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1. 发明申请

US20110103020A1 Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices 有权
标题翻译：基于碳纳米管的结构和从固态器件去除热量的方法
公开(公告)号：US20110103020A1
公开(公告)日：2011-05-05
申请号：US12177815
申请日：2008-07-22
申请人： Carlos Dangelo , Ephraim Suhir , Subrata Dey , Barbara Wacker , Yuan Xu , Arthur Boren , Darin Olsen , Yi Zhang , Peter Schwartz , Bala Padmakumar
发明人： Carlos Dangelo , Ephraim Suhir , Subrata Dey , Barbara Wacker , Yuan Xu , Arthur Boren , Darin Olsen , Yi Zhang , Peter Schwartz , Bala Padmakumar
IPC分类号： H05K7/20
CPC分类号： B82Y10/00 , H01L23/373 , H01L23/473 , H01L25/0652 , H01L2224/45015 , H01L2224/45147 , H01L2924/00014 , Y10S977/742 , Y10S977/762 , H01L2224/48 , H01L2924/20752
摘要： One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm−1 with an intensity ID, a G peak at ˜1585 cm−1 with an intensity IG, and an intensity ratio ID/IG of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm2K/W or less.
摘要翻译：本发明的一个方面包括铜基板; 在铜基材表面上的催化剂; 以及包含与催化剂接触的含有碳纳米管的层的热界面材料。碳纳米管的取向基本上垂直于铜基底的表面。含有碳纳米管的层的拉曼光谱在〜1350cm -1处具有强度为1D，在〜1585cm -1处具有强度IG的G峰和强度比ID / IG小于0.7的D峰激光激发波长514nm。热界面材料具有体热阻，热界面材料和铜基底之间的界面处的接触电阻以及热界面材料和固态器件之间的界面处的接触电阻。这些电阻的相加值为0.06cm 2 / W以下。

2. 发明授权

US08080871B2 Carbon nanotube-based structures and methods for removing heat from solid-state devices 有权
标题翻译：基于碳纳米管的结构和从固态器件去除热量的方法
公开(公告)号：US08080871B2
公开(公告)日：2011-12-20
申请号：US12177815
申请日：2008-07-22
申请人： Carlos Dangelo , Ephraim Suhir , Subrata Dey , Barbara Wacker , Yuan Xu , Arthur Boren , Darin Olsen , Yi Zhang , Peter Schwartz , Bala Padmakumar
发明人： Carlos Dangelo , Ephraim Suhir , Subrata Dey , Barbara Wacker , Yuan Xu , Arthur Boren , Darin Olsen , Yi Zhang , Peter Schwartz , Bala Padmakumar
IPC分类号： H01L23/34
CPC分类号： B82Y10/00 , H01L23/373 , H01L23/473 , H01L25/0652 , H01L2224/45015 , H01L2224/45147 , H01L2924/00014 , Y10S977/742 , Y10S977/762 , H01L2224/48 , H01L2924/20752
摘要： One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm−1 with an intensity ID, a G peak at ˜1585 cm−1 with an intensity IG, and an intensity ratio ID/IG of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm2K/W or less.
摘要翻译：本发明的一个方面包括铜基板; 在铜基材表面上的催化剂; 以及包含与催化剂接触的含有碳纳米管的层的热界面材料。碳纳米管的取向基本上垂直于铜基底的表面。含有碳纳米管的层的拉曼光谱在〜1350cm -1处具有强度为1D，在〜1585cm -1处具有强度IG的G峰和强度比ID / IG小于0.7的D峰激光激发波长为514nm。热界面材料具有体热阻，热界面材料和铜基底之间的界面处的接触电阻以及热界面材料和固态器件之间的界面处的接触电阻。这些电阻的相加值为0.06cm 2 / W以下。

3. 发明申请

US20080131655A1 Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices 审中-公开
标题翻译：基于双层碳纳米管的结构和从固态器件中去除热量的方法
公开(公告)号：US20080131655A1
公开(公告)日：2008-06-05
申请号：US11749128
申请日：2007-05-15
申请人： Barbara Wacker , Ephraim Suhir , Subrata Dey , Peter Schwartz , Rahim Kavari
发明人： Barbara Wacker , Ephraim Suhir , Subrata Dey , Peter Schwartz , Rahim Kavari
IPC分类号： B32B7/00
CPC分类号： F28F13/185 , A61K39/00 , B22F7/04 , B22F2998/00 , F28F21/02 , F28F2255/20 , H01L23/373 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L2224/29193 , H01L2224/32145 , H01L2224/32245 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/04941 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/19043 , H01L2924/351 , Y10T428/24174 , C22C26/00 , H01L2924/00
摘要： Carbon nanotube-based structures and methods for removing heat from solid-state devices are disclosed. In one embodiment, a copper substrate has thermal interface materials on top of front and back surfaces of the copper substrate. Each thermal interface material (TIM) comprises a layer of carbon nanotubes and a filler material located between the carbon nanotubes. The summation of the thermal resistance of the copper substrate, the bulk thermal resistance of each TIM, the contact resistance between each TIM and the copper substrate, the contact resistance between one TIM and a solid-state device, and the contact resistance between the other TIM and a heat conducting surface has a value of 0.06 cm2K/W or less.
摘要翻译：公开了一种基于碳纳米管的结构和从固态器件中去除热量的方法。在一个实施例中，铜基板在铜基板的前表面和后表面的顶部上具有热界面材料。每个热界面材料（TIM）包括一层碳纳米管和位于碳纳米管之间的填料。铜基板的热阻，每个TIM的体热阻，每个TIM和铜基板之间的接触电阻，一个TIM和固态器件之间的接触电阻以及另一个TIM之间的接触电阻的总和 TIM和导热表面的值为0.06cm 2 / K以上。

4. 发明申请

US20080131722A1 Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices 审中-公开
标题翻译：基于单层碳纳米管的结构和从固态器件去除热量的方法
公开(公告)号：US20080131722A1
公开(公告)日：2008-06-05
申请号：US11749126
申请日：2007-05-15
申请人： Ephraim Suhir , Subrata Dey , Barbara Wacker , Peter Schwartz
发明人： Ephraim Suhir , Subrata Dey , Barbara Wacker , Peter Schwartz
IPC分类号： B32B15/04 , H05K3/00
CPC分类号： H01L23/3735 , B32B7/03 , B32B15/04 , B32B15/20 , B32B2255/06 , B32B2255/20 , B32B2264/108 , B32B2307/30 , B32B2457/00 , C23C16/27 , C23C28/021 , C23C28/023 , C23C28/028 , C23C28/322 , C23C28/34 , C23C28/345 , C23C28/36 , H01L21/4871 , H01L23/373 , H01L24/29 , H01L24/32 , H01L33/641 , H01L2224/29111 , H01L2224/2919 , H01L2224/29193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/04941 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/19043 , H01L2924/351 , H01S5/02476 , Y10T428/125 , Y10T428/12583 , Y10T428/1259 , Y10T428/12611 , Y10T428/12625 , H01L2924/00014 , H01L2924/00
摘要： One embodiment includes: a copper substrate; a catalyst on top of a single surface of the copper substrate; and a thermal interface material on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate. The thermal interface material has: a bulk thermal resistance, a contact resistance between the thermal interface material and the copper substrate, and a contact resistance between the thermal interface material and a solid-state device. The summation of the bulk thermal resistance, the contact resistance between the thermal interface material and the copper substrate, and the contact resistance between the thermal interface material and the solid-state device has a value of 0.06 cm2K/W or less.
摘要翻译：一个实施例包括：铜基板; 在铜基材的单个表面的顶部上的催化剂; 以及在铜衬底的单个表面的顶部上的热界面材料。热界面材料包括：与催化剂接触的碳纳米管层和位于碳纳米管之间的填料。碳纳米管的取向基本上垂直于铜基底的单个表面。热界面材料具有体积热阻，热界面材料和铜基底之间的接触电阻以及热界面材料和固态器件之间的接触电阻。体热阻，热界面材料和铜基底之间的接触电阻以及热界面材料和固态器件之间的接触电阻的相加值为0.06cm 2， K / W以下。

5. 发明授权

US4882569A Deactivatable fequency-dividing-transponder tag 失效
标题翻译：不可激活的分类 - 应答器标签
公开(公告)号：US4882569A
公开(公告)日：1989-11-21
申请号：US224326
申请日：1988-07-26
申请人： Subrata Dey
发明人： Subrata Dey
IPC分类号： G01S13/74 , G08B13/24 , H01F21/08
CPC分类号： G08B13/2411 , G08B13/2437 , G08B13/2442 , G08B13/2448
摘要： A presence-detection-system tag in which a frequency-dividing transponder may be decisively deactivated notwithstanding the intensity of the ambient magnetic field. The tag includes a frequency-dividing transponder including an active strip of magnetic material that, when magnetically biased to be within a predetermined magnetic field intensity range, responds to excitation by electromagnetic radiation of a first predetermined frequency by radiating electromagnetic radiation of a second predetermined frequency that is a frequency-divided quotient of the first predetermined frequency; a first bias strip of magnetic material disposed in relation to the active strip of magnetic material for biasing the active strip of magnetic material to be within the predetermined magnetic field intensity range only when the first bias strip of magnetic material is magnetized; and a second bias strip of magnetic material disposed in relation to the active strip of magnetic material for further biasing the active strip to be outside of the predetermined magnetic field intensity range to thereby prevent the active strip of magnetic material from radiating electromagnetic radiation of the second predetermined frequency in response to excitation by electromagnetic radiation of the first predetermined frequency when the first and second bias strips of magnetic material are both magnetized. A coded tag includes two such active strips having different magnetomechanical resonant frequencies. Either tag may be detected in a presence detection system that includes means for transmitting an electromagnetic radiation signal of a first predetermined frequency into a surveillance zone; and means for detecting electromagnetic radiation of the second predetermined frequency within the surveillance zone. The system further includes a magnetizer for magnetizing the second bias strip to thereby deactivate the frequency-dividing transponder of the tag.

6. 发明授权

US4835028A Secure paper product 失效
标题翻译：安全纸产品
公开(公告)号：US4835028A
公开(公告)日：1989-05-30
申请号：US56495
申请日：1987-05-29
申请人： Subrata Dey , William R. Menyhert
发明人： Subrata Dey , William R. Menyhert
IPC分类号： G03G21/00 , D21H27/00 , G03C5/08 , G03G21/04 , G08B13/24
CPC分类号： G08B13/2411 , G03C5/08 , G03G21/043 , G08B13/2434 , G08B13/2442 , G08B13/2445 , Y10S283/902 , Y10S428/913 , Y10S428/915 , Y10S428/916 , Y10T428/22 , Y10T428/31703 , Y10T428/31993
摘要： A paper product includes both means for preventing images from being copied from the paper product by use of a xerographic photocopier; and means for enabling detection of the paper product when the paper product is transported through an interrogation zone of an article surveillance system.

7. 发明授权

US06317297B1 Current pinned dual spin valve with synthetic pinned layers 有权
标题翻译：当前固定式双自旋阀，具有合成钉扎层
公开(公告)号：US06317297B1
公开(公告)日：2001-11-13
申请号：US09413287
申请日：1999-10-06
申请人： Hua-Ching Tong , Xizeng Shi , Subrata Dey , Matthew Richard Gibbons
发明人： Hua-Ching Tong , Xizeng Shi , Subrata Dey , Matthew Richard Gibbons
IPC分类号： G11B539
CPC分类号： B82Y25/00 , B82Y10/00 , G01R33/093 , G11B5/3903 , G11B5/3954 , G11B2005/3996 , H01F10/3263
摘要： A method and system for providing a magnetoresistive sensor is disclosed. The method and system include providing a first pinned layer, providing a first spacer layer above the first pinned layer, and providing a free layer above the first spacer layer. The method and system further include providing a second spacer layer above the free layer and providing a second pinned layer above the second spacer layer. The first pinned layer includes a first magnetic layer and a second magnetic layer separated by a first nonmagnetic layer. The first magnetic layer is antiferromagnetically coupled with the second magnetic layer. The second pinned layer includes a third magnetic layer and a fourth magnetic layer separated by a second nonmagnetic layer. The third magnetic layer is antiferromagnetically coupled with the fourth magnetic layer. The first pinned layer and the second pinned layer are pinned by a current carried by the magnetoresistive head during use.
摘要翻译：公开了一种用于提供磁阻传感器的方法和系统。该方法和系统包括提供第一被钉扎层，在第一被钉扎层上方提供第一间隔层，以及在第一间隔层上方提供自由层。该方法和系统还包括在自由层上方提供第二间隔层，并在第二间隔层上方提供第二钉扎层。第一被钉扎层包括由第一非磁性层分离的第一磁性层和第二磁性层。第一磁性层与第二磁性层反铁磁耦合。第二被钉扎层包括由第二非磁性层分离的第三磁性层和第四磁性层。第三磁性层与第四磁性层反铁磁耦合。第一被钉扎层和第二钉扎层在使用期间由磁阻头承载的电流固定。

8. 发明授权

US5930086A Heat exchangeable thin-film recording head element and method for manufacturing same 失效
标题翻译：可热交换薄膜记录头元件及其制造方法
公开(公告)号：US5930086A
公开(公告)日：1999-07-27
申请号：US850039
申请日：1997-05-02
申请人： Yi-Shung Chaug , Subrata Dey
发明人： Yi-Shung Chaug , Subrata Dey
IPC分类号： G11B5/31 , G11B5/39 , G11B5/40 , G11B5/127
CPC分类号： B82Y25/00 , B82Y10/00 , G11B5/3136 , G11B5/3903 , G11B5/40 , G11B2005/3996 , G11B5/3103 , G11B5/3133
摘要： A recording element is provided for use in a high density thin film recording head. The recording element includes a substrate, a thermally conductive material in contact with the substrate, and an insulative layer in contact with the thermally conductive material. The recording element further includes a magneto-resistive element in contact with the insulative layer such that the magneto-resistive element fails to overlay the thermally conductive material. The thermally conductive material and the insulative layer have thermal conductivities sufficient to dissipate heat from the magneto-resistive element so that heat induced malfunctions of the recording element are minimized. The method for manufacturing the recording element is also provided. The method includes depositing a thermally conductive material in contact with a substrate, depositing an insulative layer in contact with the thermally conductive material, and depositing a magneto-resistive element in contact with the insulative layer such that the magneto-resistive element fails to overlay the thermally conductive material.
摘要翻译：提供用于高密度薄膜记录头的记录元件。记录元件包括基板，与基板接触的导热材料以及与导热材料接触的绝缘层。记录元件还包括与绝缘层接触的磁阻元件，使得磁阻元件不能覆盖导热材料。导热材料和绝缘层具有足以散发来自磁阻元件的热的热导率，使得记录元件的热引起的故障最小化。还提供了用于制造记录元件的方法。该方法包括沉积与衬底接触的导热材料，沉积与导热材料接触的绝缘层，以及沉积与绝缘层接触的磁阻元件，使得磁阻元件不能覆盖导热材料。

9. 发明授权

US5876614A Method of wet etching aluminum oxide to minimize undercutting 失效
标题翻译：湿蚀刻氧化铝以最小化底切的方法
公开(公告)号：US5876614A
公开(公告)日：1999-03-02
申请号：US844437
申请日：1997-04-18
申请人： Bo Zhou , Barry Allen McPherron , Subrata Dey , Yi-Shung Chaug
发明人： Bo Zhou , Barry Allen McPherron , Subrata Dey , Yi-Shung Chaug
IPC分类号： H01L21/027 , H01L21/311 , H01L21/44
CPC分类号： H01L21/31111 , H01L21/0276
摘要： The method of wet etching an aluminum oxide substrate deposits a thin layer of titanium film or chromium film on the aluminum oxide surface prior to the application of the photo-resist coating to form a barrier between the aluminum oxide and the photo-resist. This barrier layer inhibits the reaction between the aluminum oxide and the photo-resist during the photolithographic process. The undercutting of the aluminum oxide in the wet etching process is therefore controlled by the deposition of the barrier layer comprising the thin layer of titanium film or chromium film. The titanium film used is nominally 30 .ANG. thick to obtain the beneficial effects noted above while the chromium film would be approximately 1000 .ANG. thick.
摘要翻译：湿法蚀刻氧化铝衬底的方法在施加光致抗蚀剂涂层之前在氧化铝表面上沉积薄层的钛膜或铬膜，以在氧化铝和光致抗蚀剂之间形成屏障。该阻挡层在光刻工艺期间抑制氧化铝和光致抗蚀剂之间的反应。因此，湿蚀刻工艺中的氧化铝的底切由包含钛膜或铬膜薄层的阻挡层的沉积来控制。所使用的钛膜的厚度通常为30，以获得上述有益效果，而铬膜的厚度约为1000。

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