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    • 2. 发明授权
    • Method of making an infrared detector
    • 制作红外探测器的方法
    • US5192695A
    • 1993-03-09
    • US727402
    • 1991-07-09
    • Cheng-Chi WangYet-Zen LiuMuren Chu
    • Cheng-Chi WangYet-Zen LiuMuren Chu
    • H01L31/109H01L31/18
    • H01L31/1832H01L31/109Y10S148/031Y10S438/936
    • HgCdTe semiconductor material having an n-type epitaxial layer is grown on a substrate. A graded p-type epitaxial layer is grown on the n-type layer. The p-type layer is graded such that the large bandgap region is adjacent the heterojunction with the narrow bandgap region at the surface of this layer. The periphery of the p-type layer is then etched to expose the large bandgap material. A HgCdTe passivation layer may then be formed on the p-type layer. A resultant structure is then mesa etched. A metal, such as indium, is formed along the walls of the mesa structure. Indium is selected to form a good ohmic contact with the n-type layer and a Schottky barrier with the large bandgap exposed edge of the p-type layer. In this way, the PN junction is passivated at the large bandgap material. The remaining narrow bandgap material in the p-type will form a good ohmic contact to a metal contact formed on this layer.
    • 具有n型外延层的HgCdTe半导体材料生长在基板上。 渐变的p型外延层生长在n型层上。 p型层被分级,使得大的带隙区域与该层表面处的窄带隙区域的异质结相邻。 然后蚀刻p型层的周边以暴露大的带隙材料。 然后可以在p型层上形成HgCdTe钝化层。 然后将得到的结构台面蚀刻。 沿着台面结构的壁形成诸如铟的金属。 选择铟以与n型层形成良好的欧姆接触,并且形成具有p型层的大带隙暴露边缘的肖特基势垒。 以这种方式,PN结在大的带隙材料上被钝化。 p型中剩余的窄带隙材料将与形成在该层上的金属接触形成良好的欧姆接触。