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    • 2. 发明授权
    • Structure and method to fabricate high performance MTJ devices for MRAM applications
    • 制造用于MRAM应用的高性能MTJ器件的结构和方法
    • US07211447B2
    • 2007-05-01
    • US11080868
    • 2005-03-15
    • Cheng T. HorngRu-Ying TongMao-Min ChenLiubo HongMin Li
    • Cheng T. HorngRu-Ying TongMao-Min ChenLiubo HongMin Li
    • H01L21/00
    • H01L43/12
    • A method of forming a high performance MTJ in an MRAM array is disclosed. A Ta/Ru capping layer in a bottom conductor is sputter etched to remove the Ru layer and form an amorphous Ta capping layer. A key feature is a subsequent surface treatment of the Ta capping layer in a transient vacuum chamber where a self-annealing occurs and a surfactant layer is formed on the Ta surface. The resulting smooth and flat Ta surface promotes a smooth and flat surface in the MTJ layers which are subsequently formed on the surfactant layer. For a 0.3×0.6 micron MTJ bit size, a 35 to 40 Angstrom thick NiFe(18%) free layer, an AlOx barrier layer generated from a ROX oxidation of an 9 to 10 Angstrom thick Al layer, and a Ru/Ta/Ru capping layer are employed to give a dR/R of >40% and an RA of about 4000 ohm-μm2.
    • 公开了一种在MRAM阵列中形成高性能MTJ的方法。 溅射蚀刻底部导体中的Ta / Ru覆盖层以去除Ru层并形成无定形Ta覆盖层。 一个关键的特征是在瞬态真空室中Ta覆盖层的后续表面处理,其中发生自退火并且在Ta表面上形成表面活性剂层。 所得到的平滑且平坦的Ta表面促进在表面活性剂层上随后形成的MTJ层中的光滑和平坦的表面。 对于0.3×0.6微米的MTJ位尺寸,35至40埃厚的NiFe(18%)自由层,由9至10埃厚的Al层的ROX氧化产生的AlO x势垒层,以及Ru / Ta / 使用Ru覆盖层来产生大于40%的dR / R和约4000欧姆 - 姆2的RA。