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    • 4. 发明授权
    • High-current N-type silicon-on-insulator lateral insulated-gate bipolar transistor
    • 大电流N型绝缘体上半导体绝缘栅双极晶体管
    • US09159818B2
    • 2015-10-13
    • US14349632
    • 2012-10-24
    • SOUTHEAST UNIVERSITY
    • Weifeng SunSiyang LiuJing ZhuQinsong QianShen XuShengli LuLongxing Shi
    • H01L27/24H01L29/739H01L29/40H01L27/12H01L29/06H01L27/06
    • H01L29/7394H01L27/0623H01L27/1203H01L29/0638H01L29/404
    • A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.
    • 一种高电流,N型绝缘体上的横向绝缘栅双极晶体管,包括:P型衬底,设置在P型衬底上的掩埋氧化物层,设置在P型衬底上的N型外延层 氧化物层和N型缓冲阱捕获区。 P型体区域和N型中央缓冲区捕获区域设置在N型外延层内部; P型漏极区域设置在缓冲陷阱区域中; N型源极区域和P型体接触区域设置在P型体区域中; N型基极区域和P型发射极区域设置在缓冲陷阱区域中; 栅极和场氧化物层设置在N型外延层上; 多晶硅栅极设置在栅极氧化物层上; 并且钝化层和金属层设置在对称晶体管的表面上。 改善P型发射极区域的输出和电流密度,而不增加晶体管的面积。
    • 6. 发明授权
    • Transverse ultra-thin insulated gate bipolar transistor having high current density
    • 具有高电流密度的横向超薄绝缘栅双极晶体管
    • US09240469B2
    • 2016-01-19
    • US14439715
    • 2012-12-27
    • SOUTHEAST UNIVERSITY
    • Weifeng SunJing ZhuShen XuQinsong QianSiyang LiuShengli LuLongxing Shi
    • H01L29/66H01L29/739H01L29/06H01L29/49H01L29/10H01L29/08H01L23/528
    • H01L29/7394H01L23/528H01L29/0611H01L29/0696H01L29/0808H01L29/0821H01L29/0847H01L29/1008H01L29/4916H01L2924/0002H01L2924/00
    • A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.
    • 具有电流密度的横向超薄绝缘栅双极晶体管包括:P基板,其中P基板在其上设置有掩埋氧化物层,所述掩埋氧化物层在其上设置有N外延层,提供N外延层 在其中具有N阱区域和P基极区域,P基极区域中设置有第一P接触区域和N源极区域,N阱区域中设置有N个缓冲区域,N阱区域设置有 在其上的场氧化物层,N缓冲区在其中设置有P漏极区,N外延层中设置有包括P环状基极区的P基区阵列,P基区阵列位于N阱之间 区域和P基区域中,P环状基部区域设置有第二P接触区域和N环状源极区域,第二P接触区域位于N环状源极区域中。 本发明大大增加了横向超薄绝缘栅双极晶体管的电流密度,从而显着提高了智能功率模块的性能。
    • 8. 发明申请
    • TRANSVERSE ULTRA-THIN INSULATED GATE BIPOLAR TRANSISTOR HAVING HIGH CURRENT DENSITY
    • 具有高电流密度的横向超薄绝缘栅双极晶体管
    • US20150270377A1
    • 2015-09-24
    • US14439715
    • 2012-12-27
    • SOUTHEAST UNIVERSITY
    • Weifeng SunJing ZhuShen XuQinsong QianSiyang LiuShengli LuLongxing Shi
    • H01L29/739H01L23/528H01L29/10H01L29/08H01L29/06H01L29/49
    • H01L29/7394H01L23/528H01L29/0611H01L29/0696H01L29/0808H01L29/0821H01L29/0847H01L29/1008H01L29/4916H01L2924/0002H01L2924/00
    • A transverse ultra-thin insulated gate bipolar transistor having current density includes: a P substrate, where the P substrate is provided with a buried oxide layer thereon, the buried oxide layer is provided with an N epitaxial layer thereon, the N epitaxial layer is provided with an N well region and P base region therein, the P base region is provided with a first P contact region and an N source region therein, the N well region is provided with an N buffer region therein, the N well region is provided with a field oxide layer thereon, the N buffer region is provided with a P drain region therein, the N epitaxial layer is provided therein with a P base region array including a P annular base region, the P base region array is located between the N well region and the P base region, the P annular base region is provided with a second P contact region and an N annular source region therein, and the second P contact region is located in the N annular source region. The present invention greatly increases current density of a transverse ultra-thin insulated gate bipolar transistor, thus significantly improving the performance of an intelligent power module.
    • 具有电流密度的横向超薄绝缘栅双极晶体管包括:P基板,其中P基板在其上设置有掩埋氧化物层,所述掩埋氧化物层在其上设置有N外延层,提供N外延层 在其中具有N阱区域和P基极区域,P基极区域中设置有第一P接触区域和N源极区域,N阱区域中设置有N个缓冲区域,N阱区域设置有 在其上的场氧化物层,N缓冲区在其中设置有P漏极区,N外延层中设置有包括P环状基极区的P基区阵列,P基区阵列位于N阱之间 区域和P基区域中,P环状基部区域设置有第二P接触区域和N环状源极区域,第二P接触区域位于N环状源极区域中。 本发明大大增加了横向超薄绝缘栅双极晶体管的电流密度,从而显着提高了智能功率模块的性能。
    • 10. 发明申请
    • HIGH-CURRENT N-TYPE SILICON-ON-INSULATOR LATERAL INSULATED-GATE BIPOLAR TRANSISTOR
    • 高电流N型绝缘子硅酸盐绝缘栅双极晶体管
    • US20140306266A1
    • 2014-10-16
    • US14349632
    • 2012-10-24
    • SOUTHEAST UNIVERSITY
    • Weifeng SunSiyang LiuJing ZhuQinsong QianShen XuShengli LuLongxing Shi
    • H01L29/739H01L27/12H01L27/06
    • H01L29/7394H01L27/0623H01L27/1203H01L29/0638H01L29/404
    • A high-current, N-type silicon-on-insulator lateral insulated-gate bipolar transistor, including: a P-type substrate, a buried-oxide layer disposed on the P-type substrate, an N-type epitaxial layer disposed on the oxide layer, and an N-type buffer trap region. A P-type body region and an N-type central buffer trap region are disposed inside the N-type epitaxial layer; a P-type drain region is disposed in the buffer trap region; N-type source regions and a P-type body contact region are disposed in the P-type body region; an N-type base region and a P-type emitter region are disposed in the buffer trap region; gate and field oxide layers are disposed on the N-type epitaxial layer; polycrystalline silicon gates are disposed on the gate oxide layers; and a passivation layer and metal layers are disposed on the surface of the symmetrical transistor. P-type emitter region output and current density are improved without increasing the area of the transistor.
    • 一种高电流,N型绝缘体上的横向绝缘栅双极晶体管,包括:P型衬底,设置在P型衬底上的掩埋氧化物层,设置在P型衬底上的N型外延层 氧化物层和N型缓冲阱捕获区。 P型体区域和N型中央缓冲区捕获区域设置在N型外延层内部; P型漏极区域设置在缓冲陷阱区域中; N型源极区域和P型体接触区域设置在P型体区域中; N型基极区域和P型发射极区域设置在缓冲陷阱区域中; 栅极和场氧化物层设置在N型外延层上; 多晶硅栅极设置在栅极氧化物层上; 并且钝化层和金属层设置在对称晶体管的表面上。 改善P型发射极区域的输出和电流密度,而不增加晶体管的面积。