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    • 2. 发明授权
    • Polarization splitting backlight module
    • 极化分离背光模块
    • US06688751B2
    • 2004-02-10
    • US09908061
    • 2001-07-18
    • Chih-Kung LeeJiun-Yan WuShu-Sheng LeeChing-Heng Tang
    • Chih-Kung LeeJiun-Yan WuShu-Sheng LeeChing-Heng Tang
    • F21V914
    • G02B6/0038G02B5/305G02B6/0051G02B6/0056G02B27/283G02F1/133615G02F1/13362
    • A polarization splitting backlight module for efficiently converting a non-polarized light beam emitted from the light source into a single polarization state is disclosed. The polarization splitting backlight module of the present invention comprises an under plate with a ridged lower surface, a light source, a special reflection film, a scattering structure, a substrate and a polarization splitting film. The light beam emitted from the light source is introduced into the scattering structure between the under plate and the substrate. After a series of processes, such as scattering, reflection, phase retardation and polarization beam-splitting, the light beam will pass through the polarization splitting film being of a single polarization state such that it could be utilized by electro-optical systems, such as liquid crystal displays. The present invention converts light beams into a single polarization state, and the efficiency thus is higher than that of a conventional backlight module. The present invention achieves brightness levels that are almost twice that of conventional backlight module.
    • 公开了一种用于将从光源发射的非偏振光束有效地转换成单极化状态的偏振分束背光模块。 本发明的偏振分束背光模块包括具有带脊下表面的底板,光源,特殊反射膜,散射结构,基板和偏振分束膜。 从光源发射的光束被引入到底板和基板之间的散射结构中。 在诸如散射,反射,相位延迟和偏振光束分裂的一系列处理之后,光束将通过偏振分束膜为单一极化状态,使得其可以被电光系统使用,例如 液晶显示器。 本发明将光束转换成单极化状态,因此效率高于常规背光模块的效率。 本发明实现的亮度水平几乎是传统背光模块的两倍。
    • 3. 发明授权
    • Polarization splitting backlight module
    • 极化分离背光模块
    • US06631031B2
    • 2003-10-07
    • US09728714
    • 2000-11-30
    • Chih-Kung LeeChyan-Chyi WuChing-Heng Tang
    • Chih-Kung LeeChyan-Chyi WuChing-Heng Tang
    • G02B530
    • G02B6/0036F21V9/14G02B6/0038G02B6/0056G02B27/283G02B27/285G02F1/133615G02F1/13362
    • A polarization splitting backlight module for efficiently emitting polarized light beams is disclosed. The polarization splitting backlight module of the present invention comprises a light source, an under plate, a substrate, a phase retardation reflective film, a scattering structure, a thin film and an upper cover. The light beams emitted from the non-polarized light source are introduced into the substrate, and after scattering, reflection, phase retardation and polarization splitting, the light beams will pass through the upper cover being of a single polarization state so as to be utilized by electro-optical systems, such as liquid crystal displays. The present invention converts light beams into a single polarization state, and thereby the efficiency of polarization splitting, as well as the brightness, are higher than that of a conventional backlight module.
    • 公开了一种用于有效发射偏振光束的偏振分束背光模块。 本发明的偏振分束背光模块包括光源,底板,基板,相位延迟反射膜,散射结构,薄膜和上盖。 从非偏振光源发射的光束被引入到基板中,并且在散射,反射,相位延迟和偏振分裂之后,光束将通过上盖是单极化状态,以便由 电光系统,如液晶显示器。 本发明将光束转换成单极化状态,由此偏振分离的效率以及亮度高于常规背光模块的效率。
    • 4. 发明授权
    • Method for integrating image sensors with optical components
    • 图像传感器与光学元件集成的方法
    • US06679964B2
    • 2004-01-20
    • US09981774
    • 2001-10-16
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • Chih-Kung LeeLong-Sun HuangWen-Jong ChenChing-Heng TangChing-Hua Lee
    • H01L2146
    • H01L27/14685H01L27/14618H01L27/14621H01L27/14627H01L2224/48091Y10T156/1093H01L2924/00014
    • The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process. Alternatively, the composite substrate and the un-sliced wafer can be bonded together by cold compression or thermal compression. The resultant wafer is then sliced into separated image sensors for further packaging, such as CLCC, PLCC, QFP, QFN or QFJ. Alternatively, the resultant wafer can be packaged through a wafer-level chip scale packaging process.
    • 本发明是一种用于将包括图像传感器的未切片晶片和其上包括光学部件的晶片尺寸基板接合的晶片级积分方法。 在未切片的晶片和晶片尺寸的基板之间设置零级光反射基板。 图像传感器是CMOS或CCD图像传感器。 晶片尺寸的基板是透明板,并且其上的光学部件包括闪耀的光栅,二维微透镜阵列或其它光学功能元件。 晶片尺寸的基板通过合适的光学粘合剂粘合到第零级光反射基板上以形成复合基板。 在非切片晶片和复合基板的接合面上的对应位置分别设置有接合焊盘和凸块,使得复合基板和未切片的晶片可以通过回流工艺结合在一起。 或者,可以通过冷压缩或热压缩将复合衬底和未切片晶片结合在一起。 然后将得到的晶片切成分离的图像传感器以进一步包装,例如CLCC,PLCC,QFP,QFN或QFJ。 或者,所得到的晶片可以通过晶片级芯片级封装工艺进行封装。
    • 8. 发明授权
    • Multi-function opto-electronic detection apparatus
    • 多功能光电检测仪
    • US06844935B2
    • 2005-01-18
    • US10761116
    • 2004-01-20
    • Chih-Kung LeeShuen-Chen ShiueShu-Sheng LeeJiun-Yan WuChii-Wann LinShiming Lin
    • Chih-Kung LeeShuen-Chen ShiueShu-Sheng LeeJiun-Yan WuChii-Wann LinShiming Lin
    • G01B11/00G01B9/02
    • G01B11/00
    • A multi-function opto-electronic detection apparatus for detecting molecular characteristics of a test sample. The appratuses comprises functional mode subsystems including a detecting light source subsystem for generating sampling beams for illuminating the test sample; a manipulation optics subsystem for aligning the sampling beam onto the test sample; a target signal processing subsystem for analyzing target beams emerging from the test sample resulting from the illuminating of the sampling beam; and a sample fixation subsystem for holding the test sample. The detecting light source subsystem, manipulation optics subsystem and target signal processing subsystem are assembled into one of several possible optical sampling setups for the detection characteristics of the test sample. The functional mode setups include at least ellispometer, confocal image scanner, photon tunneling scanning microscope and interferometer.
    • 一种用于检测试样的分子特性的多功能光电检测装置。 该装置包括功能模式子系统,包括用于产生用于照亮测试样本的采样光束的检测光源子系统; 用于将采样光束对准到测试样品的操纵光学子系统; 目标信号处理子系统,用于分析从采样光束的照明产生的从测试样本出射的目标光束; 以及用于保持测试样本的样本固定子系统。 检测光源子系统,操作光学子系统和目标信号处理子系统被组合成用于测试样本的检测特性的几种可能的光学采样设置之一。 功能模式设置至少包括椭圆计,共焦图像扫描仪,光子隧道扫描显微镜和干涉仪。
    • 10. 发明授权
    • Surface plasmon resonance meter
    • 表面等离子体共振仪
    • US07791730B2
    • 2010-09-07
    • US12422891
    • 2009-04-13
    • Chih-Kung LeeShu-Sheng LeeChih-Hsiang SungYi-Hao Chen
    • Chih-Kung LeeShu-Sheng LeeChih-Hsiang SungYi-Hao Chen
    • G01N21/55
    • G01N21/553
    • A surface plasmon resonance meter is provided, including a backlight module, a line-slot plate, a parabolic mirror, a linear polarizer, a sensing chip, a prism and a photo detector array. The line-slot plate includes a light outlet. A light beam travels in the backlight module, and leaves the backlight module through the light outlet. The position of the line-slot plate is matched on a predetermined focal point of the parabolic mirror. The light beam is reflected by the parabolic mirror to be a parallel light beam, and travels trough the linear polarizer to the prism. The prism includes a light entering surface, a detection surface and a light exiting surface. The light beam enters the prism through the light entering surface, contacts the sensing chip with total internal reflection, and finally leaves the prism through the light exiting surface to be received by the photo detector array.
    • 提供了表面等离子体共振仪,包括背光模块,线槽板,抛物面镜,线性偏振器,感测芯片,棱镜和光电检测器阵列。 线槽板包括一个灯出口。 光束在背光模块中传播,并使背光模块通过灯泡出口。 线槽板的位置在抛物面镜的预定焦点上匹配。 光束被抛物面镜反射成平行光束,并且通过线性偏振器行进到棱镜。 棱镜包括光入射表面,检测表面和光出射表面。 光束通过光进入表面进入棱镜,与全内反射接触感测芯片,最后通过光出射表面离开棱镜,以被光电检测器阵列接收。