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1. 发明申请

WO2004027262A2 MICRO-FABRICATED ELECTROKINETIC PUMP 审中-公开
标题翻译：微型电动泵
公开(公告)号：WO2004027262A2
公开(公告)日：2004-04-01
申请号：PCT/US2003/030179
申请日：2003-09-23
申请人： COOLIGY, INC.
发明人： CORBIN, David , KENNETH, Goodson, E. , KENNY, Thomas, William, Jr. , ZENG, Shulin , SANTIAGO, Juan, G.
IPC分类号： F04B
CPC分类号： F04B17/00 , F04B19/006
摘要： An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.
摘要翻译：用于泵送液体的电动泵包括具有多个窄的，短的和直的孔隙的泵送体，用于将液体引导通过身体。用于施加电压差的一对电极形成在孔隙的相对端处的泵体的相对表面上。泵体形成在支撑结构上以保持泵体的机械完整性。泵可以使用常规的半导体处理步骤制造。优选使用等离子体蚀刻形成孔。该结构被氧化以使结构绝缘并且还使孔变窄。通过蚀刻衬底并除去界面氧化物层形成支撑结构。形成电极以在泵体上施加电压电位。制造电动泵的另一种方法包括提供蚀刻停止对准标记，使得蚀刻步骤自我终止。

2. 发明申请

WO2003067630A3 SYSTEM INCLUDING POWER CONDITIONING MODULES 审中-公开
公开(公告)号：WO2003067630A3
公开(公告)日：2003-08-14
申请号：PCT/US2003/002869
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , KIM, John, J. , CHAPLINSKY, Robert, C. , EVERETT, George, Carl, Jr.
IPC分类号： H05K1/18
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module (100), affixed to an integrated circuit device (200), conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate (102) having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias (104a -104h), to provide electrical connection between the first interface and the second interface, and a first set of pads (106i -106p), disposed on the first interface and a second set of pads (106a - 106h ) disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry (112), disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

3. 发明申请

WO2003067630A2 SYSTEM INCLUDING POWER CONDITIONING MODULES 审中-公开
标题翻译：包括功率调节模块的系统
公开(公告)号：WO2003067630A2
公开(公告)日：2003-08-14
申请号：PCT/US2003/002869
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , KIM, John, J. , CHAPLINSKY, Robert, C. , EVERETT, George, Carl, Jr.
IPC分类号： H01L
CPC分类号： G06F1/26 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73257 , H01L2924/00014 , H01L2924/00
摘要： In one aspect, the present invention is a technique of, and a system for, conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译：一方面，本发明是用于消费设备的功率调节的技术和系统。在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。每个焊盘连接到第一或第二接口上的对应的一个接口通孔。功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。电路可以设置在第一接口，第二接口或两个接口上。此外，电路包括至少一个电压调节器和至少一个电容器。

4. 发明申请

WO2004042303A2 INTERWOVEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANNEL HEAT EXCHANGERS 审中-公开
标题翻译：用于微通道换热器降低压降的交互式流体管道
公开(公告)号：WO2004042303A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/032128
申请日：2003-10-10
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , SHOOK, James, Gill , MUNCH, Mark , UPADHYA, Girish , ZHOU, Peng , KENNETH, Goodson, E. , CORBIN, David
IPC分类号： F28D
CPC分类号： F28D15/0266 , F04B19/006 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
摘要翻译：微通道热交换器，其耦合到热源并且被配置用于冷却热源，所述热源包括用于将第一温度的流体提供到热交换区域的第一组指状物，其中热交换区域中的流体流向第二组指状物并在第二温度下离开热交换器，其中每个指状物与相邻指状物间隔开适当的尺寸以最小化热交换器中的压降并且平行布置。微通道热交换器包括具有热交换区域的界面层。优选地，歧管层包括第一组指状物和第二组指状物，其配置在内以冷却热源中的热点。或者，界面层包括沿热交换区域配置的第一组和第二组指状物。

5. 发明申请

WO2004042302A2 CHANNELED FLAT PLATE FIN HEAT EXCHANGE SYSTEM, DEVICE AND METHOD 审中-公开
标题翻译：通道平板翅片热交换系统，装置和方法
公开(公告)号：WO2004042302A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/035432
申请日：2003-10-31
申请人： COOLIGY, INC.
发明人： UPADHYA, Girish , HERMS, Richard , ZHOU, Peng , KENNETH, Goodson, E.
IPC分类号： F28C
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
摘要翻译：公开了一种用于流体冷却通道式热交换装置的装置，方法和系统。流体冷却通道热交换装置利用通过通道热交换器循环的流体，用于高散热和每单位体积的传递面积。该装置包括高导热性材料，优选小于200W / m-K。优选的通道热交换器包括两个联接的平板和耦合到平板的多个翅片。至少一个板优选地接收处于加热状态的流体的流动。流体优选地承载来自热源（例如CPU）的热量。具体地，至少一个板优选地包括多个冷凝器通道，其构造成在加热状态下接收，冷凝和冷却流体。处于较冷状态的流体优选从装置运送到热源，从而冷却热源。

6. 发明申请

WO2004042313A1 METHOD AND APPARATUS FOR FLEXIBLE FLUID DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于在热生产装置中冷却所需热水嘴的柔性流体输送的方法和装置
公开(公告)号：WO2004042313A1
公开(公告)日：2004-05-21
申请号：PCT/US2003/032178
申请日：2003-10-09
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , SHOOK, James, Gill , MUNCH, Mark , UPADHYA, Girish , ZHOU, Peng , KENNETH, Goodson, E. , CORBIN, David
IPC分类号： F28F7/00
CPC分类号： G06Q20/20 , F04B17/00 , F04B19/006 , F28D15/0266 , F28D21/0015 , F28F3/12 , F28F13/06 , F28F2210/10 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer (102) for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer (106) for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically (118) and horizontally (105). The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
摘要翻译： 1.一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层（102），所述界面层具有适当的导热性和用于向界面层提供流体的歧管层（106）其中所述歧管层被配置为优选地通过冷却界面热点区域来实现所述热源中的温度均匀性。多个流体端口被配置到诸如入口端口和出口的热交换器，由此流体端口被垂直（118）和水平（105）配置。歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

7. 发明申请

WO2004042297A2 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042297A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/033749
申请日：2003-10-22
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , MUNCH, Mark , ZHOU, Peng , SHOOK, James, Gill , UPADHYA, Girish , KENNETH, Goodson, E. , CORBIN, Dave , MCMASTER, Mark , LOVETTE, James
IPC分类号： F25D
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

8. 发明申请

WO2004042304A2 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042304A2
公开(公告)日：2004-05-21
申请号：PCT/US2003/034742
申请日：2003-10-30
申请人： COOLIGY, INC.
发明人： KENNETH, Goodson, E. , KENNY, Thomas, William, Jr. , ZHOU, Peng , UPADHYA, Girish , MUNCH, Mark , McMASTER, Mark , HOM, James , SHOOK, James, Gill , CORBIN, David , LOVETTE, James
IPC分类号： F28D
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a heat source configured along a lane. The heat exchanger comprises an interface layer that perform thermal exchanger with the heat source and configured to pass fluid from a first side to a second side. The manifold layer comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer coupled to the first layer and in contact with the second side to the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着车道配置的热源的方法和装置。热交换器包括界面层，该界面层与热源一起执行热交换器，并被配置为将流体从第一侧传送到第二侧。歧管层包括与热源接触的第一层，并且具有适当的导热性以将热量传递到界面层。歧管层还包括耦合到第一层并与第二侧接触到界面层的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

9. 发明申请

WO2003067730A3 POWER CONDITIONING MODULE 审中-公开
公开(公告)号：WO2003067730A3
公开(公告)日：2003-08-14
申请号：PCT/US2003/002868
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , EVERETT, George, Carl, Jr.
IPC分类号： H05K1/18
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module (100), affixed to an integrated circuit device (200), conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate (102) having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias (104a-104h), to provide electrical connection between the first interface and the second interface, and a first set of pads (106I-106p), disposed on the first interface and a second set of pads (106a-106h) disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry (112), disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

10. 发明申请

WO2003067730A2 POWER CONDITIONING MODULE 审中-公开
标题翻译：功率调节模块
公开(公告)号：WO2003067730A2
公开(公告)日：2003-08-14
申请号：PCT/US2003/002868
申请日：2003-01-31
申请人： COOLIGY, INC.
发明人： KENNY, Thomas, William, Jr. , KENNETH, Goodson, E. , SANTIAGO, Juan, G. , EVERETT, George, Carl, Jr.
IPC分类号： H02J
CPC分类号： G06F1/26 , H01L2224/05554 , H01L2224/16225 , H01L2224/48091 , H01L2224/48465 , H01L2224/49175 , H01L2224/73257 , H01L2924/00014 , H01L2924/00
摘要： In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.
摘要翻译：一方面，本发明是一种用于调节消耗装置的功率的技术和系统。在这方面，固定到集成电路装置的功率调节模块调节要施加到集成电路装置的功率。功率调节模块包括具有第一接口和第二接口的半导体衬底，其中第一接口与第二接口相对。所述功率调节模块还包括多个接口通路，以在所述第一接口和所述第二接口之间提供电连接，以及设置在所述第一接口上的第一组焊盘以及设置在所述第二接口上的第二组焊盘。每个焊盘连接到第一或第二接口上的对应的一个接口通孔。功率调节模块还包括设置在半导体衬底内的电路，以调节要施加到集成电路器件的功率。电路可以设置在第一接口，第二接口或两个接口上。此外，电路包括至少一个电压调节器和至少一个电容器。

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