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    • 1. 发明授权
    • High temperature isostatic pressure bonding of beryllium pressure vessels with an interior void
    • 具有内部空隙的铍压力容器的高温等压压接
    • US06264095B1
    • 2001-07-24
    • US09350349
    • 1999-07-14
    • Charles J. StoufferPatrick BourkeJames M. MarderLawrence H. Ryczek
    • Charles J. StoufferPatrick BourkeJames M. MarderLawrence H. Ryczek
    • B23K2000
    • B23K20/233B23K20/002B23K20/021
    • A process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to selective portions of the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing at a temperature of about 1700° F. to 1750° F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the parts. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. Strength of the bond is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.
    • 将金属部件彼此粘合以形成无缝的中空金属制品,特别是由铍制成的方法。 在热压之前,将模具组装到部件上,以将压力施加到部件的选择性部分。 然后将与工具组装在一起的部件在约1700°F至1750°F的温度和约2000psi至2500psi的压力下进行约3小时的热等静压。 围绕金属部件的工具用于限制部件的压缩量。 通过该方法形成的物品在空间飞行应用中特别有用,因为它们由均匀的材料形成。 由于不使用填料金属,粘结强度提高。 不存在填充金属也消除了由于热膨胀系数差异导致的任何热应力问题。