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1. 发明申请

WO2007089869A3 TAPE-WRAPPED MULTILAYER TUBING AND METHODS FOR MAKING THE SAME 审中-公开
公开(公告)号：WO2007089869A3
公开(公告)日：2007-08-09
申请号：PCT/US2007/002701
申请日：2007-01-30
申请人： COOLIGY, INC. , WERNER, Douglas, E. , FIROUZI, Ali , MUNCH, Mark , CICHOCKI, Zbigniew
发明人： WERNER, Douglas, E. , FIROUZI, Ali , MUNCH, Mark , CICHOCKI, Zbigniew
IPC分类号： F28F7/00
摘要： The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.

2. 发明申请

WO2007120530A2 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A2
公开(公告)日：2007-10-25
申请号：PCT/US2007/008190
申请日：2007-03-30
申请人： COOLIGY, INC. , HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
发明人： HOM, James , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark , TSAO, Paul , CONWAY, Bruce , ZHOU, Peng , BREWER, Richard
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

3. 发明申请

WO2007098077A2 LIQUID COOLING LOOPS FOR SERVER APPLICATIONS 审中-公开
标题翻译：液体冷却液用于服务器应用
公开(公告)号：WO2007098077A2
公开(公告)日：2007-08-30
申请号：PCT/US2007/004236
申请日：2007-02-16
申请人： COOLIGY, INC. , UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
发明人： UPADHYA, Girish , MUNCH, Mark , CHOW, Norman , TSAO, Paul , WERNER, Douglas, E. , MCMASTER, Mark , LANDRY, Frederic , SPEARING, Ian , SCHRADER, Tim
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H01L2924/0002 , H05K7/20727 , H05K7/20772 , H01L2924/00
摘要： Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.
摘要翻译：液体冷却溶液，用于将一个或多个发热装置产生的热量从一个或多个电子服务器传递到环境。每个电子服务器包括一个或多个发热装置。集成到每个电子服务器上是一种基于液体的冷却系统。每个基于液体的冷却系统包括服务器泵和通过流体管线连接在一起的一个或多个微通道冷板（MCP）。用于每个电子服务器的基于液体的冷却系统包括配置有微通道的排出板。 MCP，服务器泵和排料板形成第一个闭环。排料板通过热界面材料连接到底盘冷板。在多电子服务器配置中，用于每个电子服务器的排放板联接到配置有流体通道的底盘冷板，流体通道经由流体管线耦合到液体 - 空气热交换系统以形成第二闭合回路。

4. 发明申请

WO2007114913A2 MULTI DEVICE COOLING 审中-公开
标题翻译：多设备冷却
公开(公告)号：WO2007114913A2
公开(公告)日：2007-10-11
申请号：PCT/US2007/008281
申请日：2007-03-30
申请人： COOLIGY, INC. , UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
发明人： UPADHYA, Girish , WERNER, Douglas, E. , MUNCH, Mark
IPC分类号： F25D17/06 , F25B1/00
CPC分类号： G06F1/20 , F28D1/0408 , F28D2021/0028 , F28F3/022 , F28F2270/00 , G06F2200/201 , H05K7/20154
摘要： A micro scale cooling system comprises a first heat exchanger thermally coupled to a first heat source. The cooling system also has a second heat exchanger thermally coupled to a second heat source and a connection between the first heat exchanger and the second heat exchanger. A fluid flows through the first and second cooling plates. The cooling system has a first pump for driving the fluid. The cooling system further includes a first radiator and tubing that interconnects the first heat exchanger, the second heat exchanger, the first pump, and the first radiator. The tubing of some embodiments is designed to minimize fluid loss. Some embodiments optionally include a first fan to reject heat from the first radiator, and/or a volume compensator for counteracting fluid loss over time. In some embodiments, at least one heat exchanger has at least one micro scale structure. Some embodiments include a method of cooling the heat sources for a multi device configuration by using such a cooling system.
摘要翻译：微型冷却系统包括热耦合到第一热源的第一热交换器。冷却系统还具有热耦合到第二热源的第二热交换器和第一热交换器与第二热交换器之间的连接。流体流过第一和第二冷却板。冷却系统具有用于驱动流体的第一泵。冷却系统还包括第一散热器和连接第一热交换器，第二热交换器，第一泵和第一辐射器的管道。一些实施例的管道被设计成使流体损失最小化。一些实施例可选地包括第一风扇以排除来自第一散热器的热量，和/或用于抵消随着时间的流体损失的体积补偿器。在一些实施例中，至少一个热交换器具有至少一个微尺度结构。一些实施例包括通过使用这种冷却系统来冷却多器件配置的热源的方法。

5. 发明申请

WO2007130644A2 GIMBALLED ATTACHMENT FOR MULTIPLE HEAT EXCHANGERS 审中-公开
标题翻译：吸引多个热交换器的附件
公开(公告)号：WO2007130644A2
公开(公告)日：2007-11-15
申请号：PCT/US2007/010956
申请日：2007-05-04
申请人： COOLIGY INC. , MUNCH, Mark , WERNER, Douglas, E.
发明人： MUNCH, Mark , WERNER, Douglas, E.
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , H01L23/40 , H01L23/433 , H01L23/4338 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： One or more heat exhangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：一个或多个热交换器使用单个球形接合机构联接到一个或多个热源。接合机构包括万向板和万向接头。万向节接头能够独立地将作用于热交换器的保持力作为单点负载施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向接头到每个热交换器的保持力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

6. 发明申请

WO2006074353A2 FABRICATION OF HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATIONS IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEMS 审中-公开
标题翻译：制造高表面量的比例结构及其在液体冷却系统的微波炉交换器中的集成
公开(公告)号：WO2006074353A2
公开(公告)日：2006-07-13
申请号：PCT/US2006/000434
申请日：2006-01-06
申请人： COOLIGY, INC. , DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
发明人： DATTA, Madhav , MCMASTER, Mark , BREWER, Rick , ZHOU, Peng , TSAO, Paul , UPADHAYA, Girish , MUNCH, Mark
IPC分类号： F28F7/00
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

7. 发明申请

WO2005122662A3 SEMI-COMPLIANT JOINING MECHANISM FOR SEMICONDUCTOR COOLING APPLICATIONS 审中-公开
公开(公告)号：WO2005122662A3
公开(公告)日：2005-12-22
申请号：PCT/US2005/016879
申请日：2005-05-12
申请人： COOLIGY, INC. , BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
发明人： BREWER, Richard, G. , TSAO, Paul , HERMS, Richard , MUNCH, Mark , MCMASTER, Mark , CORBIN, Dave
IPC分类号： H05K7/20
摘要： A heat coolection apparatus (100) is mounted to the heat source (20) using a gimbal plate (150) which includes a gimbal joint (301).

8. 发明申请

WO2007056599A3 LIQUID COOLING FOR BACKLIT DISPLAYS 审中-公开
公开(公告)号：WO2007056599A3
公开(公告)日：2007-05-18
申请号：PCT/US2006/043999
申请日：2006-11-09
申请人： COOLIGY, INC. , MUNCH, Mark , UPADHYA, Girish
发明人： MUNCH, Mark , UPADHYA, Girish
IPC分类号： H01L23/467
摘要： The present invention provides a cooling system for a backlit device. The cooling system has a first heat collector that comprises a micro tube. The first heat collector is for maintaining contact with the backlit device. The cooling system also has a first radiator, a first pump, an interconnecting tubing, a fluid, and optionally a fan and/or a reservoir. The first radiator is for distributing and/or dispersing heat, the first pump is for driving a fluid flow, and the reservoir is for storing the fluid. The interconnect tubing is interposed between the first heat collector, the first radiator, and the first pump to form a closed cooling loop. Some embodiments further provide a method of cooling a backlit device by using such a cooling system.

9. 发明申请

WO2006026460A2 PUMPED FLUID COOLING SYSTEM AND METHOD 审中-公开
标题翻译：泵送流体冷却系统及方法
公开(公告)号：WO2006026460A2
公开(公告)日：2006-03-09
申请号：PCT/US2005/030465
申请日：2005-08-24
申请人： COOLIGY, INC. , WERNER, Douglas , GOODSON, Kenneth , MUNCH, Mark , UPADHYA, Girish
发明人： WERNER, Douglas , GOODSON, Kenneth , MUNCH, Mark , UPADHYA, Girish
IPC分类号： F28F7/00
CPC分类号： F28F9/0263 , F28F3/12 , F28F2260/02
摘要： The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mas increases.
摘要翻译：本发明是一种泵送流体冷却系统和方法。泵送流体冷却系统和方法包括泵送流体系统的电阻的平流，对流和扩散分量的相对量级。泵送流体冷却系统和方法还包括调整工作流体的化学成分，特别是调整组成和粘度，因为每单位流体热容量的敏感度增加。

10. 发明申请

WO2005121681A2 COUNTER FLOW MICRO HEAT EXCHANGER FOR OPTIMAL PERFORMANCE 审中-公开
标题翻译：逆流微型热交换器的最佳性能
公开(公告)号：WO2005121681A2
公开(公告)日：2005-12-22
申请号：PCT/US2005/016875
申请日：2005-05-12
申请人： COOLIGY, INC. , MUNCH, Mark , UPADHYA, Girish
发明人： MUNCH, Mark , UPADHYA, Girish
IPC分类号： F28F3/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
摘要翻译：微型热交换器和集成电路根据逆流取向。为了确定该取向，确定集成电路的温度梯度。温度梯度用于确定优选地表示从集成电路的热部分到冷部分的方向定向的温度矢量。微型热交换器循环冷却流体以接收从集成电路传递的热量。确定该冷却液的定向流动。定向流量作为从微型热交换器的入口到出口的方向矢量进行测量。逆流方向被定义为与定向流相反的温度矢量。

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