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    • 5. 发明授权
    • Battery core and method of manufacturing the same
    • 电池芯和制造方法相同
    • US09123924B2
    • 2015-09-01
    • US13596299
    • 2012-08-28
    • Ming-Lung ChenChien-Ming ChenChing-Chou YuSheng-Fu Wen
    • Ming-Lung ChenChien-Ming ChenChing-Chou YuSheng-Fu Wen
    • H01M4/64H01M4/04H01M10/04
    • H01M4/0404H01M10/0431Y10T29/49208
    • A battery core and a method of manufacturing the same are disclosed herein. The battery core includes a first electrode plate and a second electrode plate. The first electrode plate includes a substrate and a first active material. A first portion of the first active material is formed on a first area of the substrate, and a second portion of the first active material is formed on a second area of the substrate. The second electrode plate includes first and second substrates disconnected from each other, and a second active material. The first and second substrates are positioned corresponding to the first and second first areas respectively. A first portion of the second active material is formed on the first substrate, and a second portion of the second active material is formed on the second substrate.
    • 本文公开了电池芯及其制造方法。 电池芯包括第一电极板和第二电极板。 第一电极板包括基板和第一活性材料。 第一活性材料的第一部分形成在衬底的第一区域上,并且第一活性材料的第二部分形成在衬底的第二区域上。 第二电极板包括彼此分离的第一和第二基板和第二活性材料。 第一和第二基板分别对应于第一和第二区域定位。 第二活性物质的第一部分形成在第一衬底上,第二活性材料的第二部分形成在第二衬底上。
    • 6. 发明授权
    • Package carrier
    • 包装承运人
    • US08859908B2
    • 2014-10-14
    • US13778078
    • 2013-02-26
    • Chin-Sheng WangChien-Ming Chen
    • Chin-Sheng WangChien-Ming Chen
    • H05K1/00H05K1/11H05K1/02
    • H05K1/0206H01L2924/0002H05K2201/10416H01L2924/00
    • A package carrier includes a substrate, first and second insulation layers, first and second patterned circuit layers, at least one first and second conductive through holes, a heat dissipation channel, an adhesive layer and a heat conducting element. The first and second patterned circuit layers are respectively disposed on the first and second insulation layers which are respectively disposed on upper and lower surfaces of the substrate. The heat dissipation channel at least passes through the first insulation layer, the first and second patterned circuit layers, and the substrate. The first and second conductive through holes electrically connect with the substrate, the first and second patterned circuit layers. At least two opposite side surfaces of the heat conducting element each includes at least one convex portion or at least one concave portion. The heat conducting element is mounted in the heat dissipation channel via the adhesive layer.
    • 封装载体包括衬底,第一和第二绝缘层,第一和第二图案化电路层,至少一个第一和第二导电通孔,散热通道,粘合剂层和导热元件。 第一和第二图案化电路层分别设置在分别设置在基板的上表面和下表面上的第一绝缘层和第二绝缘层上。 散热通道至少穿过第一绝缘层,第一和第二图案化电路层以及基板。 第一和第二导电通孔与衬底电连接,第一和第二图案化电路层。 导热元件的至少两个相对侧表面各自包括至少一个凸部或至少一个凹部。 导热元件通过粘合剂层安装在散热通道中。
    • 7. 发明申请
    • MANUFACTURING METHOD OF COVER STRUCTURE
    • 盖结构的制造方法
    • US20140224411A1
    • 2014-08-14
    • US14253883
    • 2014-04-16
    • Chien-Ming Chen
    • Chien-Ming Chen
    • H05K9/00
    • H05K9/0084H05K9/0086Y10T156/10Y10T156/1039
    • A method of manufacturing a cover structure is provided. A first insulating layer is provided. The first insulating layer has a first surface and a second surface opposite to each other. A second insulating layer is provided. The second insulating layer has a third surface and a fourth surface opposite to each other and an opening passing through the third surface and the fourth surface. A thickness of the second insulating layer is greater than a thickness of the first insulating layer. The first insulating layer and the second insulating layer are laminated to each other, so that the third surface of the second insulating layer connects to the second surface of the first insulating layer. A cavity is defined by the opening of the second insulating layer and the first insulating layer. A metal layer is formed on the cavity.
    • 提供一种制造盖结构的方法。 提供第一绝缘层。 第一绝缘层具有彼此相对的第一表面和第二表面。 提供第二绝缘层。 第二绝缘层具有彼此相对的第三表面和第四表面以及通过第三表面和第四表面的开口。 第二绝缘层的厚度大于第一绝缘层的厚度。 第一绝缘层和第二绝缘层彼此层叠,使得第二绝缘层的第三表面连接到第一绝缘层的第二表面。 空腔由第二绝缘层和第一绝缘层的开口限定。 在空腔上形成金属层。