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1. 发明专利

IL274853D0 Tool, work management device, work management method, and work management system 未知
公开(公告)号：IL274853D0
公开(公告)日：2020-07-30
申请号：IL27485320
申请日：2020-05-21
申请人： CONNECTEC JAPAN CORP , FUJIKIN KK , HORIKAWA KAZUTOSHI , NEBASHI TORU , MACHIDA HIDEKAZU , SHIMOISHIZAKA NOZOMI , HARADA AKIHIRO , OCHIISHI MASAHIKO , YAMATO YOSHIAKI , KARUBE HIROKI , KOYOMOGI MUTSUNORI , SHINOHARA TSUTOMU
发明人： HORIKAWA KAZUTOSHI , NEBASHI TORU , MACHIDA HIDEKAZU , SHIMOISHIZAKA NOZOMI , HARADA AKIHIRO , OCHIISHI MASAHIKO , YAMATO YOSHIAKI , KARUBE HIROKI , KOYOMOGI MUTSUNORI , SHINOHARA TSUTOMU
IPC分类号： B25B13/36
摘要： A tool is equipped with a torque sensor, suited for a tightening task of a fastening component of a device such as a fluid control system that requires a large number of fastening components for assembly and has a narrow space for access to the fastening components, and capable of automatically detecting a tightening torque. The tool includes a torque sensor capable of detecting a tightening torque for tightening a fastening component acting on a bit. The torque sensor initiates measurement of the tightening torque when the tightening torque detected exceeds a set threshold value, completes measurement when the tightening torque detected falls below the set threshold value and a set time elapses, and outputs torque-related data formed on the basis of measurement data from measurement initiation to measurement completion and including a measurement time. The torque-related data includes a peak value of the measurement data.

2. 发明专利

SG11202005033UA TOOL, TASK MANAGEMENT DEVICE, TASK MANAGEMENT METHOD, AND TASK MANAGEMENT SYSTEM 未知
公开(公告)号：SG11202005033UA
公开(公告)日：2020-06-29
申请号：SG11202005033U
申请日：2018-12-03
申请人： CONNECTEC JAPAN CORP , FUJIKIN KK
发明人： HORIKAWA KAZUTOSHI , NEBASHI TORU , MACHIDA HIDEKAZU , SHIMOISHIZAKA NOZOMI , HARADA AKIHIRO , OCHIISHI MASAHIKO , YAMATO YOSHIAKI , KARUBE HIROKI , KOYOMOGI MUTSUNORI , SHINOHARA TSUTOMU
IPC分类号： B25B23/14 , G05B19/418
摘要： A tool is equipped with a torque sensor, suited for a tightening task of a fastening component of a device such as a fluid control system that requires a large number of fastening components for assembly and has a narrow space for access to the fastening components, and capable of automatically detecting a tightening torque. The tool includes a torque sensor capable of detecting a tightening torque for tightening a fastening component acting on a bit. The torque sensor initiates measurement of the tightening torque when the tightening torque detected exceeds a set threshold value, completes measurement when the tightening torque detected falls below the set threshold value and a set time elapses, and outputs torque-related data formed on the basis of measurement data from measurement initiation to measurement completion and including a measurement time. The torque-related data includes a peak value of the measurement data.

3. 发明专利

JP2014033059A Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2014033059A
公开(公告)日：2014-02-20
申请号：JP2012172396
申请日：2012-08-02
申请人： Connectec Japan Corp , コネクテックジャパン株式会社
发明人： SHIMOISHIZAKA NOZOMI , NAKANO TAKAHIRO , HIRATA KATSUNORI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To reduce a position shift between an electrode of a semiconductor element and a wiring board due to dimensional changes of the wiring board in flip-chip mounting.SOLUTION: A wiring board 31 comprises: first, second, third, fourth element electrode rows 9, 11, 13, 15 of a semiconductor element 3 from the external side of a region of the semiconductor element; and first, second, third, fourth of bonding wiring rows 4, 6, 5, 7 for bonded to the element electrode rows respectively. A pitch between each of conductor wiring forming the first and third bonding wiring rows continuously changes so as to be wider than a pitch between the first and third element electrode rows in external side of the semiconductor element region and to be narrower than the pitch between the first and third element electrode rows at a tip on a center side of the semiconductor element. A pitch between each of conductor wiring forming the second and fourth bonding wiring rows continuously changes so as to be narrower than a pitch between the second and fourth element electrode rows in external side of the semiconductor element region and to be wider than the pitch between the second and fourth element electrode rows at the tip on the center side of the semiconductor element.
摘要翻译：要解决的问题：为了减少倒装芯片安装中由于布线板的尺寸变化导致的半导体元件的电极和布线板之间的位置偏移。解决方案：布线板31包括：第一，第二，第三，第四半导体元件3的从半导体元件的区域的外侧的元件电极列9,11,13,15; 以及用于分别结合到元件电极列的键合布线行4,6,5,7的第一，第二，第三和第四。形成第一和第三接合布线的导线之间的间距连续地变化，以比半导体元件区的外侧的第一和第三元件电极列之间的间距宽，并且比第在半导体元件的中心侧的尖端处的第一和第三元件电极列。形成第二和第四接合布线列的每个导体布线之间的间距连续变化，以便比半导体元件区域的外侧中的第二和第四元件电极列之间的间距更窄，并且宽于第二和第四元件电极列在半导体元件的中心侧的尖端处。

4. 发明专利

JP2014033058A Semiconductor device and method for manufacturing the same 审中-公开
公开(公告)号：JP2014033058A
公开(公告)日：2014-02-20
申请号：JP2012172383
申请日：2012-08-02
申请人： Connectec Japan Corp , コネクテックジャパン株式会社
发明人： SHIMOISHIZAKA NOZOMI , NAKANO TAKAHIRO , HIRATA KATSUNORI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To reduce a position shift between an electrode of a semiconductor element and a wiring board due to dimensional changes of the wiring board in flip-chip mounting.SOLUTION: A wiring board 31 comprises: first, second, third, fourth element electrode rows 9, 11, 13, 15 of a semiconductor element 3 from the external side of a region of the semiconductor element; and first, second, third, fourth of bonding wiring rows 4, 6, 5, 7 for bonded to the element electrode rows respectively. A pitch between each of conductor wiring forming the first and third bonding wiring rows continuously changes so as to be wider than a pitch between the first and third element electrode rows in external side of the semiconductor element region and to be narrower than the pitch between the first and third element electrode rows at a tip on a center side of the semiconductor element. A pitch between each of conductor wiring forming the second and fourth bonding wiring rows continuously changes so as to be narrower than a pitch between the second and fourth element electrode rows in external side of the semiconductor element region and to be wider than the pitch between the second and fourth element electrode rows at the tip on the center side of the semiconductor element.

5. 发明专利

JP2011171720A Mounting substrate, production method thereof, electronic component, and production method thereof 有权
标题翻译：安装基板，其制造方法，电子部件及其制造方法
公开(公告)号：JP2011171720A
公开(公告)日：2011-09-01
申请号：JP2011006601
申请日：2011-01-17
申请人： Connectec Japan Corp , コネクテックジャパン株式会社
发明人： NAKANO TAKAHIRO , SHIMOISHIZAKA NOZOMI , HIRATA KATSUNORI
IPC分类号： H01L23/12 , H01L21/60
CPC分类号： H01L24/27 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/15787 , H01L2924/15788 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a mounting substrate and an electronic component capable of, ensuring highly reliable connection, and also to provide production methods for them.
SOLUTION: A bump portion 15a with a mountain shape is formed by screen-printing Ag paste on a ceramic substrate 10 (base material) formed with wiring 11 (conductor). The bump portion 15a is preferably straddling to the wiring 11 and the ceramic substrate 10. Electroless plating is applied to the surface of the bump portion 15a to form a bump membrane 15b. Then, the mounting substrate B is formed. Afterward, components to be mounted such as a semiconductor chip are mounted on the mounting substrate B by using a fixing member, and the wiring 11 and an exterior conductor are electrically connected with a bump 15. Printing method can be used to ensure highly reliable connection by the thick bump 15.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够确保高度可靠的连接的安装基板和电子部件，并且还提供它们的制造方法。解决方案：通过在由布线11（导体）形成的陶瓷基板10（基材）上丝网印刷Ag浆料形成具有山形的凸起部分15a。突起部分15a优选地跨接到布线11和陶瓷基板10。将无电镀施加到凸块部分15a的表面以形成凸块膜15b。然后，形成安装基板B. 之后，通过使用固定构件将诸如半导体芯片等要安装的部件安装在安装基板B上，并且布线11和外部导体与凸块15电连接。可以使用打印方法来确保高度可靠的连接通过厚厚的凸点15.版权所有（C）2011，JPO＆INPIT

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