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1. 发明申请

US20080131655A1 Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices 审中-公开
标题翻译：基于双层碳纳米管的结构和从固态器件中去除热量的方法
公开(公告)号：US20080131655A1
公开(公告)日：2008-06-05
申请号：US11749128
申请日：2007-05-15
申请人： Barbara Wacker , Ephraim Suhir , Subrata Dey , Peter Schwartz , Rahim Kavari
发明人： Barbara Wacker , Ephraim Suhir , Subrata Dey , Peter Schwartz , Rahim Kavari
IPC分类号： B32B7/00
CPC分类号： F28F13/185 , A61K39/00 , B22F7/04 , B22F2998/00 , F28F21/02 , F28F2255/20 , H01L23/373 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L2224/29193 , H01L2224/32145 , H01L2224/32245 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/0132 , H01L2924/04941 , H01L2924/04953 , H01L2924/12041 , H01L2924/14 , H01L2924/15747 , H01L2924/19043 , H01L2924/351 , Y10T428/24174 , C22C26/00 , H01L2924/00
摘要： Carbon nanotube-based structures and methods for removing heat from solid-state devices are disclosed. In one embodiment, a copper substrate has thermal interface materials on top of front and back surfaces of the copper substrate. Each thermal interface material (TIM) comprises a layer of carbon nanotubes and a filler material located between the carbon nanotubes. The summation of the thermal resistance of the copper substrate, the bulk thermal resistance of each TIM, the contact resistance between each TIM and the copper substrate, the contact resistance between one TIM and a solid-state device, and the contact resistance between the other TIM and a heat conducting surface has a value of 0.06 cm2K/W or less.
摘要翻译：公开了一种基于碳纳米管的结构和从固态器件中去除热量的方法。在一个实施例中，铜基板在铜基板的前表面和后表面的顶部上具有热界面材料。每个热界面材料（TIM）包括一层碳纳米管和位于碳纳米管之间的填料。铜基板的热阻，每个TIM的体热阻，每个TIM和铜基板之间的接触电阻，一个TIM和固态器件之间的接触电阻以及另一个TIM之间的接触电阻的总和 TIM和导热表面的值为0.06cm 2 / K以上。

2. 发明申请

US20070097648A1 Method and apparatus for establishing optimal thermal contact between opposing surfaces 审中-公开
标题翻译：用于在相对表面之间建立最佳热接触的方法和装置
公开(公告)号：US20070097648A1
公开(公告)日：2007-05-03
申请号：US11265264
申请日：2005-11-01
申请人： Kevin Xu , Ephraim Suhir , Carlos Dangelo
发明人： Kevin Xu , Ephraim Suhir , Carlos Dangelo
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： To achieve optimal thermal contact between opposing surfaces, it is necessary to align such surfaces so that maximum contact is achieved. In a semiconductor package, it is necessary to align the surface of a semiconductor integrated circuit (IC) and a heat sink surface, where the heat sink contains a nano-composite wire structure. By using a self-aligned structure that forces the alignment of the IC surface and the heat sink, maximum thermal contact between the two surfaces is achieved. The self-alignment of a pressure measurement device for same is also disclosed.
摘要翻译：为了实现相对表面之间的最佳热接触，需要对准这些表面以便实现最大的接触。在半导体封装中，必须对准半导体集成电路（IC）的表面和散热器表面，其中散热器包含纳米复合导线结构。通过使用迫使IC表面和散热片对准的自对准结构，实现两个表面之间的最大热接触。还公开了用于其的压力测量装置的自对准。

3. 发明授权

US07162137B2 Optical fiber with nano-particle cladding 失效
标题翻译：具有纳米粒子包层的光纤
公开(公告)号：US07162137B2
公开(公告)日：2007-01-09
申请号：US09884463
申请日：2001-06-20
申请人： Dov Ingman , Ephraim Suhir
发明人： Dov Ingman , Ephraim Suhir
IPC分类号： G02B6/00
CPC分类号： G02B6/0229 , G02B6/02033 , G02B6/04
摘要： An optical fiber includes a core, and a cladding layer that has a plurality of nano-particles around the core.
摘要翻译：光纤包括芯，以及在芯周围具有多个纳米粒子的包覆层。

4. 发明授权

US07321714B2 Moisture-resistant nano-particle material and its applications 失效
标题翻译：防水纳米颗粒材料及其应用
公开(公告)号：US07321714B2
公开(公告)日：2008-01-22
申请号：US10559850
申请日：2003-06-13
申请人： Dov Ingman , Vladimir Ogenko , Ephraim Suhir , Andrew Glista
发明人： Dov Ingman , Vladimir Ogenko , Ephraim Suhir , Andrew Glista
IPC分类号： G02B6/00
CPC分类号： C09D5/008 , B81B7/0077 , C08K3/36 , C09D7/70 , G02B6/0229 , G02B6/02395 , G02B6/03622
摘要： Nano-particle materials including nanometer-scaled particles with a variety of sizes, chemical compositions, and properties may be used to form functional and/or protective media (layers) on a variety of materials and items. Among the items that may be coated and/or protected by nano-particle materials are integrated circuits, printed circuit boards, micro-electro-mechanical systems (MEMS), photonics devices and packages, optical fibers, and displays, as well as various macroscopic structures, such as pipes (tubes), bridges, towers and other civil engineering structures, all kinds of marine vehicles and off-shore structures, aircraft and aerospace structures, cars, etc.
摘要翻译：包括具有各种尺寸，化学组成和性质的纳米级颗粒的纳米颗粒材料可用于在各种材料和物品上形成功能性和/或保护性介质（层）。可以由纳米颗粒材料涂覆和/或保护的项目包括集成电路，印刷电路板，微电子机械系统（MEMS），光子器件和封装，光纤和显示器以及各种宏观结构，如管道（管），桥梁，塔等土木工程结构，各种船用车辆和离岸结构，飞机和航空航天结构，汽车等。

5. 发明授权

US07279916B2 Apparatus and test device for the application and measurement of prescribed, predicted and controlled contact pressure on wires 有权
标题翻译：用于应用和测量电线上规定的，预测和控制的接触压力的装置和测试装置
公开(公告)号：US07279916B2
公开(公告)日：2007-10-09
申请号：US11207096
申请日：2005-08-17
申请人： Ephraim Suhir
发明人： Ephraim Suhir
IPC分类号： G01R30/02
CPC分类号： G01R1/07357 , B82Y10/00 , G01R1/06716 , G01R1/0675 , G01R1/44 , H01L23/373 , H01L2224/73253 , H01L2924/01019 , H01L2924/01079
摘要： The mechanical behavior of wires subjected to axial loading and experiencing bending deformation is used to ensure effective control of the contact pressure in mechanical and/or heat removing devices, and similar structures and systems. An apparatus for taking advantage of the characteristics of wires in packaging of a device, such as a semiconductor device, is disclosed, as well as a test device for identifying the accurate contact pressure required in same. Methods for the prediction of such a behavior for pre-buckling, buckling, and post-buckling conditions in wires, carbon nanotubes (CNTs), and similar wire-grid-array (WGA) structures, for example are also disclosed.
摘要翻译：使用经受轴向载荷和经历弯曲变形的线的机械性能来确保机械和/或除热装置以及类似结构和系统中的接触压力的有效控制。公开了一种用于利用诸如半导体器件的器件的封装中的电线特性的装置，以及用于识别其中所需的准确接触压力的测试装置。还公开了用于预测电线，碳纳米管（CNT）和类似的线栅阵列（WGA）结构中的预屈曲，屈曲和后屈曲条件的这种行为的方法。

6. 发明申请

US20070099006A1 Highly compliant bonding compound and structure 审中-公开
标题翻译：高度兼容的粘合剂和结构
公开(公告)号：US20070099006A1
公开(公告)日：2007-05-03
申请号：US11264097
申请日：2005-11-02
申请人： Dov Ingman , Ephraim Suhir
发明人： Dov Ingman , Ephraim Suhir
IPC分类号： B32B27/00 , C09J183/04 , C08L83/04
CPC分类号： B32B7/04 , B32B27/20 , B32B27/283 , B32B2264/102 , B32B2264/104 , B32B2264/105 , B32B2457/00 , B32B2551/00 , B32B2559/00 , C09J183/04 , Y10T428/31663
摘要： A compliant bonding material includes a thixotropic filler, and a plurality of nanoparticles embedded in the filler. The filler can be for example, oil or other stable viscous liquid with the proper surface tension properties, for example, siloxane, other silicone oils, or polysiloxane. The nanoparticles can be, e.g., Ag, Cu, Ti, Ni, metal oxides, silica, ZnO and Fe2O3. A plurality of microspheres can be embedded in the filler, with whiskers formed on surfaces of the microspheres. Nanoparticles can also be embedded in the filler. The whiskers can be nanotubes, nanoparticles and/or nanowires. The whiskers can be, for example, metallic. The bonding material can be used a bonded structure that includes a first surface and a second surface, with the bonding material positioned between the first and second surfaces.
摘要翻译：柔性粘合材料包括触变填料和嵌入填料中的多个纳米颗粒。填料可以是例如具有适当表面张力性能的油或其它稳定的粘稠液体，例如硅氧烷，其它硅油或聚硅氧烷。纳米颗粒可以是例如Ag，Cu，Ti，Ni，金属氧化物，二氧化硅，ZnO和Fe 2 O 3 3。可以在填料中嵌入多个微球，其中形成在微球表面上的晶须。纳米颗粒也可以嵌入填料中。晶须可以是纳米管，纳米颗粒和/或纳米线。晶须可以是例如金属的。接合材料可以使用包括第一表面和第二表面的接合结构，其中接合材料位于第一表面和第二表面之间。

7. 发明申请

US20070036510A1 Moisture-resistant nano-particle material and its applications 失效
标题翻译：防水纳米颗粒材料及其应用
公开(公告)号：US20070036510A1
公开(公告)日：2007-02-15
申请号：US10559850
申请日：2003-06-13
申请人： Dov Ingman , Vladimir Ogenko , Ephraim Suhir , Andrew Glista
发明人： Dov Ingman , Vladimir Ogenko , Ephraim Suhir , Andrew Glista
IPC分类号： G02B6/00
CPC分类号： C09D5/008 , B81B7/0077 , C08K3/36 , C09D7/70 , G02B6/0229 , G02B6/02395 , G02B6/03622
摘要： Nano-particle materials including nanometer-scaled particles with a variety of sizes, chemical compositions, and properties may be used to form functional and/or protective media (layers) on a variety of materials and items. Among the items that may be coated and/or protected by nano-particle materials are integrated circuits, printed circuit boards, micro-electro-mechanical systems (MEMS), photonics devices and packages, optical fibers, and displays, as well as various macroscopic structures, such as pipes (tubes), bridges, towers and other civil engineering structures, all kinds of marine vehicles and off-shore structures, aircraft and aerospace structures, cars, etc.
摘要翻译：包括具有各种尺寸，化学组成和性质的纳米级颗粒的纳米颗粒材料可用于在各种材料和物品上形成功能性和/或保护性介质（层）。可以由纳米颗粒材料涂覆和/或保护的项目包括集成电路，印刷电路板，微电子机械系统（MEMS），光子器件和封装，光纤和显示器以及各种宏观结构，如管道（管），桥梁，塔等土木工程结构，各种船用车辆和离岸结构，飞机和航空航天结构，汽车等。

8. 发明授权

US06460753B1 Bi-material assembly adhesively bonded at the ends and fabrication method 失效
标题翻译：双材料组装在端部粘结并制作方法
公开(公告)号：US06460753B1
公开(公告)日：2002-10-08
申请号：US09703292
申请日：2000-11-01
申请人： Ephraim Suhir
发明人： Ephraim Suhir
IPC分类号： H01L2150
CPC分类号： H01L23/34 , H01L2924/0002 , Y10T428/24826 , H01L2924/00
摘要： A bi-material assembly comprising two adherends, adhesively bonded. The assembly is adhesively bonded in an area consisting of a length of 2l at each end of the bonded assembly. The interface of the adherends is not completed bonded so that 2l is less than half of the assembly length. Each bonded area has an inner edge. The inner edge local interfacial shearing stress is substantially equal in magnitude to the inner edge global interfacial shearing stress causing the strength of the bi-material bonded assembly to be substantially the same as a like structure wherein 2l substantially equals half the assembly length. Further are a method of fabricating a bi-material assembly, and a semiconductor device and fabrication method.
摘要翻译：一种双组分材料，包括两个被粘合的粘合剂。组合体在粘合组件的每个端部处由21l的长度组成的区域粘合。被粘物的界面未完成粘合，使得21l小于组装长度的一半。每个粘合区域都有一个内边缘。内边缘局部界面剪切应力的大小与内边缘总体界面剪切应力基本相等，导致双材料粘合组件的强度与类似结构基本相同，其中2l基本上等于组件长度的一半。另外是制造双材料组件的方法，以及半导体器件和制造方法。

9. 发明授权

US06327411B1 Interconnected optical devices having enhanced reliability 有权
标题翻译：具有增强的可靠性的互连光学器件
公开(公告)号：US06327411B1
公开(公告)日：2001-12-04
申请号：US09357457
申请日：1999-07-20
申请人： Ephraim Suhir
发明人： Ephraim Suhir
IPC分类号： G02B602
CPC分类号： G02B6/43 , G02B6/02395 , G02B6/4402
摘要： This invention is predicated on applicant's discovery that the conventional polymer coatings are often too thin to prevent buckling and subsequent bending of optical interconnection fiber, and that this buckling and the consequent induced bending can be eliminated by increasing the thickness of the fiber polymer coating. Applicant has further discovered that a thicker coating that might be insufficient to prevent buckling, reduces stress should buckling occur, thereby improving the reliability and quality of the waveguide. The optimal (minimum) polymer thickness for buckling prevention can be calculated in terms of the properties of the fiber and tube materials and the thermal history of the device. Increased thicknesses less than this optimal thickness can nonetheless reduce stress should buckling occur.
摘要翻译：本发明基于申请人的发现，传统的聚合物涂层通常太薄而不能防止光学互连纤维的屈曲和随后的弯曲，并且通过增加纤维聚合物涂层的厚度可以消除该屈曲和随之而来的诱导弯曲。申请人进一步发现，较厚的涂层可能不足以防止翘曲，减少应力会发生弯曲，从而提高波导的可靠性和质量。用于防止翘曲的最佳（最小）聚合物厚度可以根据纤维和管材料的性质以及装置的热历史来计算。增加的厚度小于这个最佳厚度，尽管如此，可以降低压应力。

10. 发明授权

US08048688B2 Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays 有权
标题翻译：用于评估和改进CNT / CNF阵列的机械和热性能的方法和装置
公开(公告)号：US08048688B2
公开(公告)日：2011-11-01
申请号：US11618441
申请日：2006-12-29
申请人： Ephraim Suhir , Yuan Xu , Yi Zhang
发明人： Ephraim Suhir , Yuan Xu , Yi Zhang
IPC分类号： H01L21/66
CPC分类号： G01N3/08 , B82Y30/00 , G01N2203/028 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01042 , H01L2924/14
摘要： A method and apparatus for the evaluation and improvement of the mechanical and thermal properties of carbon-nanotube (CNT) and carbon nanofiber (CNF) arrays grown on a substrate is disclosed. The Young's modulus of a CNT/CNF material is measured by applying an axial compressive force on the CNT/CNF array and measuring the applied forces and the induced displacements. Also disclosed are the evaluation of the nonlinear stress-strain relationship of the CNT/CNF material, increasing of the Young's modulus and decreasing the thermal resistance by application of a compressive load, the application of rapid thermal annealing to improve the quality of the CNT/CNF material and to reduce the interfacial thermal resistance, improvement of the bonding strength of the CNT/CNF array to a substrate, evaluation of the bonding strength of the CNT/CNF array to a substrate, evaluation of the shearing force at failure, and an analytical stress model that enables one to predict the interfacial shearing stress from the measured force.
摘要翻译：公开了一种用于评价和改善在衬底上生长的碳纳米管（CNT）和碳纳米纤维（CNF）阵列的机械和热性质的方法和装置。 CNT / CNF材料的杨氏模量通过在CNT / CNF阵列上施加轴向压力并测量所施加的力和诱发的位移来测量。还公开了CNT / CNF材料的非线性应力 - 应变关系的评估，通过施加压缩载荷提高杨氏模量和降低热阻，应用快速热退火来提高CNT / CNF材料并降低界面热阻，改善CNT / CNF阵列与基片的结合强度，评估CNT / CNF阵列与基片的接合强度，评估破坏时的剪切力，以及分析应力模型，可以从测量的力量预测界面剪切应力。

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