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1. 发明申请

US20060189035A1 Placement of Absorbing Material in a Semiconductor Device 有权
标题翻译：吸收材料放置在半导体器件中
公开(公告)号：US20060189035A1
公开(公告)日：2006-08-24
申请号：US11276875
申请日：2006-03-17
申请人： Chien-Hua Chen , David Crald , Troy Schwinabart
发明人： Chien-Hua Chen , David Crald , Troy Schwinabart
IPC分类号： H01L21/52
CPC分类号： H01L23/26 , H01L2224/48091 , H01L2224/73265 , H01L2924/15312 , H01L2924/00014
摘要： A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.
摘要翻译：提供一种半导体器件，其包括具有顶部构件和底部构件的气密密封的壳体。将半导体管芯封装在壳体内，并且吸收材料位于半导体管芯下方。

2. 发明申请

US20070274669A1 Fabrication tool for bonding 有权
标题翻译：用于粘接的加工工具
公开(公告)号：US20070274669A1
公开(公告)日：2007-11-29
申请号：US11413333
申请日：2006-04-28
申请人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
发明人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
IPC分类号： G02B6/00
CPC分类号： H01L21/67092
摘要： A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
摘要翻译：在第一和第二装置表面已被等离子体激活之后，制造工具将第一装置表面压靠第二装置表面，以将第一装置表面与第二装置表面结合。制造工具包括粘合活塞，以在第一装置表面施加力以将第一装置表面压靠第二装置表面。制造工具还包括位于接合活塞和第一装置表面之间的压力板。制造工具还包括机构，以确保由第一装置表面经由压板施加的结合活塞的力最初施加在第一装置表面上的一个或多个第一位置上，随后在一个或多个第二位置上施加第一个设备表面。

3. 发明申请

US20060033188A1 Electronic component packaging 审中-公开
标题翻译：电子元件包装
公开(公告)号：US20060033188A1
公开(公告)日：2006-02-16
申请号：US11011426
申请日：2004-12-14
申请人： Chien-Hua Chen , Troy Schwinabart , David Craig
发明人： Chien-Hua Chen , Troy Schwinabart , David Craig
IPC分类号： H01L23/02 , H01L21/52
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01033 , H01L2924/01049 , H01L2924/01067 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/3011 , H01L2924/00
摘要： One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component and including a mechanically planarized sealing surface, and a lid including a mechanically planarized sealing surface sealed to the planarized sealing surface of the base so as to define a hermetic seal therebetween.
摘要翻译：电子部件包装系统的一个实施例包括适于支撑电子部件并包括机械平面化的密封表面的基座和包括密封到基座的平坦化密封表面的机械平面化的密封表面的盖子，以便限定气密密封之间。

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