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1. 发明授权

US09142534B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US09142534B2
公开(公告)日：2015-09-22
申请号：US13148544
申请日：2009-10-13
申请人： Chao-Hsing Chen , Schang-Jing Hon , Alexander Chan Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
发明人： Chao-Hsing Chen , Schang-Jing Hon , Alexander Chan Wang , Li-Tian Liang , Chin-Yung Fan , Chien-Kai Chung , Min-Hsun Hsieh
IPC分类号： H01L27/15 , H01L27/02 , H01L25/065 , H01L25/075 , H01L27/32 , H01L33/62
CPC分类号： H01L27/15 , H01L25/0753 , H01L27/153 , H01L27/156 , H01L27/3211 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/12032 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.
摘要翻译：提供了能够直接连接到包括至少一个电子元件的替代电流源的发光器件; 至少一个发光二极管阵列芯片; 至少一个接合焊盘，导电迹线和用于支撑电子元件的基座，发光二极管阵列芯片，接合焊盘和导电迹线。导电迹线电连接到电子元件，发光二极管阵列芯片和接合焊盘。

2. 发明授权

US09000457B2 Multi-dimensional light-emitting device 有权
标题翻译：多维发光装置
公开(公告)号：US09000457B2
公开(公告)日：2015-04-07
申请号：US13186218
申请日：2011-07-19
申请人： Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
发明人： Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
IPC分类号： H01L29/20 , F21K99/00 , F21Y101/02 , F21Y105/00 , F21Y113/00 , H01L25/075 , H01L33/50
CPC分类号： H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L33/50 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要： The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.
摘要翻译：本申请提供了电连接到电源系统的多维发光装置。多维发光装置包括基板，蓝色发光二极管阵列和一个或多个荧光体层。设置在基板上的蓝色发光二极管阵列包括电连接的多个蓝色发光二极管芯片。多维发光装置包括围绕中心区域布置的中心区域和多个周边区域。磷光体层覆盖中心区域。当电源系统提供高电压时，多维发光装置的中心区域和外围区域分别提供第一光和多个第二光。第一个光和第二个光被混合成混合光。

3. 发明申请

US20120012867A1 MULTI-DIMENSIONAL LIGHT-EMITTING DEVICE 有权
标题翻译：多维发光器件
公开(公告)号：US20120012867A1
公开(公告)日：2012-01-19
申请号：US13186218
申请日：2011-07-19
申请人： Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
发明人： Chien-Fu Shen , Schang-Jing Hon , Tsun-Kai Ko , Alexander Chan Wang , Min-Hsun Hsieh , Cheng Nan Han
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L33/50 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48137 , H01L2924/0002 , H01L2924/00014 , H01L2924/00
摘要： The present application provides a multi-dimensional light-emitting device electrically connected to a power supply system. The multi-dimensional light-emitting device comprises a substrate, a blue light-emitting diode array and one or more phosphor layers. The blue light-emitting diode array, disposed on the substrate, comprises a plurality of blue light-emitting diode chips which are electrically connected. The multi-dimensional light-emitting device comprises a central area and a plurality of peripheral areas, which are arranged around the central area. The phosphor layer covers the central area. When the power supply system provides a high voltage, the central area and the peripheral areas of the multi-dimensional light-emitting device provide a first light and a plurality of second lights, respectively. The first light and the second lights are blended into a mixed light.
摘要翻译：本申请提供了电连接到电源系统的多维发光装置。多维发光装置包括基板，蓝色发光二极管阵列和一个或多个荧光体层。设置在基板上的蓝色发光二极管阵列包括电连接的多个蓝色发光二极管芯片。多维发光装置包括围绕中心区域布置的中心区域和多个周边区域。磷光体层覆盖中心区域。当电源系统提供高电压时，多维发光装置的中心区域和外围区域分别提供第一光和多个第二光。第一个光和第二个光被混合成混合光。

4. 发明申请

US20110157884A1 OPTOELECTRONIC DEVICE 审中-公开
标题翻译：光电器件
公开(公告)号：US20110157884A1
公开(公告)日：2011-06-30
申请号：US12981788
申请日：2010-12-30
申请人： Chao-Hsing Chen , Alexander Chan Wang , Chia-Ling Hsu
发明人： Chao-Hsing Chen , Alexander Chan Wang , Chia-Ling Hsu
IPC分类号： F21V9/00 , F21S4/00
CPC分类号： H05B33/0821 , H01L24/04 , H01L24/48 , H01L25/0753 , H01L27/15 , H01L33/0066 , H01L33/0079 , H01L33/62 , H01L2224/04042 , H01L2224/48139 , H01L2224/48157 , H01L2224/48465 , H01L2224/4848 , H01L2924/00014 , H01L2224/45099
摘要： A light-emitting device includes an insulating carrier; a light-emitting array formed on the insulating carrier including a first light-emitting circuit having a first light-emitting unit, wherein the first light-emitting circuit is a one-way circuit, a second light-emitting circuit having a second light-emitting unit, wherein the second light-emitting circuit is a one-way circuit, a first conductive layer, a second conductive layer, and a third conductive layer, wherein the first light-emitting circuit is formed between the first conductive layer and the second conductive layer and connects with them electrically, the second light-emitting circuit is formed between the second conductive layer and the third conductive layer and connects with them electrically, wherein an area of the second conductive layer is greater or equal to 1.9×103 μm2.
摘要翻译：发光装置包括绝缘载体; 形成在绝缘载体上的发光阵列，包括具有第一发光单元的第一发光电路，其中所述第一发光电路是单向电路，第二发光电路具有第二发光单元，发光单元，其中第二发光电路是单向电路，第一导电层，第二导电层和第三导电层，其中第一发光电路形成在第一导电层和第二导电层之间导电层并与它们电连接，第二发光电路形成在第二导电层和第三导电层之间并与它们电连接，其中第二导电层的面积大于或等于1.9×10 3μm2。

5. 发明申请

US20080205201A1 Time display apparatus 审中-公开
标题翻译：时间显示装置
公开(公告)号：US20080205201A1
公开(公告)日：2008-08-28
申请号：US12149056
申请日：2008-04-25
申请人： Hwa Su , Alexander Chan Wang
发明人： Hwa Su , Alexander Chan Wang
IPC分类号： G04B19/32
CPC分类号： G04B19/305 , G04B19/32 , G04C17/00
摘要： A time display apparatus is disclosed and comprises at least a housing, a timetable panel, three pointers and a backlight unit. The timetable panel is disposed in the housing. The three pointers are coated with variety of phosphorescence materials respectively and vertically arranged on the timetable panel in order. The backlight unit is disposed below the timetable panel to generate a light source with a fixed wavelength to illuminate the phosphorescence materials of the three pointers, thereby generating different colors for showing hour, minute and second respectively.
摘要翻译：公开了一种时间显示装置，并且至少包括壳体，时刻表面板，三个指针和背光单元。时间表面板设置在外壳中。三个指针分别涂覆有各种磷光材料，并按顺序布置在时间表面板上。背光单元设置在时间表面下方，以产生具有固定波长的光源，以照亮三个指针的磷光材料，从而分别产生用于显示小时，分钟和秒的不同颜色。

6. 外观设计

USD631019S1 Light emitting diode packaging array 有权
标题翻译：发光二极管封装阵列
公开(公告)号：USD631019S1
公开(公告)日：2011-01-18
申请号：US29360157
申请日：2010-04-21
申请人： Alexander Chan Wang , Chia-Liang Hsu , Pang-Yen Liu
设计人： Alexander Chan Wang , Chia-Liang Hsu , Pang-Yen Liu

7. 发明申请

US20080151562A1 Fabrication structure for light emitting diode component 审中-公开
标题翻译：发光二极管组件的制造结构
公开(公告)号：US20080151562A1
公开(公告)日：2008-06-26
申请号：US12073579
申请日：2008-03-07
申请人： Hwa Su , Alexander Chan Wang
发明人： Hwa Su , Alexander Chan Wang
IPC分类号： F21V21/00
CPC分类号： H01L25/0753 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , H01L33/60 , H01L33/64 , H01L2224/48091 , H01L2224/49107 , H01L2924/09701 , H01L2924/00014
摘要： The fabrication structure for light emitting diode component is disclosed. The fabrication structure of the present invention includes a substrate, a plurality of cavities, a plurality of selection units, a first and a second directional predetermined cut. The plurality of cavities are arranged and disposed on the substrate to form an M rows×N columns matrix array. M and N are respectively a positive integer. Each selection unit corresponds to each cavity. The first directional predetermined cut is disposed between the rows, and the second directional predetermined cut is disposed between the columns. The first directional predetermined cut and the second directional predetermined cut are utilized to divide the substrate according to the plurality of selection units to obtain a X rows×Y columns area from the M rows×N columns matrix array. The fabrication structure of the present invention has high density and can be flexibly expanded upon demands
摘要翻译：公开了发光二极管部件的制造结构。本发明的制造结构包括基板，多个空腔，多个选择单元，第一和第二定向预定切口。多个空腔被布置和设置在基板上以形成M行×N列矩阵阵列。 M和N分别为正整数。每个选择单元对应于每个空腔。第一定向预定切口设置在行之间，并且第二定向预定切口设置在列之间。使用第一定向预定切割和第二定向预定切割来根据多个选择单元划分基板，以从M行x列列矩阵阵列获得X行xY列区域。本发明的制造结构具有高密度，并且可以根据需要灵活扩展

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