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1. 发明申请

US20050121778A1 Thinned die integrated circuit package 有权
标题翻译：薄模集成电路封装
公开(公告)号：US20050121778A1
公开(公告)日：2005-06-09
申请号：US11033325
申请日：2005-01-11
申请人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Anna George , Chuan Hu
发明人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Anna George , Chuan Hu
IPC分类号： H01L23/14 , H01L23/367 , H01L23/495
CPC分类号： H01L24/97 , H01L21/4871 , H01L23/142 , H01L23/36 , H01L23/367 , H01L23/49816 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/20 , H01L2224/211 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
摘要翻译：一种方法和装置提供具有改进的散热和更容易制造的集成电路封装。集成电路封装包括使用导热材料附着到散热器的薄化半导体管芯。减薄的模头降低了模具/散热器组合的热阻，以改善从模具的热提取以及消除制造中的加工步骤。此外，薄型模具变得更加柔顺，因为它承受散热器的热/机械性能，以减少模具的应力引起的开裂。

2. 发明授权

US07888183B2 Thinned die integrated circuit package 有权
标题翻译：薄模集成电路封装
公开(公告)号：US07888183B2
公开(公告)日：2011-02-15
申请号：US12042392
申请日：2008-03-05
申请人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Anna George, legal representative , Chuan Hu
发明人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Chuan Hu
IPC分类号： H01L21/44
CPC分类号： H01L24/97 , H01L21/4871 , H01L23/142 , H01L23/36 , H01L23/367 , H01L23/49816 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/20 , H01L2224/211 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
摘要翻译：一种方法和装置提供具有改进的散热和更容易制造的集成电路封装。集成电路封装包括使用导热材料附着到散热器的薄化半导体管芯。减薄的模头降低了模具/散热器组合的热阻，以改善从模具的热提取以及消除制造中的加工步骤。此外，薄型模具变得更加柔顺，因为它承受散热器的热/机械性能，以减少模具的应力引起的开裂。

3. 发明申请

US20080153209A1 THINNED DIE INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：薄膜集成电路封装
公开(公告)号：US20080153209A1
公开(公告)日：2008-06-26
申请号：US12042392
申请日：2008-03-05
申请人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Anna George , Chuan Hu
发明人： Cheng-Yi Liu , Johanna Swan , Steven Towle , Anna George , Chuan Hu
IPC分类号： H01L21/58
CPC分类号： H01L24/97 , H01L21/4871 , H01L23/142 , H01L23/36 , H01L23/367 , H01L23/49816 , H01L23/5389 , H01L24/11 , H01L24/19 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/16225 , H01L2224/16227 , H01L2224/20 , H01L2224/211 , H01L2224/32245 , H01L2224/73253 , H01L2224/73267 , H01L2224/82039 , H01L2224/92244 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.
摘要翻译：一种方法和装置提供具有改进的散热和更容易制造的集成电路封装。集成电路封装包括使用导热材料附着到散热器的薄化半导体管芯。减薄的模头降低了模具/散热器组合的热阻，以改善从模具的热提取以及消除制造中的加工步骤。此外，薄型模具变得更加柔顺，因为它承受散热器的热/机械性能，以减少模具的应力引起的开裂。

4. 发明申请

US20080032280A1 Method and Kits for Detecting Human Cytomegalovirus 失效
标题翻译：检测人巨细胞病毒的方法和试剂盒
公开(公告)号：US20080032280A1
公开(公告)日：2008-02-07
申请号：US11459329
申请日：2006-07-21
申请人： Yu-Jiun Chan , Jui-Chu Lin , Cheng-Yi Liu , Ming-Tak Ho
发明人： Yu-Jiun Chan , Jui-Chu Lin , Cheng-Yi Liu , Ming-Tak Ho
IPC分类号： C12Q1/70 , C07H21/00
CPC分类号： C12Q1/701
摘要： The present invention provides methods and kits for detecting human cytomegalovirus. The present invention also provides oligonucleotides for detecting human cytomegalovirus.
摘要翻译：本发明提供用于检测人巨细胞病毒的方法和试剂盒。本发明还提供了用于检测人巨细胞病毒的寡核苷酸。

5. 发明申请

US20080003707A1 Method for fabricating diode having reflective electrode of alloy metal 审中-公开
标题翻译：制造具有合金金属反射电极的二极管的方法
公开(公告)号：US20080003707A1
公开(公告)日：2008-01-03
申请号：US11501015
申请日：2006-08-09
申请人： Cheng-Yi Liu , Chia-Hsien Chou , Ching-Liang Lin
发明人： Cheng-Yi Liu , Chia-Hsien Chou , Ching-Liang Lin
IPC分类号： H01L33/00
CPC分类号： H01L33/405 , H01L33/0095 , H01L33/32 , H01L33/40
摘要： The present invention provides a method to fabricate a diode whose heat stability is improved. The diode has a layer of high reflective ohmic contact and an alloy metal is used in the layer. With the alloy metal used in the layer, the heat stability of the diode is improved.
摘要翻译：本发明提供一种制造热稳定性提高的二极管的方法。二极管具有高反射欧姆接触层，在该层中使用合金金属。使用该层中使用的合金金属，二极管的热稳定性得到改善。

6. 发明授权

US07265389B2 Light emitting diode and fabricating method thereof 有权
标题翻译：发光二极管及其制造方法
公开(公告)号：US07265389B2
公开(公告)日：2007-09-04
申请号：US11163314
申请日：2005-10-14
申请人： Cheng-Yi Liu , Yuan-Tai Lai , Shen-Jie Wang
发明人： Cheng-Yi Liu , Yuan-Tai Lai , Shen-Jie Wang
IPC分类号： H01L27/15 , H01L21/00
CPC分类号： H01L33/0079 , H01L25/0753 , H01L2224/48091 , H01L2924/00014
摘要： A method for fabricating a light emitting diode (LED) is provided. Successively forming a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer on an epitaxy substrate; forming a bonding layer thereon; bonding a transferring substrate with the bonding layer; removing the epitaxy substrate; removing a part of the first type doped semiconductor layer, the light emitting layer and the second type doped semiconductor layer for exposing a part of the bonding layer; patterning the bonding layer to form a first and a second bonding portion isolated from each other, wherein the first type doped semiconductor layer, the light emitting layer and the second type doped semiconductor layer are disposed on the first bonding portion; forming a pad on the first type doped semiconductor layer; and forming a conducting wire for electrically connecting the pad and the second bonding portion.
摘要翻译：提供一种制造发光二极管（LED）的方法。在外延衬底上连续形成第一掺杂半导体层，发光层和第二掺杂半导体层; 在其上形成结合层; 用转移衬底与接合层接合; 去除外延衬底; 去除所述第一类型掺杂半导体层的一部分，所述发光层和所述第二类型掺杂半导体层，用于暴露所述结合层的一部分; 图案化所述接合层以形成彼此隔离的第一和第二接合部分，其中所述第一掺杂半导体层，所述发光层和所述第二掺杂半导体层设置在所述第一接合部分上; 在所述第一掺杂半导体层上形成焊盘; 以及形成用于电连接所述焊盘和所述第二接合部的导线。

7. 发明申请

US20070122646A1 SOLDER COMPOSITION AND SOLDERING STRUCTURE 审中-公开
标题翻译：焊接组合物和焊接结构
公开(公告)号：US20070122646A1
公开(公告)日：2007-05-31
申请号：US11307447
申请日：2006-02-08
申请人： Cheng-Yi Liu , Shen-Jie Wang
发明人： Cheng-Yi Liu , Shen-Jie Wang
IPC分类号： C22C13/00 , B32B15/01
CPC分类号： C22C13/00 , C22C13/02 , Y10T428/12708
摘要： A solder composition for reacting with aluminum is provided. The main alloying components in the solder includes tin (Sn), zinc (Zn) and chromium (Cr) with 0.01 wt % to 20 wt % zinc and 0.01 wt % to 20 wt % chromium.
摘要翻译：提供了与铝反应的焊料组合物。焊料中的主要合金成分包括含有0.01重量％至20重量％锌和0.01重量％至20重量％铬的锡（Sn），锌（Zn）和铬（Cr）。

8. 发明申请

US20050031483A1 [SOLDER COMPOSITION] 审中-公开
标题翻译： [焊接组合物]
公开(公告)号：US20050031483A1
公开(公告)日：2005-02-10
申请号：US10709990
申请日：2004-06-11
申请人： Cheng-Yi Liu , Shih-Chieh Hsu , Shen-Jie Wang
发明人： Cheng-Yi Liu , Shih-Chieh Hsu , Shen-Jie Wang
IPC分类号： B23K35/22 , B23K35/26 , B23K35/28 , B23K35/32 , C22C12/00 , C22C13/00 , C22C18/00 , C22C28/00
CPC分类号： B23K35/26 , B23K35/262 , B23K35/264 , B23K35/282 , B23K35/32 , C22C12/00 , C22C13/00 , C22C18/00 , C22C28/00
摘要： A solder composition adapted to bond metallic materials and non-metallic materials is provided. The solder composition can enhance the bonding strength for the metallic materials and the non-metallic materials. The solder composition mainly comprises Sn—Cr alloy. The solder composition further includes anther metal component for regulating the bonding capability so that the solder composition can be used to bond various materials.
摘要翻译：提供了适于粘合金属材料和非金属材料的焊料组合物。焊料组合物可以增强金属材料和非金属材料的结合强度。焊料组成主要包括Sn-Cr合金。焊料组合物还包括用于调节接合能力的其他金属组分，以便可以将焊料组合物用于粘合各种材料。

9. 发明授权

US08017962B2 Light-emitting diode apparatus and manufacturing method thereof 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US08017962B2
公开(公告)日：2011-09-13
申请号：US12193271
申请日：2008-08-18
申请人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
发明人： Shih-Peng Chen , Chia-Hua Chan , Horng-Jou Wang , Ching-Liang Lin , Chii-Chang Chen , Cheng-Yi Liu , Huang-Kun Chen
IPC分类号： H01L33/60
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2933/0091
摘要： A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.
摘要翻译：发光二极管（LED）装置包括导热基板，导热粘合剂层，外延层，电流扩散层和微型或纳米粗糙结构。导热粘合剂层设置在导热基板上。外延层与导电粘合剂层相对设置，并具有第一半导体层，有源层和第二半导体层。电流扩散层设置在外延层的第二半导体层和导热粘合剂层之间。微结构或纳米粗糙结构设置在外延层的第一半导体层上。此外，还公开了一种LED装置的制造方法。

10. 发明申请

US20060255348A1 LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：发光二极管及其制造方法
公开(公告)号：US20060255348A1
公开(公告)日：2006-11-16
申请号：US11164133
申请日：2005-11-11
申请人： Cheng-Yi Liu , Shih-Chieh Hsu
发明人： Cheng-Yi Liu , Shih-Chieh Hsu
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/0079
摘要： A method for fabricating a light emitting diode (LED) is provided. A first-type doped semiconductor layer, a light emitting layer and a second-type doped semiconductor layer are formed on an epitaxy substrate sequentially. Then, a gold layer is formed on the second-type doped semiconductor layer. Next, a bonding substrate is provided. The bonding substrate includes a silicon substrate and a germanium-contained layer disposed on the silicon substrate. Then, a bonding process is performed on the bonding substrate and the gold layer. Next, the epitaxy substrate is removed. Accordingly, a LED with better reliability and light-emitting efficiency can be made. Moreover, a LED is also provided.
摘要翻译：提供一种制造发光二极管（LED）的方法。依次在外延基板上形成第一掺杂半导体层，发光层和第二掺杂半导体层。然后，在第二掺杂半导体层上形成金层。接下来，提供接合基板。接合基板包括硅基板和设置在硅基板上的含锗层。然后，对接合基板和金层进行接合处理。接下来，除去外延基板。因此，可以实现具有更好的可靠性和发光效率的LED。此外，还提供了LED。

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