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1. 发明申请

US20110157775A1 DECOUPLING DEVICE 有权
标题翻译：解除装置
公开(公告)号：US20110157775A1
公开(公告)日：2011-06-30
申请号：US12776442
申请日：2010-05-10
申请人： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
发明人： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
IPC分类号： H01G9/00
CPC分类号： H01G9/15 , H01G9/008 , H01G9/28
摘要： A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.
摘要翻译：解耦装置包括引线框架，电容器单元，金属层和高介电有机 - 无机复合材料层。引线框架包括阴极端子部分和阳极端子部分。电容器单元设置在引线框架上。电容器单元包括阴极部分，阳极部分和位于阴极部分和阳极部分之间的绝缘部分。阴极部分电连接到阴极端子部分，并且阳极部分电连接到阳极端子部分。高介电有机 - 无机复合材料层通过金属层并联连接到电容器单元。

2. 发明授权

US08289679B2 Decoupling device 有权
标题翻译：去耦装置
公开(公告)号：US08289679B2
公开(公告)日：2012-10-16
申请号：US12776442
申请日：2010-05-10
申请人： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
发明人： Cheng-Liang Cheng , Chi-Lun Chen , Li-Duan Tsai , Min-Lin Lee , Shur-Fen Liu
IPC分类号： H01G5/38 , H01G9/00
CPC分类号： H01G9/15 , H01G9/008 , H01G9/28
摘要： A decoupling device includes a lead frame, a capacitor unit, a metal layer, and a high dielectric organic-inorganic composite material layer. The lead frame includes a cathode terminal portion and an anode terminal portion. The capacitor unit is disposed on the lead frame. The capacitor unit includes a cathode portion, an anode portion, and an insulation portion located between the cathode portion and the anode portion. The cathode portion is electrically connected to the cathode terminal portion, and the anode portion is electrically connected to the anode terminal portion. The high dielectric organic-inorganic composite material layer is connected to the capacitor unit in parallel via the metal layer.
摘要翻译：解耦装置包括引线框架，电容器单元，金属层和高介电有机 - 无机复合材料层。引线框架包括阴极端子部分和阳极端子部分。电容器单元设置在引线框架上。电容器单元包括阴极部分，阳极部分和位于阴极部分和阳极部分之间的绝缘部分。阴极部分电连接到阴极端子部分，并且阳极部分电连接到阳极端子部分。高介电有机 - 无机复合材料层通过金属层并联连接到电容器单元。

3. 发明申请

US20090161298A1 HYBRID CAPACITOR 有权
标题翻译：混合电容器
公开(公告)号：US20090161298A1
公开(公告)日：2009-06-25
申请号：US12050188
申请日：2008-03-18
申请人： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
发明人： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
IPC分类号： H01G9/26 , H01G9/15
CPC分类号： H01G9/15 , H01G9/0029 , H01G9/012 , H01L23/642 , H01L28/40 , H01L2924/0002 , H01L2924/12044 , H01L2924/19015 , H01L2924/3011 , H01L2924/00
摘要： A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.
摘要翻译：提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。衬底具有通孔，并且板电容器在衬底上。至少一个通孔电容器和至少一个平板电容器是并联的。通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。第一阴极层被第二阴极层覆盖。第二阴极层的导电率大于第一阴极层的导电率。

4. 发明授权

US07561410B1 Hybrid capacitor 有权
标题翻译：混合电容
公开(公告)号：US07561410B1
公开(公告)日：2009-07-14
申请号：US12050188
申请日：2008-03-18
申请人： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
发明人： Min-Lin Lee , Li-Duan Tsai , Shur-Fen Liu , Bang-Hao Wu , Cheng-Liang Cheng
IPC分类号： H01G9/025
CPC分类号： H01G9/15 , H01G9/0029 , H01G9/012 , H01L23/642 , H01L28/40 , H01L2924/0002 , H01L2924/12044 , H01L2924/19015 , H01L2924/3011 , H01L2924/00
摘要： A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.
摘要翻译：提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。衬底具有通孔，并且板电容器在衬底上。至少一个通孔电容器和至少一个平板电容器是并联的。通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。第一阴极层被第二阴极层覆盖。第二阴极层的导电率大于第一阴极层的导电率。

5. 发明授权

US08922976B2 Decoupling device and fabricating method thereof 有权
标题翻译：去耦装置及其制造方法
公开(公告)号：US08922976B2
公开(公告)日：2014-12-30
申请号：US13350813
申请日：2012-01-15
申请人： Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
发明人： Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
IPC分类号： H01G4/228 , H01G5/38 , H01G9/048 , H01G9/15 , H01G9/26 , H01G9/08
CPC分类号： H01G9/048 , H01G9/08 , H01G9/15 , H01G9/26 , Y10T29/417
摘要： A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.
摘要翻译：提供一种包括引线框，多个电容器单元，保护层和封装元件的去耦装置。引线框架包括阴极端子部分和设置在阴极端子部分两端的至少两个相对的阳极端子部分。两个阳极端子部分通过导线彼此电连接。电容器单元并联连接并设置在引线框架上。每个电容器单元具有阴极部分和相对的阳极部分。阴极部分与阴极端子部电连接。阳极部与阳极端子部电连接。保护层包裹电容器单元的阳极部分和阴极部分中的至少一个。封装元件覆盖引线框架，电容器单元和保护层。包装元件暴露引线框架的底表面。

6. 发明申请

US20130120903A1 DECOUPLING DEVICE AND FABRICATING METHOD THEREOF 有权
标题翻译：解除装置及其制作方法
公开(公告)号：US20130120903A1
公开(公告)日：2013-05-16
申请号：US13350813
申请日：2012-01-15
申请人： Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
发明人： Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
IPC分类号： H01G4/236 , H01G9/08
CPC分类号： H01G9/048 , H01G9/08 , H01G9/15 , H01G9/26 , Y10T29/417
摘要： A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.
摘要翻译：提供一种包括引线框，多个电容器单元，保护层和封装元件的去耦装置。引线框架包括阴极端子部分和设置在阴极端子部分的两端的至少两个相对的阳极端子部分。两个阳极端子部分通过导线彼此电连接。电容器单元并联连接并设置在引线框架上。每个电容器单元具有阴极部分和相对的阳极部分。阴极部分与阴极端子部电连接。阳极部与阳极端子部电连接。保护层包裹电容器单元的阳极部分和阴极部分中的至少一个。封装元件覆盖引线框架，电容器单元和保护层。包装元件暴露引线框架的底表面。

7. 发明申请

US20120168217A1 EMBEDDED CAPACITOR SUBSTRATE MODULE 有权
标题翻译：嵌入式电容器基板模块
公开(公告)号：US20120168217A1
公开(公告)日：2012-07-05
申请号：US13197283
申请日：2011-08-03
申请人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
IPC分类号： H05K1/16
CPC分类号： H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
摘要： An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
摘要翻译：嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。金属基板用作第一电极，并且基板用作第二电极。在基板和金属基板之间形成绝缘材料。因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且还可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。

8. 发明授权

US08941015B2 Embedded capacitor substrate module 有权
标题翻译：嵌入式电容器基板模块
公开(公告)号：US08941015B2
公开(公告)日：2015-01-27
申请号：US13197283
申请日：2011-08-03
申请人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
发明人： Chien-Min Hsu , Min-Lin Lee , Cheng-Liang Cheng , Li-Duan Tsai
IPC分类号： H05K1/16 , H05K1/02 , H01L23/498 , H01L23/64 , H05K3/46 , H01L23/00 , H01G9/012 , H01G9/15
CPC分类号： H05K1/0231 , H01G9/012 , H01G9/15 , H01L23/49822 , H01L23/642 , H01L24/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2924/14 , H01L2924/19041 , H05K1/162 , H05K3/4608 , H05K2201/0187 , H05K2201/09309 , H05K2203/0315
摘要： An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.
摘要翻译：嵌入式电容器基板模块包括基板，金属基板和固体电解电容器材料。在金属基板上形成固体电解电容器材料，以便与基板形成固体电解电容器。嵌入式电容器基板模块还包括通过使基板和金属基板延伸而形成的电极引出区域。金属基板用作第一电极，并且基板用作第二电极。在基板和金属基板之间形成绝缘材料。因此，嵌入式电容器基板模块不仅有利于具有作为常规固体电容器的大电容，而且可以在嵌入印刷电路板中之后被钻孔或电镀并电连接到其它电路。

9. 发明申请

US20090159322A1 THROUGH HOLE CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：通孔电容器及其制造方法
公开(公告)号：US20090159322A1
公开(公告)日：2009-06-25
申请号：US12046422
申请日：2008-03-11
申请人： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
发明人： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
IPC分类号： H05K1/18 , H01G4/35
CPC分类号： H05K1/162 , H01G9/012 , H01G11/48 , H05K2201/09809 , H05K2203/0315 , Y02E60/13 , Y10T29/417 , Y10T29/435
摘要： A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.
摘要翻译：提供至少包括基板，阳极层，电介质层，第一阴极层和第二阴极层的通孔电容器。基板具有多个通孔。阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。电介质层设置在阳极层的多孔结构上。第一阴极层覆盖电介质层的表面。第二阴极层覆盖第一阴极层的表面，第二阴极层的导电率大于第一阴极层的导电率。通孔电容器可用于阻抗控制，因为通孔的阴极层用于信号传输。

10. 发明授权

US07894178B2 Through hole capacitor and method of manufacturing the same 有权
标题翻译：通孔电容器及其制造方法
公开(公告)号：US07894178B2
公开(公告)日：2011-02-22
申请号：US12046422
申请日：2008-03-11
申请人： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
发明人： Bang-Hao Wu , Li-Duan Tsai , Min-Lin Lee , Cheng-Liang Cheng
IPC分类号： H01G9/04 , H01G9/145 , H01G4/228
CPC分类号： H05K1/162 , H01G9/012 , H01G11/48 , H05K2201/09809 , H05K2203/0315 , Y02E60/13 , Y10T29/417 , Y10T29/435
摘要： A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.
摘要翻译：提供至少包括基板，阳极层，电介质层，第一阴极层和第二阴极层的通孔电容器。基板具有多个通孔。阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。电介质层设置在阳极层的多孔结构上。第一阴极层覆盖电介质层的表面。第二阴极层覆盖第一阴极层的表面，第二阴极层的导电性大于第一阴极层的导电率。通孔电容器可用于阻抗控制，因为通孔的阴极层用于信号传输。

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