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    • 8. 发明授权
    • Electrical fuse with a thinned fuselink middle portion
    • 电熔丝带有细长的中间部分
    • US07550323B2
    • 2009-06-23
    • US11835800
    • 2007-08-08
    • Dureseti ChidambarraoWilliam K. HensonDeok-kee KimChandrasekharan Kothandaraman
    • Dureseti ChidambarraoWilliam K. HensonDeok-kee KimChandrasekharan Kothandaraman
    • H01L21/82
    • H01L23/5256H01L2924/0002H01L2924/00
    • A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal layer may be patterned so that a middle portion of the fuselink semiconductor portion has a thin metal layer, which upon annealing produces a thinner metal semiconductor alloy portion than surrounding metal semiconductor alloy portion on the fuselink semiconductor portion. Alternatively, a middle portion of the metal semiconductor alloy having a uniform thickness throughout the fuselink may be lithographically patterned and etched to form a thin metal semiconductor alloy portion in the middle of the fuselink, while thick metal semiconductor alloy portions are formed on the end portions of the fuselink. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink to enhance the divergence of electrical current.
    • 在包含阴极半导体部分,熔丝半导体部分和阳极半导体部分的图案化的半导体材料层上沉积金属层。 可以对金属层进行图案化,使得熔融半导体部分的中间部分具有薄金属层,其在退火时产生比在熔融半导体部分上的周围金属半导体合金部分更薄的金属半导体合金部分。 或者,在整个整体中具有均匀厚度的金属半导体合金的中间部分可以被光刻图案化和蚀刻,以在熔丝中间形成薄金属半导体合金部分,同时在端部形成厚金属半导体合金部分 的fuselink。 所产生的本发明的电熔丝具有界面,在该界面上,较薄的金属半导体合金与所述富熔体中较厚的金属半导体合金相接触以增强电流的发散。
    • 9. 发明申请
    • ELECTRICAL FUSE WITH A THINNED FUSELINK MIDDLE PORTION
    • 带有薄型熔断器中间部分的电气保险丝
    • US20090042341A1
    • 2009-02-12
    • US11835800
    • 2007-08-08
    • Dureseti ChidambarraoWilliam K. HensonDeok-kee KimChandrasekharan Kothandaraman
    • Dureseti ChidambarraoWilliam K. HensonDeok-kee KimChandrasekharan Kothandaraman
    • H01L21/82
    • H01L23/5256H01L2924/0002H01L2924/00
    • A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal layer may be patterned so that a middle portion of the fuselink semiconductor portion has a thin metal layer, which upon annealing produces a thinner metal semiconductor alloy portion than surrounding metal semiconductor alloy portion on the fuselink semiconductor portion. Alternatively, a middle portion of the metal semiconductor alloy having a uniform thickness throughout the fuselink may be lithographically patterned and etched to form a thin metal semiconductor alloy portion in the middle of the fuselink, while thick metal semiconductor alloy portions are formed on the end portions of the fuselink. The resulting inventive electrical fuse has interfaces at which a thinner metal semiconductor alloy abuts a thicker metal semiconductor alloy in the fuselink to enhance the divergence of electrical current.
    • 在包含阴极半导体部分,熔丝半导体部分和阳极半导体部分的图案化的半导体材料层上沉积金属层。 可以对金属层进行图案化,使得熔融半导体部分的中间部分具有薄金属层,其在退火时产生比在熔融半导体部分上的周围金属半导体合金部分更薄的金属半导体合金部分。 或者,在整个整体中具有均匀厚度的金属半导体合金的中间部分可以被光刻图案化和蚀刻,以在熔丝中间形成薄金属半导体合金部分,同时在端部形成厚金属半导体合金部分 的fuselink。 所产生的本发明的电熔丝具有界面,在该界面上,较薄的金属半导体合金与所述富熔体中较厚的金属半导体合金相接触以增强电流的发散。