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    • 3. 发明授权
    • Single stripe magnetoresistive (MR) head
    • 单条磁阻(MR)头
    • US06373667B1
    • 2002-04-16
    • US09637208
    • 2000-08-14
    • Cherng-Chyi HanMao-Min ChenCheng Tzong HorngPo-Kang WangChyu Jiuh TorngKochan JuYimin Guo
    • Cherng-Chyi HanMao-Min ChenCheng Tzong HorngPo-Kang WangChyu Jiuh TorngKochan JuYimin Guo
    • G11B5127
    • B82Y25/00G01R33/093G11B5/3903G11B5/3932Y10T29/49048
    • A method for fabricating a soft adjacent layer (SAL) magnetoresistive (MR) sensor element and several soft adjacent layer (SAL) magnetoresistive (MR) sensor elements which may be fabricated employing the method. There is first provided a substrate. There is formed over the substrate a dielectric layer, where the dielectric layer has a first surface of the dielectric layer and a second surface of the dielectric layer opposite the first surface of the dielectric layer. There is also formed over the substrate a magnetoresistive (MR) layer contacting the first surface of the dielectric layer. There is also formed over the substrate a soft adjacent layer (SAL), where the soft adjacent layer (SAL) has a first surface of the soft adjacent layer (SAL) and a second surface of the soft adjacent layer (SAL). The first surface of the soft adjacent layer (SAL) contacts the second surface of the dielectric layer. Finally, there is also formed over the substrate a transverse magnetic biasing layer, where the transverse magnetic biasing layer contacts the second surface of the soft adjacent layer (SAL), and where at least one of the dielectric layer, the magnetoresistive (MR) layer, the soft adjacent layer (SAL) and the transverse magnetic biasing layer is a patterned layer formed employing an etch mask which serves as a lift-off stencil for forming a patterned second dielectric layer adjoining an edge of the patterned layer. The invention also contemplates a soft adjacent layer (SAL) magnetoresistive (MR) sensor element formed with the magnetoresistive (MR) layer interposed between the substrate and the soft adjacent layer (SAL). Similarly, the invention also contemplates a soft adjacent layer (SAL) magnetoresistive (MR) sensor element employing a transverse magnetic biasing layer formed of a hard bias permanent magnet material.
    • 一种用于制造软相邻层(SAL)磁阻(MR)传感器元件和若干软相邻层(SAL)磁阻(MR))传感器元件的方法,其可以使用该方法制造。 首先提供基板。 在衬底上形成介电层,其中电介质层具有电介质层的第一表面和电介质层与电介质层的第一表面相对的第二表面。 还在衬底上形成与电介质层的第一表面接触的磁阻(MR)层。 还在衬底上形成软相邻层(SAL),其中软相邻层(SAL)具有软相邻层(SAL)的第一表面和软相邻层(SAL)的第二表面。 软相邻层(SAL)的第一表面接触电介质层的第二表面。 最后,还在衬底上形成横向磁偏置层,横向磁偏置层接触软相邻层(SAL)的第二表面,并且其中介电层,磁阻(MR)层中的至少一个 ,软相邻层(SAL)和横向磁偏置层是使用蚀刻掩模形成的图案层,其用作用于形成与图案化层的边缘相邻的图案化的第二介电层的剥离模板。 本发明还考虑了由介于基板和软相邻层(SAL)之间的磁阻(MR)层形成的软相邻层(SAL)磁阻(MR)传感器元件。 类似地,本发明还考虑使用由硬偏磁永磁材料形成的横向磁偏置层的软相邻层(SAL)磁阻(MR)传感器元件。
    • 8. 发明申请
    • Magnetic Tunnel Junction for MRAM applications
    • MRAM应用的磁隧道结
    • US20120181537A1
    • 2012-07-19
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L29/82H01L21/36H01L29/04
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FeB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic %. NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiment, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FeB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%的Mg,Hf,Zr,Nb或Ta。 NiFeX厚度优选在20至40埃之间,以显着减少位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。
    • 9. 发明授权
    • Magnetic tunnel junction for MRAM applications
    • 用于MRAM应用的磁隧道结
    • US08786036B2
    • 2014-07-22
    • US12930877
    • 2011-01-19
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • Wei CaoCheng T. HorngWitold KulaChyu Jiuh Torng
    • H01L43/10H01L27/22
    • H01L43/10G11C11/161H01L27/222H01L43/00H01L43/02H01L43/08
    • A MTJ in an MRAM array is disclosed with a composite free layer having a lower crystalline layer contacting a tunnel barrier and an upper amorphous NiFeX layer for improved bit switching performance. The crystalline layer is Fe, Ni, or FEB with a thickness of at least 6 Angstroms which affords a high magnetoresistive ratio. The X element in the NiFeX layer is Mg, Hf, Zr, Nb, or Ta with a content of 5 to 30 atomic % NiFeX thickness is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. In an alternative embodiments, the crystalline layer may be a Fe/NiFe bilayer. Optionally, the amorphous layer may have a NiFeM1/NiFeM2 configuration where M1 and M2 are Mg, Hf, Zr, Nb, or Ta, and M1 is unequal to M2. Annealing at 300° C. to 360° C. provides a high magnetoresistive ratio of about 150%.
    • 公开了具有接触隧道势垒的较低结晶层和上部非晶NiFeX层的复合自由层的MRAM阵列中的MTJ,用于改善位切换性能。 结晶层是厚度至少为6埃的Fe,Ni或FEB,其具有高的磁阻比。 NiFeX层中的X元素为含有5〜30原子%NiFeX厚度的Mg,Hf,Zr,Nb或Ta优选为20〜40埃,以显着降低位线切换电流和短路位数。 在替代实施例中,结晶层可以是Fe / NiFe双层。 可选地,非晶层可以具有其中M1和M2是Mg,Hf,Zr,Nb或Ta的NiFeM1 / NiFeM2构型,M1不等于M2。 在300℃至360℃退火,提供约150%的高磁阻比。