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1. 发明申请

US20130128610A1 PLANE LIGHT SOURCE AND FLEXIBLE PLANE LIGHT SOURCE 有权
标题翻译：平面光源和柔性平面光源
公开(公告)号：US20130128610A1
公开(公告)日：2013-05-23
申请号：US13590202
申请日：2012-08-21
申请人： Chao-Kai Hsu , Yu-Hua Chen , Wei-Chung Lo
发明人： Chao-Kai Hsu , Yu-Hua Chen , Wei-Chung Lo
IPC分类号： F21V13/02 , F21V8/00
CPC分类号： F21V5/002 , F21S2/00 , F21V13/04 , F21Y2105/00 , F21Y2115/10 , G02B6/0021 , G02B6/0036 , G02B6/0061 , G02B6/0068 , G02B6/0073 , G02B6/0078 , G02B6/0083 , G02B6/009
摘要： A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.
摘要翻译：提供了包括电路基板，多组侧视发光装置（LED）和漫射光导层的平面光源。侧视LED被布置在电路基板上并且与电路基板电连接。漫射光导层覆盖侧视LED，其中漫射光导层包括排列成阵列并彼此连接的多个漫射导光单元。每个漫射光导单元分别对应于一组侧视LED的照明覆盖。每组侧视LED至少包括两个侧视LED，用于分别沿着两个不同方向发射光并朝向一个单个漫射光导单元。

2. 发明授权

US08915634B2 Plane light source and flexible plane light source 有权
标题翻译：平面光源和柔性平面光源
公开(公告)号：US08915634B2
公开(公告)日：2014-12-23
申请号：US13590202
申请日：2012-08-21
申请人： Chao-Kai Hsu , Yu-Hua Chen , Wei-Chung Lo
发明人： Chao-Kai Hsu , Yu-Hua Chen , Wei-Chung Lo
IPC分类号： F21V7/04 , F21V13/04 , F21S2/00 , F21V5/00 , F21Y105/00 , F21Y101/02
CPC分类号： F21V5/002 , F21S2/00 , F21V13/04 , F21Y2105/00 , F21Y2115/10 , G02B6/0021 , G02B6/0036 , G02B6/0061 , G02B6/0068 , G02B6/0073 , G02B6/0078 , G02B6/0083 , G02B6/009
摘要： A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.
摘要翻译：提供了包括电路基板，多组侧视发光装置（LED）和漫射光导层的平面光源。侧视LED被布置在电路基板上并且与电路基板电连接。漫射光导层覆盖侧视LED，其中漫射光导层包括排列成阵列并彼此连接的多个漫射导光单元。每个漫射光导单元分别对应于一组侧视LED的照明覆盖。每组侧视LED至少包括两个侧视LED，用于分别沿着两个不同方向发射光并朝向一个单个漫射光导单元。

3. 发明授权

US07763895B2 Flexible light source device and fabrication method thereof 有权
标题翻译：柔性光源装置及其制造方法
公开(公告)号：US07763895B2
公开(公告)日：2010-07-27
申请号：US12422291
申请日：2009-04-13
申请人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
发明人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
IPC分类号： H01L29/267
CPC分类号： H05K3/32 , H01L33/62 , H01L2924/0002 , H05K1/0203 , H05K1/0274 , H05K1/189 , H05K3/284 , H05K2201/09481 , H05K2201/0969 , H05K2201/10106 , H05K2201/2054 , H05K2203/1316 , H05K2203/1469 , H01L2924/00
摘要： A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
摘要翻译：提供了包括基板，发光装置，模塑料，电介质层和金属线的柔性光源装置。基板具有第一表面，与第一表面相对的第二表面和第一开口。发光装置设置在基板的第一表面上并覆盖第一开口。模塑料位于第一表面上方并覆盖发光器件。电介质层设置在第二表面上并且覆盖第一开口的侧壁。介电层具有暴露部分发光器件的第二开口。金属线设置在电介质层上，其中金属线通过电介质层中的第二开口与发光器件电连接。另外，还提供了柔性光源装置的制造方法。

4. 发明申请

US20090116244A1 LIGHT-EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20090116244A1
公开(公告)日：2009-05-07
申请号：US12046419
申请日：2008-03-11
申请人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
发明人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
IPC分类号： F21V7/00
CPC分类号： H05K1/0274 , F21K9/68 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H05K2201/10106 , H05K2201/2054
摘要： A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.
摘要翻译：发光模块包括具有第一表面和第二表面的衬底，设置在衬底的第一表面上的至少一个发光器件，以及设置在衬底的第一表面上并围绕光的光反射层用于接收从发光装置发射的一部分光并反射该光的部分的发光装置。基底可以是刚性的或柔性的。

5. 发明授权

US08777437B2 Light-emitting module 有权
标题翻译：发光模块
公开(公告)号：US08777437B2
公开(公告)日：2014-07-15
申请号：US12046419
申请日：2008-03-11
申请人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
发明人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
IPC分类号： G09F13/04
CPC分类号： H05K1/0274 , F21K9/68 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H05K2201/10106 , H05K2201/2054
摘要： A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.
摘要翻译：发光模块包括具有第一表面和第二表面的衬底，设置在衬底的第一表面上的至少一个发光器件，以及设置在衬底的第一表面上并围绕光的光反射层用于接收从发光装置发射的一部分光并反射该光的部分的发光装置。基底可以是刚性的或柔性的。

6. 发明申请

US20100163897A1 FLEXIBLE LIGHT SOURCE DEVICE AND FABRICATION METHOD THEREOF 有权
标题翻译：柔性光源装置及其制造方法
公开(公告)号：US20100163897A1
公开(公告)日：2010-07-01
申请号：US12422291
申请日：2009-04-13
申请人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
发明人： Zhi-Cheng Hsiao , Chao-Kai Hsu , Yu-Hua Chen
IPC分类号： H01L33/00
CPC分类号： H05K3/32 , H01L33/62 , H01L2924/0002 , H05K1/0203 , H05K1/0274 , H05K1/189 , H05K3/284 , H05K2201/09481 , H05K2201/0969 , H05K2201/10106 , H05K2201/2054 , H05K2203/1316 , H05K2203/1469 , H01L2924/00
摘要： A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
摘要翻译：提供了包括基板，发光装置，模塑料，电介质层和金属线的柔性光源装置。基板具有第一表面，与第一表面相对的第二表面和第一开口。发光装置设置在基板的第一表面上并覆盖第一开口。模塑料位于第一表面上方并覆盖发光器件。电介质层设置在第二表面上并且覆盖第一开口的侧壁。介电层具有暴露部分发光器件的第二开口。金属线设置在电介质层上，其中金属线通过电介质层中的第二开口与发光器件电连接。另外，还提供了柔性光源装置的制造方法。

7. 发明申请

US20090152741A1 CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF 审中-公开
标题翻译：其芯片结构及其制造工艺及其片式包装结构及其制造工艺
公开(公告)号：US20090152741A1
公开(公告)日：2009-06-18
申请号：US12192138
申请日：2008-08-15
申请人： Tao-Chih Chang , Chao-Kai Hsu
发明人： Tao-Chih Chang , Chao-Kai Hsu
IPC分类号： H01L21/768 , H01L23/488
CPC分类号： H01L25/0657 , G02B6/4214 , H01L21/563 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/49811 , H01L24/02 , H01L24/12 , H01L24/16 , H01L24/83 , H01L24/90 , H01L25/50 , H01L2224/0401 , H01L2224/13009 , H01L2224/13021 , H01L2224/13099 , H01L2224/16147 , H01L2224/16225 , H01L2224/16237 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81141 , H01L2224/81191 , H01L2224/83191 , H01L2224/83194 , H01L2224/83365 , H01L2224/83385 , H01L2224/8383 , H01L2224/83851 , H01L2224/83856 , H01L2225/06513 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
摘要： A chip structure including a chip, a first dielectric layer and at least one first conductive layer is provided. The chip has an active surface, a backside and at least one bonding pad disposed on the active surface. The first dielectric layer is disposed on the active surface and has at least one first opening, wherein the first opening correspondingly exposes the bonding pad. The first conductive layer covers an inner wall of the first opening and the bonding pad so as to form a concave structure in the first opening. When the chip structure is bonded to a substrate, the solder bump of the substrate is inlaid into the concave structure of the chip. Moreover, a fabrication process of the chip structure, a flip chip package structure and a fabrication process thereof, a package structure of a light emitting/receiving device and a chip stacked structure are also provided.
摘要翻译：提供了包括芯片，第一介电层和至少一个第一导电层的芯片结构。芯片具有活性表面，背面以及设置在活性表面上的至少一个粘结垫。第一电介质层设置在有源表面上并且具有至少一个第一开口，其中第一开口相应地暴露接合焊盘。第一导电层覆盖第一开口的内壁和接合焊盘，以便在第一开口中形成凹形结构。当芯片结构结合到基板上时，衬底的焊料凸块镶嵌在芯片的凹形结构中。此外，还提供了芯片结构的制造工艺，倒装芯片封装结构及其制造工艺，发光/接收装置的封装结构和芯片堆叠结构。

8. 发明授权

US08636381B2 Flexible light source module 有权
标题翻译：柔性光源模块
公开(公告)号：US08636381B2
公开(公告)日：2014-01-28
申请号：US12981495
申请日：2010-12-30
申请人： Chen-Yang Huang , Tsai-Lin Tai , Chao-Kai Hsu
发明人： Chen-Yang Huang , Tsai-Lin Tai , Chao-Kai Hsu
IPC分类号： F21S4/00
CPC分类号： F21V5/002 , F21Y2107/10 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/49107 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： A flexible light source module including a flexible substrate, a flexible light guide film and a plurality of point light sources is provided. The flexible light guide film including light-guiding portions is disposed on the point light sources. Each of the light-guiding portions includes a light incident surface and a light emitting surface. The light incident surface includes light incident sub-surfaces. The light emitting surface includes light emitting sub-surfaces, and the one closest to the geometric center of the light-guiding portion is a first light emitting sub-surface. The absolute values of the tangent slopes of the first light emitting sub-surface are ascending with approaching the geometric center of the light-guiding portion. The light beams emitted from the point light sources exit out of the flexible light source module via the flexible light guide film so that the flexible light source module provides a uniform planar light source.
摘要翻译：提供了包括柔性基板，柔性导光膜和多个点光源的柔性光源模块。包括导光部分的柔性导光膜设置在点光源上。每个导光部分包括光入射表面和发光表面。光入射面包括光入射的子表面。光发射表面包括发光子表面，并且最靠近导光部分的几何中心的发光表面是第一发光子表面。第一发光子表面的切线斜率的绝对值随着靠近导光部的几何中心而上升。从点光源发射的光束经由柔性导光膜离开柔性光源模块，使得柔性光源模块提供均匀的平面光源。

9. 发明授权

US07626208B2 Bendable solid state planar light source structure 有权
标题翻译：可弯曲固态平面光源结构
公开(公告)号：US07626208B2
公开(公告)日：2009-12-01
申请号：US11309200
申请日：2006-07-13
申请人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
发明人： Chien-Cheng Yang , Chao-Kai Hsu , Jing-Yao Chang
IPC分类号： H01L33/00
CPC分类号： H05K1/0203 , F21K9/00 , F21V33/0008 , F21Y2105/10 , F21Y2115/10 , H01L2924/0002 , H05K1/189 , H05K2201/09318 , H05K2201/09481 , H05K2201/10106 , H05K2201/10553 , H05K2203/049 , H01L2924/00
摘要： A bendable LED planar light source structure, a flexible substrate therefore, and a manufacturing method thereof are provided. The flexible substrate has metal layers on both sides, where the metal layer on one side has a circuit layout, and the metal layer on the other side has a pattern structure or a whole metal coating with reflecting and scattering characteristics. Meanwhile, bonding pads are provided on the same side or opposite side as the metal layer with the circuit layout, and an array of LED dies is bonded with the bonding pads through wire bonding or flip chip bonding, such that the LED dies are conducted with current through the circuit layout on the flexible substrate, so as to form a planar light source.
摘要翻译：提供了一种可弯曲的LED平面光源结构，因此可挠性基板及其制造方法。柔性基板的两侧具有金属层，其一侧的金属层具有电路布局，另一侧的金属层具有具有反射和散射特性的图案结构或整体金属涂层。同时，在具有电路布局的金属层的相同侧或相对侧上设置接合焊盘，并且通过引线接合或倒装芯片接合将LED管芯阵列与接合焊盘接合，使得LED管芯与电流通过柔性基板上的电路布局，以形成平面光源。

10. 发明申请

US20120140464A1 FLEXIBLE LIGHT SOURCE MODULE 有权
标题翻译：柔性光源模块
公开(公告)号：US20120140464A1
公开(公告)日：2012-06-07
申请号：US12981495
申请日：2010-12-30
申请人： Chen-Yang Huang , Tsai-Lin Tai , Chao-Kai Hsu
发明人： Chen-Yang Huang , Tsai-Lin Tai , Chao-Kai Hsu
IPC分类号： F21V11/00
CPC分类号： F21V5/002 , F21Y2107/10 , F21Y2115/10 , H01L25/0753 , H01L33/58 , H01L2224/48091 , H01L2224/49107 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： A flexible light source module including a flexible substrate, a flexible light guide film and a plurality of point light sources is provided. The flexible light guide film including light-guiding portions is disposed on the point light sources. Each of the light-guiding portions includes a light incident surface and a light emitting surface. The light incident surface includes light incident sub-surfaces. The light emitting surface includes light emitting sub-surfaces, and the one closest to the geometric center of the light-guiding portion is a first light emitting sub-surface. The absolute values of the tangent slopes of the first light emitting sub-surface are ascending with approaching the geometric center of the light-guiding portion. The light beams emitted from the point light sources exit out of the flexible light source module via the flexible light guide film so that the flexible light source module provides a uniform planar light source.
摘要翻译：提供了包括柔性基板，柔性导光膜和多个点光源的柔性光源模块。包括导光部分的柔性导光膜设置在点光源上。每个导光部分包括光入射表面和发光表面。光入射面包括光入射的子表面。光发射表面包括发光子表面，并且最靠近导光部分的几何中心的发光表面是第一发光子表面。第一发光子表面的切线斜率的绝对值随着靠近导光部的几何中心而上升。从点光源发射的光束经由柔性导光膜离开柔性光源模块，使得柔性光源模块提供均匀的平面光源。

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