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1. 发明申请

WO2004038318A2 VAPOR ESCAPE MICROCHANNEL HEAT EXCHANGER 审中-公开
标题翻译：蒸馏器微通道热交换器
公开(公告)号：WO2004038318A2
公开(公告)日：2004-05-06
申请号：PCT/US2003/032020
申请日：2003-10-07
申请人： COOLIGY, INC.
发明人： ZHOU, Peng , SANTIAGO, Juan, G. , GOODSON, Kenneth
IPC分类号： F28D15/00
CPC分类号： H01L23/4275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor escape membrane for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device, the vapor escape membrane comprising: a porous surface for removing vapor produced from the liquid in the cooling region, the membrane configured to confine the liquid in the cooling region, the membrane configured to confine the liquid only within the cooling region. The vapor escape membrane transfers vapor to a vapor region within the heat exchanging device, wherein the membrane is configured to prevent liquid in the cooling region from entering the vapor region. The membrane is configured to include a hydrophobic surface between the membrane and the cooling region, wherein the liquid in the cooling region does not flow through the porous surface. The vapor escape membrane includes a plurality of apertures for allowing vapor to transfer therethrough, each of the apertures having a predetermined dimension.
摘要翻译：一种用于热交换装置的蒸气逸出膜（112），包括将液体运送到与发热装置相邻的冷却区域中的热管或散热器，所述蒸汽逸出膜构造成仅将液体限制在冷却地区。蒸汽逸出膜将蒸气转移到热交换装置内的蒸气区域，其中膜被构造成防止冷却区域中的液体进入蒸气区域。膜被配置为在膜和冷却区域之间包括疏水表面，其中冷却区域中的液体不会流过多孔表面。蒸汽逸出膜包括用于允许蒸汽从其中转移的多个孔（105），每个孔具有预定尺寸。

2. 发明申请

WO2004036040A1 MICRO-FABRICATED ELECTROKINETIC PUMP WITH ON-FRIT ELECTRODE 审中-公开
标题翻译：带微型电极的微型电动泵
公开(公告)号：WO2004036040A1
公开(公告)日：2004-04-29
申请号：PCT/US2003/030177
申请日：2003-09-23
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , SHOOK, James, Gill , ZENG, Shulin , LENEHAN, Daniel, J. , SANTIAGO, Juan, G. , LOVETTE, James
IPC分类号： F04B17/00
CPC分类号： F04B19/006 , F04B17/00 , F28D15/00 , F28F2250/08
摘要： An electroosmotic pump (300) has a porous structure (302) adapted to pump fluid through fluid channels (304, 305). The porous structure has a first side (308) and a second side (306) between which are provided the fluid channels (304, 305). A first continous layer of electrically conductive material (312) is deposited on the first side and a second continous layer of electrically conductive material (310) is deposited on the second side. The first and second layers (312, 310) are connected to a power source (318). The power source supplies a voltage differential between the first and the second layers to drive fluid through the porous structure at a desired flow rate. One embodiment discloses the continuous layers (312, 310) as being thin film electrodes having a thickness between 200 and 10,000 Angstroms.
摘要翻译：电渗泵（300）具有适于将流体泵送通过流体通道（304,305）的多孔结构（302）。多孔结构具有第一侧面（308）和第二侧面（306），两者之间设有流体通道（304,305）。导电材料（312）的第一连续层沉积在第一侧上，并且第二连续的导电材料层（310）沉积在第二侧上。第一和第二层（312,310）连接到电源（318）。电源在第一和第二层之间提供电压差，以期望的流速驱动流体通过多孔结构。一个实施例公开了作为薄膜电极的连续层（312,310），其厚度在200和10,000埃之间。

3. 发明申请

WO2004027262A2 MICRO-FABRICATED ELECTROKINETIC PUMP 审中-公开
标题翻译：微型电动泵
公开(公告)号：WO2004027262A2
公开(公告)日：2004-04-01
申请号：PCT/US2003/030179
申请日：2003-09-23
申请人： COOLIGY, INC.
发明人： CORBIN, David , KENNETH, Goodson, E. , KENNY, Thomas, William, Jr. , ZENG, Shulin , SANTIAGO, Juan, G.
IPC分类号： F04B
CPC分类号： F04B17/00 , F04B19/006
摘要： An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.
摘要翻译：用于泵送液体的电动泵包括具有多个窄的，短的和直的孔隙的泵送体，用于将液体引导通过身体。用于施加电压差的一对电极形成在孔隙的相对端处的泵体的相对表面上。泵体形成在支撑结构上以保持泵体的机械完整性。泵可以使用常规的半导体处理步骤制造。优选使用等离子体蚀刻形成孔。该结构被氧化以使结构绝缘并且还使孔变窄。通过蚀刻衬底并除去界面氧化物层形成支撑结构。形成电极以在泵体上施加电压电位。制造电动泵的另一种方法包括提供蚀刻停止对准标记，使得蚀刻步骤自我终止。

4. 发明申请

WO2004083742A2 BOILING TEMPERATURE DESIGN IN PUMPED MICROCHANNEL COOLING LOOPS 审中-公开
标题翻译：泵送微通道冷却机的沸腾温度设计
公开(公告)号：WO2004083742A2
公开(公告)日：2004-09-30
申请号：PCT/US2004/006746
申请日：2004-03-05
申请人： COOLIGY, INC.
发明人： ZHOU, Peng , ZENG, Shulin , KENNY, Thomas, W., Jr. , MUNCH, Mark , UPADHYA, Girish , GOODSON, Kenneth , SANTIAGO, Juan, G.
IPC分类号： F25B
CPC分类号： H01L23/473 , F28D15/0266 , F28D15/06 , H01L2924/0002 , H01L2924/00
摘要： A method of cooling at least one heat generating device using a cooling system is disclosed. The method comprises the steps of using at least one pump to cause a fluid to flow in at least on heat exchanger and adjusting a pressure of the fluid to correspondingly adjust a boiling point temperature of the fluid in the at least one heat exchanger. The method can also include the step of providing at least one heat rejector for rejecting heat from the system, the at least one heat rejector being situated downstream of the at least one heat exchanger. The step of adjusting a pressure of the fluid can comprise adjusting a pressure of the fluid during charging and sealing of the system. Further, the step of adjusting a pressure of the fluid can comprise adjusting a composition and volume of a gas and liquid introduced during charging of the system.
摘要翻译：公开了一种使用冷却系统来冷却至少一个发热装置的方法。该方法包括以下步骤：使用至少一个泵来使流体至少在热交换器上流动并且调节流体的压力以相应地调节至少一个热交换器中的流体的沸点温度。该方法还可以包括提供至少一个散热器以排除来自系统的热的步骤，所述至少一个热排出器位于至少一个热交换器的下游。调节流体压力的步骤可以包括在系统充电和密封期间调节流体的压力。此外，调节流体压力的步骤可以包括调节在系统充电期间引入的气体和液体的组成和体积。

5. 发明申请

WO2003067630A3 SYSTEM INCLUDING POWER CONDITIONING MODULES 审中-公开
公开(公告)号：WO2003067630A3
公开(公告)日：2003-08-14
申请号：PCT/US2003/002869
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , KIM, John, J. , CHAPLINSKY, Robert, C. , EVERETT, George, Carl, Jr.
IPC分类号： H05K1/18
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module (100), affixed to an integrated circuit device (200), conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate (102) having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias (104a -104h), to provide electrical connection between the first interface and the second interface, and a first set of pads (106i -106p), disposed on the first interface and a second set of pads (106a - 106h ) disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry (112), disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

6. 发明申请

WO2003067630A2 SYSTEM INCLUDING POWER CONDITIONING MODULES 审中-公开
标题翻译：包括功率调节模块的系统
公开(公告)号：WO2003067630A2
公开(公告)日：2003-08-14
申请号：PCT/US2003/002869
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , KIM, John, J. , CHAPLINSKY, Robert, C. , EVERETT, George, Carl, Jr.
IPC分类号： H01L
CPC分类号： G06F1/26 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73257 , H01L2924/00014 , H01L2924/00
摘要： In one aspect, the present invention is a technique of, and a system for, conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译：一方面，本发明是用于消费设备的功率调节的技术和系统。在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。每个焊盘连接到第一或第二接口上的对应的一个接口通孔。功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。电路可以设置在第一接口，第二接口或两个接口上。此外，电路包括至少一个电压调节器和至少一个电容器。

7. 发明申请

WO2003067730A3 POWER CONDITIONING MODULE 审中-公开
公开(公告)号：WO2003067730A3
公开(公告)日：2003-08-14
申请号：PCT/US2003/002868
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , EVERETT, George, Carl, Jr.
IPC分类号： H05K1/18
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module (100), affixed to an integrated circuit device (200), conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate (102) having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias (104a-104h), to provide electrical connection between the first interface and the second interface, and a first set of pads (106I-106p), disposed on the first interface and a second set of pads (106a-106h) disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry (112), disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

8. 发明申请

WO2003067730A2 POWER CONDITIONING MODULE 审中-公开
标题翻译：功率调节模块
公开(公告)号：WO2003067730A2
公开(公告)日：2003-08-14
申请号：PCT/US2003/002868
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , EVERETT, George, Carl, Jr.
IPC分类号： H02J
CPC分类号： G06F1/26 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73257 , H01L2924/00014 , H01L2924/00
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译：一方面，本发明是一种用于调节消耗装置的功率的技术和系统。在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。每个焊盘连接到第一或第二接口上的对应的一个接口通孔。功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。电路可以设置在第一接口，第二接口或两个接口上。此外，电路包括至少一个电压调节器和至少一个电容器。

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