; 并且其中Si和N取代基位于苯环上的间位。本发明的四苯基硅烷 - 咔唑化合物是通过在添加剂存在下将选择的四苯基硅烷与咔唑混合制备的，或者在加热条件下进行反应，或者通过将选择的咔唑与丁基金属化合并在相对较低的温度下进行反应来制备。该产品可用作有机发光二极管（OLED）掺杂剂的主体材料。

8. 发明授权

US07884472B2 Semiconductor package having substrate ID code and its fabricating method 有权
标题翻译：具有衬底ID码的半导体封装及其制造方法
公开(公告)号：US07884472B2
公开(公告)日：2011-02-08
申请号：US12052357
申请日：2008-03-20
申请人： Chin-Ti Chen , Ching-Wei Hung , Bing-Shun Yu , Chin-Fa Wang
发明人： Chin-Ti Chen , Ching-Wei Hung , Bing-Shun Yu , Chin-Fa Wang
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , B23K1/0016 , B23K35/025 , B41M5/26 , H01L21/67294 , H01L23/13 , H01L23/49816 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2223/54413 , H01L2223/54433 , H01L2223/5448 , H01L2223/54486 , H01L2224/16 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/83101 , H01L2224/83856 , H01L2224/85 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18301 , H01L2924/0665 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package with a substrate ID code and its manufacturing method are revealed. A circuit and a solder mask are formed on the bottom surface of a substrate where the solder mask covers most of the circuit and a circuit-free zone of the substrate. A chip is disposed on the top surface of the substrate. A substrate ID code consisting of a plurality of laser marks is inscribed in the solder mask or in a portion of an encapsulant on the bottom surface away from the circuit to show the substrate lot number on the bottom surface. Therefore, quality control and failure tracking and management can easily be implemented by tracking the substrate ID code from the semiconductor package without changing the appearance of the semiconductor package. Furthermore, the substrate ID code can be implemented by the existing laser imprinting machines for semiconductor packaging processes and be formed at the same time of formation of a product code. The complexity of the semiconductor packaging processes is not increased and the circuits of the substrates are not easily damaged.
摘要翻译：揭示了具有基板ID码的半导体封装及其制造方法。在基板的底表面上形成电路和焊料掩模，其中焊料掩模覆盖电路的大部分和基板的无电路区域。芯片设置在基板的顶表面上。由多个激光标记组成的衬底ID码被内接在焊接掩模中或封装在位于电路底部的密封剂的一部分中，以在底表面上显示衬底批号。因此，可以通过在不改变半导体封装的外观的情况下跟踪来自半导体封装的衬底ID代码来容易地实现质量控制和故障跟踪和管理。此外，基板ID代码可以通过现有的用于半导体封装工艺的激光打印机来实现，并且在形成产品代码的同时形成。半导体封装工艺的复杂性不会增加，并且基板的电路不容易损坏。

9. 发明申请

US20090243055A1 Leadframe, semiconductor packaging structure and manufacturing method thereof 审中-公开
标题翻译：引线框架，半导体封装结构及其制造方法
公开(公告)号：US20090243055A1
公开(公告)日：2009-10-01
申请号：US12081620
申请日：2008-04-18
申请人： Chin-Ti Chen
发明人： Chin-Ti Chen
IPC分类号： H01L23/495 , H05K7/18 , H01L21/60 , H01R43/00
CPC分类号： H01L23/49575 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48249 , H01L2224/48257 , H01L2224/49109 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor packaging structure includes a plurality of first inner leads, a plurality of second inner leads, a plurality of first outer leads, a plurality of stacked chips, an encapsulating body, and a plurality of wires. Wherein, a first protrusion portion is protruded from each of the first inner leads and is formed a plurality of contact faces with height differences, a second protrusion portion is protruded from each of the second inner leads. Therefore, the wires connected to the stacked chips, the first protrusion portion of the first inner leads, and the second protrusion portion of the second inner leads can be shorten. And, the wire sweep and short-circuit can be prevented during molding process. In addition, the present invention also discloses a leadframe and manufacturing method for the leadframe and its semiconductor packaging structure.
摘要翻译：半导体封装结构包括多个第一内部引线，多个第二内部引线，多个第一外部引线，多个堆叠的芯片，封装体以及多个引线。其中，第一突出部分从每个第一内引线突出并且形成多个高度差的接触面，第二突出部分从每个第二内引线突出。因此，可以缩短连接到堆叠的芯片的电线，第一内部引线的第一突出部分和第二内部引线的第二突出部分。并且，在成型过程中可以防止线扫和短路。另外，本发明还公开了引线框及其半导体封装结构的引线框及其制造方法。

10. 发明授权

US07564123B1 Semiconductor package with fastened leads 有权
标题翻译：带紧固导线的半导体封装
公开(公告)号：US07564123B1
公开(公告)日：2009-07-21
申请号：US12122937
申请日：2008-05-19
申请人： Chin-Fa Wang , Chin-Ti Chen , Bing-Shun Yu , Wan-Jung Hsieh
发明人： Chin-Fa Wang , Chin-Ti Chen , Bing-Shun Yu , Wan-Jung Hsieh
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4334 , H01L23/4951 , H01L23/544 , H01L24/48 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/73215 , H01L2924/00014 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package primarily comprises a plurality of leadframe's leads, a chip, a paddle, an adhesive and an encapsulant encapsulating the components mentioned above. The paddle has a carrying surface and an exposed external surface. The first chip is attached to one surface of the leads. The paddle is attached to an opposing surface of the leads by the adhesive bonding the carrying surface to the leads. Furthermore, the adhesive further encapsulates the gaps between the leads without contaminating the exposed external surface and with the exposed external surface exposed from the encapsulant. Therefore, the leads obtain a better support so that the encapsulated portions of the leads will not shift nor expose from the encapsulant during molding processes without encapsulated bubbles between the leads and the paddle. The heat dissipation is also enhanced.
摘要翻译：半导体封装主要包括多个引线框的引线，芯片，桨，粘合剂和封装上述组件的密封剂。桨具有承载表面和暴露的外表面。第一个芯片连接到引线的一个表面。通过将承载表面粘合到引线上的粘合剂将桨连接到引线的相对表面。此外，粘合剂进一步封装引线之间的间隙，而不会污染暴露的外表面，暴露的外表面暴露于密封剂。因此，引线获得更好的支撑，使得引线的封装部分在模制过程中不会移动或暴露于密封剂，而不会在引线和引脚之间产生封装的气泡。散热也得到提高。

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