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1. 发明授权

US07326964B2 Light emitting diode package with protective function against electrostatic discharge 失效
标题翻译：具有防静电放电功能的发光二极管封装
公开(公告)号：US07326964B2
公开(公告)日：2008-02-05
申请号：US11312365
申请日：2005-12-21
申请人： Chang Hyun Lim , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Sang Hyun Choi
发明人： Chang Hyun Lim , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Sang Hyun Choi
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00 , H02H3/20 , H02H9/04 , H02H3/00 , H02H7/00 , H02H9/02
CPC分类号： H01L33/62 , H01L24/17 , H01L25/167 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
摘要翻译：一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由静电放电引起的过大电流的影响。 LED封装包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案，导电板通过施加高于预定电压电压的静电力与第一导电板接触。

2. 发明授权

US07262440B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US07262440B2
公开(公告)日：2007-08-28
申请号：US11320968
申请日：2005-12-30
申请人： Sang Hyun Choi , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Chang Hyun Lim
发明人： Sang Hyun Choi , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Chang Hyun Lim
IPC分类号： H01L29/22 , H01L23/498 , H01L21/00
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

3. 发明授权

US08310023B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08310023B2
公开(公告)日：2012-11-13
申请号：US12360444
申请日：2009-01-27
申请人： Ho Joon Park , Woong Lin Hwang , Seog Moon Choi , Sung Jun Lee , Sang Hyun Choi , Chang Hyun Lim
发明人： Ho Joon Park , Woong Lin Hwang , Seog Moon Choi , Sung Jun Lee , Sang Hyun Choi , Chang Hyun Lim
IPC分类号： H01L23/52
CPC分类号： H01L33/641 , H01L33/46 , H01L2224/16225 , H01L2224/97
摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种LED封装及其制造方法。本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

4. 发明授权

US07816156B2 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US07816156B2
公开(公告)日：2010-10-19
申请号：US11882167
申请日：2007-07-31
申请人： Sang Hyun Choi , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Chang Hyun Lim
发明人： Sang Hyun Choi , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sung Jun Lee , Chang Hyun Lim
IPC分类号： H01L29/22 , H01L23/498
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

5. 发明授权

US07649208B2 Light emitting diode package including monitoring photodiode 有权
标题翻译：发光二极管封装包括监控光电二极管
公开(公告)号：US07649208B2
公开(公告)日：2010-01-19
申请号：US11313508
申请日：2005-12-21
申请人： Sung Jun Lee , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sang Hyun Choi , Chang Hyun Lim
发明人： Sung Jun Lee , Woong Lin Hwang , Seog Moon Choi , Ho Joon Park , Sang Hyun Choi , Chang Hyun Lim
IPC分类号： H01L27/15
CPC分类号： H01L31/147 , H01L25/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014
摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.
摘要翻译：本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

6. 发明授权

US07582496B2 LED package using Si substrate and fabricating method thereof 失效
标题翻译：使用Si衬底的LED封装及其制造方法
公开(公告)号：US07582496B2
公开(公告)日：2009-09-01
申请号：US11312412
申请日：2005-12-21
申请人： Sung Jun Lee , Woong Lin Hwang , Sang Hyun Choi , Chang Hyun Lim , Ho Joon Park , Seog Moon Choi
发明人： Sung Jun Lee , Woong Lin Hwang , Sang Hyun Choi , Chang Hyun Lim , Ho Joon Park , Seog Moon Choi
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.
摘要翻译：提供了使用Si衬底的LED封装和LED封装的制造方法。在LED封装中，支撑结构包括Si衬底和形成在Si衬底的顶表面和底表面上的绝缘层，并且支撑结构通过部分去除Si衬底和绝缘层而在底表面中限定至少一个凹槽。多个上电极形成在支撑结构的顶表面上。至少一个LED安装在支撑结构的顶表面上，并且LED包括电连接到上电极的两个端子。金属填料填充在支撑结构的底面中限定的槽中。

7. 发明申请

US20130154966A1 TOUCH PANEL 审中-公开
标题翻译：触控面板
公开(公告)号：US20130154966A1
公开(公告)日：2013-06-20
申请号：US13591975
申请日：2012-08-22
申请人： Youn Soo Kim , Sang Hwan Oh , Ho Joon Park , Hyun Jun Kim
发明人： Youn Soo Kim , Sang Hwan Oh , Ho Joon Park , Hyun Jun Kim
IPC分类号： G06F3/041
CPC分类号： G06F3/044
摘要： Disclosed herein is a touch panel in which an upper transparent substrate and a lower transparent substrate are adhered to each other such that an upper detecting electrode that is formed on surfaces of convex portions of the upper transparent substrate crosses a lower detecting electrode that is formed in one direction in which concave portions and the convex portions of the lower transparent substrate are formed, and the surfaces of the convex portions on which the upper detecting electrode is formed and the surfaces of the concave portions on which the lower detecting electrode is formed face each other. Thus, a distribution of an electric field is concentrated on a sensing electrode, thereby improving the sensitivity of the touch panel, compared to a general electrode structure.
摘要翻译：这里公开了一种触摸面板，其中上透明基板和下透明基板彼此粘合，使得形成在上透明基板的凸部表面上的上检测电极与形成在下透明基板的下检测电极相交叉形成下部透明基板的凹部和凸部的一个方向，形成上部检测电极的凸部的表面和形成有下部检测电极的凹部的表面各自其他。因此，与一般的电极结构相比，电场的分布集中在感测电极上，从而提高触摸面板的灵敏度。

8. 发明申请

US20130088545A1 INKJET PRINT HEAD ASSEMBLY 审中-公开
标题翻译：喷墨打印头组件
公开(公告)号：US20130088545A1
公开(公告)日：2013-04-11
申请号：US13613671
申请日：2012-09-13
申请人： Jae Chan PARK , Seung Mo Lim , Ho Joon Park , Seung Joo Shin
发明人： Jae Chan PARK , Seung Mo Lim , Ho Joon Park , Seung Joo Shin
IPC分类号： B41J2/135
CPC分类号： B41J2/14233
摘要： There is provided an inkjet print head assembly. The inkjet print head assembly includes an inkjet print head, and a first coating layer formed on the inkjet print head, and absorbing and radiating heat generated in the inkjet print head.
摘要翻译：提供了一种喷墨打印头组件。喷墨打印头组件包括喷墨打印头和形成在喷墨打印头上的第一涂层，以及吸收和辐射在喷墨打印头中产生的热。

9. 发明申请

US20130055558A1 METHOD FOR MANUFACTURING TOUCH PANEL 审中-公开
标题翻译：制造触控面板的方法
公开(公告)号：US20130055558A1
公开(公告)日：2013-03-07
申请号：US13425765
申请日：2012-03-21
申请人： Youn Soo Kim , Hyun Jun Kim , Ji Soo Lee , Ho Joon Park , Sang Hwan Oh
发明人： Youn Soo Kim , Hyun Jun Kim , Ji Soo Lee , Ho Joon Park , Sang Hwan Oh
IPC分类号： H01H11/00
CPC分类号： G06F3/041 , G06F2203/04103 , Y10T29/49105
摘要： Disclosed herein is a method for manufacturing a touch panel including: (A) applying a spinning solution including metal, a metal oxide, a conductive polymer, carbon nanotubes (CNTs), graphene, or any combination thereof to one surface of a transparent substrate through an electro spinning process to form an electrode layer; and (B) patterning the electrode layer by a laser to form a sensing electrode. Since sensing electrodes are formed through an electro spinning process without using high-priced equipment, the overall manufacturing costs of the touch panel can be reduced.
摘要翻译：本发明公开了一种触摸面板的制造方法，其特征在于，包括：（A）将包含金属，金属氧化物，导电性聚合物，碳纳米管（CNT），石墨烯或其任何组合的纺丝溶液施加到透明基板的一个表面，通过电纺丝工艺形成电极层; 和（B）通过激光来形成电极层以形成感测电极。由于感应电极通过电纺工艺形成，而不使用高价格的设备，因此可以降低触摸面板的整体制造成本。

10. 发明申请

US20130050103A1 DISPLAY DEVICE INCLUDING TOUCH PANEL 审中-公开
标题翻译：显示设备，包括触摸面板
公开(公告)号：US20130050103A1
公开(公告)日：2013-02-28
申请号：US13312763
申请日：2011-12-06
申请人： Ha Yoon Song , Young Jae Kim , Ho Joon Park
发明人： Ha Yoon Song , Young Jae Kim , Ho Joon Park
IPC分类号： G06F3/041
CPC分类号： G06F3/041 , G06F2203/04103
摘要： Disclosed herein is a display device including a touch panel, including: a touch panel having a transparent substrate and a sensing electrode formed on the transparent substrate; and a display unit combined with one surface of the touch panel, wherein the touch panel and the display unit are attached to each other by a UV resin layer. According to the present invention, conductive balls are contained in the UV resin layer, whereby noise that may be generated from the display unit can be shielded.
摘要翻译：本文公开了一种包括触摸面板的显示装置，包括：具有透明基板的触摸面板和形成在透明基板上的感测电极; 以及与所述触摸面板的一个表面组合的显示单元，其中所述触摸面板和所述显示单元通过UV树脂层彼此附接。根据本发明，UV树脂层中包含导电球，从而可以屏蔽可能从显示单元产生的噪声。

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