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1. 发明申请

US20120319271A1 BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME 有权
标题翻译： BUMP结构及其制造方法
公开(公告)号：US20120319271A1
公开(公告)日：2012-12-20
申请号：US13163967
申请日：2011-06-20
申请人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
发明人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
IPC分类号： H01L23/52 , H01L21/44
CPC分类号： H01L24/03 , H01L24/05 , H01L2224/02126 , H01L2224/0401 , H01L2224/05012 , H01L2224/05017 , H01L2224/05018 , H01L2224/05022 , H01L2224/051 , H01L2224/05166 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/05582 , H01L2224/05644 , H01L2224/81805 , H01L2924/01322 , H01L2924/15788 , H01L2924/01074 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block and the second polymer block are located at two sides of the first groove, the first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first connection slot and the first groove. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove, a third connection slot and a fourth connection slot communicated with each other. The connection metal layer covers the under bump metallurgy layer to form a third groove, a fifth connection slot and a sixth connection slot communicated with each other.
摘要翻译：凸块结构包括第一聚合物嵌段，第二聚合物嵌段，第一凹槽，凸块下金属层和连接金属层，其中第一聚合物嵌段和第二聚合物嵌段是各自的嵌段。第一聚合物嵌段和第二聚合物嵌段位于第一凹槽的两侧，第一聚合物嵌段包括第一连接槽，第二聚合物嵌段包括与第一连接槽和第一凹槽连通的第二连接槽。凸块下金属层覆盖第一聚合物嵌段和第二聚合物嵌段以形成彼此连通的第二凹槽，第三连接槽和第四连接槽。连接金属层覆盖凸块下金属层以形成第三凹槽，第五连接槽和第六连接槽彼此连通。

2. 发明申请

US20120318570A1 BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME 有权
标题翻译： BUMP结构及其制造方法
公开(公告)号：US20120318570A1
公开(公告)日：2012-12-20
申请号：US13163870
申请日：2011-06-20
申请人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
发明人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
IPC分类号： H05K1/00 , B23K1/20
CPC分类号： H05K3/4007 , H05K3/244 , H05K2201/09745 , H05K2201/099
摘要： A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first groove and the first connection slot. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove. The connection metal layer covers the under bump metallurgy layer to form a third groove, wherein the under bump metallurgy layer covers a first coverage area of the first polymer block and a second coverage area of the second polymer block and reveals a first exposure area of the first polymer block and a second exposure area of the second polymer block.
摘要翻译：凸块结构包括第一聚合物嵌段，第二聚合物嵌段，第一凹槽，凸块下金属层和连接金属层，其中第一聚合物嵌段和第二聚合物嵌段是各自的嵌段。第一聚合物块包括第一连接槽，第二聚合物块包括与第一槽和第一连接槽连通的第二连接槽。凸块下金属层覆盖第一聚合物嵌段和第二聚合物嵌段以形成第二凹槽。所述连接金属层覆盖所述凸块下金属层以形成第三凹槽，其中所述凸块下金属层覆盖所述第一聚合物嵌段的第一覆盖区域和所述第二聚合物嵌段的第二覆盖区域，并且揭示所述第二聚合物嵌段的第一暴露区域第一聚合物嵌段和第二聚合物嵌段的第二曝光区域。

3. 发明授权

US08437142B2 Bump structure and process of manufacturing the same 有权
标题翻译：凸块结构和制造过程相同
公开(公告)号：US08437142B2
公开(公告)日：2013-05-07
申请号：US13163870
申请日：2011-06-20
申请人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
发明人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
IPC分类号： H05K7/00
CPC分类号： H05K3/4007 , H05K3/244 , H05K2201/09745 , H05K2201/099
摘要： A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first groove and the first connection slot. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove. The connection metal layer covers the under bump metallurgy layer to form a third groove, wherein the under bump metallurgy layer covers a first coverage area of the first polymer block and a second coverage area of the second polymer block and reveals a first exposure area of the first polymer block and a second exposure area of the second polymer block.
摘要翻译：凸块结构包括第一聚合物嵌段，第二聚合物嵌段，第一凹槽，凸块下金属层和连接金属层，其中第一聚合物嵌段和第二聚合物嵌段是各自的嵌段。第一聚合物块包括第一连接槽，第二聚合物块包括与第一槽和第一连接槽连通的第二连接槽。凸块下金属层覆盖第一聚合物嵌段和第二聚合物嵌段以形成第二凹槽。所述连接金属层覆盖所述凸块下金属层以形成第三凹槽，其中所述凸块下金属层覆盖所述第一聚合物嵌段的第一覆盖区域和所述第二聚合物嵌段的第二覆盖区域，并且揭示所述第二聚合物嵌段的第一暴露区域第一聚合物嵌段和第二聚合物嵌段的第二曝光区域。

4. 发明授权

US08330280B1 Bump structure and process of manufacturing the same 有权
标题翻译：凸块结构和制造过程相同
公开(公告)号：US08330280B1
公开(公告)日：2012-12-11
申请号：US13163967
申请日：2011-06-20
申请人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
发明人： Cheng-Hung Shih , Shyh-Jen Guo , Wen-Tung Chen
IPC分类号： H01L29/40
CPC分类号： H01L24/03 , H01L24/05 , H01L2224/02126 , H01L2224/0401 , H01L2224/05012 , H01L2224/05017 , H01L2224/05018 , H01L2224/05022 , H01L2224/051 , H01L2224/05166 , H01L2224/05552 , H01L2224/05557 , H01L2224/05558 , H01L2224/05572 , H01L2224/05582 , H01L2224/05644 , H01L2224/81805 , H01L2924/01322 , H01L2924/15788 , H01L2924/01074 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A bump structure comprises a first polymer block, a second polymer block, a first groove, an under bump metallurgy layer and a connection metal layer, wherein the first polymer block and the second polymer block are individual blocks. The first polymer block and the second polymer block are located at two sides of the first groove, the first polymer block comprises a first connection slot, and the second polymer block comprises a second connection slot communicated with the first connection slot and the first groove. The under bump metallurgy layer covers the first polymer block and the second polymer block to form a second groove, a third connection slot and a fourth connection slot communicated with each other. The connection metal layer covers the under bump metallurgy layer to form a third groove, a fifth connection slot and a sixth connection slot communicated with each other.
摘要翻译：凸块结构包括第一聚合物嵌段，第二聚合物嵌段，第一凹槽，凸块下金属层和连接金属层，其中第一聚合物嵌段和第二聚合物嵌段是各自的嵌段。第一聚合物嵌段和第二聚合物嵌段位于第一凹槽的两侧，第一聚合物嵌段包括第一连接槽，第二聚合物嵌段包括与第一连接槽和第一凹槽连通的第二连接槽。凸块下金属层覆盖第一聚合物嵌段和第二聚合物嵌段以形成彼此连通的第二凹槽，第三连接槽和第四连接槽。连接金属层覆盖凸块下金属层以形成第三凹槽，第五连接槽和第六连接槽彼此连通。

5. 发明授权

US5886131A Method for preparing 1,4-Bis(4-aminophenoxy)naphthalene and its polymers 失效
标题翻译： 1,4-双（4-氨基苯氧基）萘及其聚合物的制备方法
公开(公告)号：US5886131A
公开(公告)日：1999-03-23
申请号：US866121
申请日：1997-05-30
申请人： Shin Chuan Yao , Jongfu Wu , Kun-Lin Cheng , Wen-Tung Chen
发明人： Shin Chuan Yao , Jongfu Wu , Kun-Lin Cheng , Wen-Tung Chen
IPC分类号： C07C217/90 , C08G69/32 , C08G69/40 , C08G73/10 , C08G73/14
CPC分类号： C08G69/40 , C07C217/90 , C08G69/32 , C08G73/105 , C08G73/1071 , C08G73/14
摘要： A method for synthesizing 1,4-bis(4-aminophenoxy)naphthalene and a series of polyamides, polyimides and copoly(amide-imide)s derived from the said compound is disclosed. These polymers possess excellent thermal stability and mechanical strength.
摘要翻译：公开了由所述化合物衍生的1,4-双（4-氨基苯氧基）萘和一系列聚酰胺，聚酰亚胺和共聚（酰胺 - 酰亚胺）的合成方法。这些聚合物具有优异的热稳定性和机械强度。

6. 发明授权

US06805739B2 Component and manufacture of a photo-catalyst 有权
标题翻译：光催化剂的组分和制造
公开(公告)号：US06805739B2
公开(公告)日：2004-10-19
申请号：US10206180
申请日：2002-07-29
申请人： Lien-Hua Chiu , Wen-Tung Chen , Jan-An Guu , Jeffrey Chi-Sheng Wu , I-Hsiang Tseng , Chih-Hsien Chen
发明人： Lien-Hua Chiu , Wen-Tung Chen , Jan-An Guu , Jeffrey Chi-Sheng Wu , I-Hsiang Tseng , Chih-Hsien Chen
IPC分类号： C04B136
CPC分类号： B01J21/063 , B01J35/004 , B01J37/036 , Y10T428/2993
摘要： A method of manufacturing a photo-catalyst including titanium dioxide and silicon dioxide is provided, wherein titanium dioxide is synthesized by a collosol gelatinization utilizing the water generated by the esterification of acid and alcohol to conduct a reaction of hydrolysis condensation. The silicon dioxide is synthesized by a collosol gelatinization by adding Si(OC2H5)4, n-C4H9OH and water or Si(OC2H5)4, (CH3)Si(OC2H5)3 and water.
摘要翻译：提供了一种制造包括二氧化钛和二氧化硅的光催化剂的方法，其中二氧化钛通过利用由酸和醇的酯化产生的水进行胶体醇凝胶合成，以进行水解缩合反应。通过加入Si（OC 2 H 5）4，n-C 4 H 9 OH和水或Si（OC 2 H 5）4，（CH 3）Si（OC 2 H 5）3和水），通过胶体醇化来合成二氧化硅。

7. 发明授权

US06197920B1 Formulation for the production of 1, 3-bis (4-aminophenoxy) naphthalene and its polymer 有权
标题翻译：制备1,3-双（4-氨基苯氧基）萘及其聚合物的制剂
公开(公告)号：US06197920B1
公开(公告)日：2001-03-06
申请号：US09357996
申请日：1999-07-21
申请人： Kun Lin Cheng , Wen-Tung Chen
发明人： Kun Lin Cheng , Wen-Tung Chen
IPC分类号： C08G7310
CPC分类号： C08G73/14 , C07C217/90 , C08G69/32 , C08G73/105
摘要： The present invention relates to the synthesis of new type of diamine monomer, 1,3-bis(4-amonophenoxy)naphthalene, and with such a compound to produce a series of aromatic polymers, including polyamide, polyimide, copoly(amide-imide)s, etc., such polymers having excellent resistance to heat and mechanical properties.
摘要翻译：本发明涉及新型二胺单体，1,3-双（4-氨基苯氧基）萘和这种化合物的合成，以生产一系列芳族聚合物，包括聚酰胺，聚酰亚胺，共聚（酰胺 - 酰亚胺）这些聚合物具有优异的耐热性和机械性能。

8. 发明授权

US5863983A Manufacturing method for blocked aqueous dispersion of polyurethanes 失效
标题翻译：封闭聚氨酯水分散体的制备方法
公开(公告)号：US5863983A
公开(公告)日：1999-01-26
申请号：US917273
申请日：1997-08-25
申请人： Jongfu Wu , Cheng Kun Lin , Wen-Tung Chen
发明人： Jongfu Wu , Cheng Kun Lin , Wen-Tung Chen
IPC分类号： C08G18/08 , C08G18/12 , C08G18/50 , D06M15/564 , D06M15/568 , D06M15/572 , C08J3/00 , C08K3/20 , C08L75/00
CPC分类号： D06M15/572 , C08G18/0828 , C08G18/12 , C08G18/5072 , D06M15/564 , D06M15/568 , D06M2101/06
摘要： A blocked hydrophilic polyurethane with molecular weight of 500.about.40,000, 5.about.70% solid content and 5.about.200 milliequivalent per 100 g polymer of sulfonic acid salt, can be prepared from following reactants:a. Organic isocyanates;b. Polyols, including polyether polyol, polyester polyol, polycarbonate, and polycaprolactone, that can participate in the polyaddition reactions with isocyanates.c. Polyols containing sulfonate group.d. Organic blocking agents capable of reacting with isocyanates.The blocked hydrophilic PU resins formed from above reactants can be applied for the anti-wrinkle treatment of cellulosic textiles with excellent performance.
摘要翻译：分子量为500的聚合物的封闭亲水性聚氨酯可以由以下反应物制备：差示聚合物40,000，5差异70％固含量和5差异200毫当量/ 100g磺酸盐聚合物。有机异氰酸酯; b。多元醇，包括聚醚多元醇，聚酯多元醇，聚碳酸酯和聚己内酯，其可以参与与异氰酸酯的加聚反应。 C。含有磺酸盐基团的多元醇。 d。能够与异氰酸酯反应的有机封端剂。由上述反应物形成的封闭的亲水PU树脂可以用于具有优异性能的纤维素纺织品的抗皱处理。

9. 发明授权

US06191214B1 Method for the preparation of water-borne polyurethane adhesive 有权
标题翻译：水性聚氨酯胶粘剂的制备方法
公开(公告)号：US06191214B1
公开(公告)日：2001-02-20
申请号：US09354301
申请日：1999-07-16
申请人： Kun Lin Cheng , Wen-Tung Chen
发明人： Kun Lin Cheng , Wen-Tung Chen
IPC分类号： C08J300
CPC分类号： C08G18/0828 , C08G2170/80
摘要： The present invention consists of a method for the preparation of an anionic water dispersible polyurethane(PU), which has excellent adhesive properties. The preparation method involves the formation of prepolymer from polyisocyanates and an active hydrogen containing compound such as polyols, followed by chain extension with aliphatic diols or diamines, and finally by chain extension with N-(2-aminoalkyl-2-aminoethoxylate ethane sulfonate and dispersion of the reaction product by deionized water to obtain water-borne polyurethane adhesive.
摘要翻译：本发明包括具有优异粘合性能的阴离子水分散性聚氨酯（PU）的制备方法。制备方法包括从多异氰酸酯和含活性氢的化合物如多元醇形成预聚物，然后用脂族二醇或二胺进行链延伸，最后通过N-（2-氨基烷基-2-氨基乙氧基化乙烷磺酸盐和分散体的反应产物通过去离子水得到水性聚氨酯粘合剂。

10. 发明授权

US5789518A Method for aqueous polyurethane blocking reaction 失效
标题翻译：水性聚氨酯封闭反应的方法
公开(公告)号：US5789518A
公开(公告)日：1998-08-04
申请号：US649025
申请日：1996-05-16
申请人： Shin-Chuan Yao , Jongfu Wu , Kun-Lin Cheng , Wen-Tung Chen , Fu-Fong Chang
发明人： Shin-Chuan Yao , Jongfu Wu , Kun-Lin Cheng , Wen-Tung Chen , Fu-Fong Chang
IPC分类号： C08G18/08 , C08G18/12 , C08G18/48 , C08G18/50 , C08G18/80
CPC分类号： C08G18/5072 , C08G18/0804 , C08G18/0828 , C08G18/12 , C08G18/4862
摘要： An improved method of reaction of water PU resins for improving the blocking reactions of beta-dicarbynal compounds and polisocynantes, and reducing the reaction time for water PU blocking, wherein the construction is: ##STR1## wherein: R.sub.1,R.sub.2,R.sub.3,R.sub.4 =hydrogen or alkyl group n.sub.1 =1.about.100 n.sub.2, n.sub.3, n.sub.4 =1.about.10 The blocking agents of beta-Dicarbonyl compounds are reduced by D.sub.1 and D.sub.2 which are used in the blocking reactions of water PU.
摘要翻译：一种改进的水PU树脂的改进方法，用于改善β-二碳酸酯化合物和聚异氰酸酯的阻聚反应，并减少水PU阻聚的反应时间，其中结构为：其中：R1，R2， R3，R4 =氢或烷基n1 = 1 DIFFERENCE 100 n2，n3，n4 = 1差异化合物D1和D2的β-二羰基化合物的封闭剂被用于水PU的封闭反应中。

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