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    • 2. 发明申请
    • MICROBATTERY COMPRISING THROUGH-CONNECTIONS AND PRODUCTION METHOD THEREOF
    • 包含通过连接的微型计算机及其生产方法
    • WO2006024721A2
    • 2006-03-09
    • PCT/FR2005001771
    • 2005-07-08
    • COMMISSARIAT ENERGIE ATOMIQUELAURENT JEAN-YVESSALOT RAPHAELMARSACQ DIDIERZUSSY MARC
    • LAURENT JEAN-YVESSALOT RAPHAELMARSACQ DIDIERZUSSY MARC
    • H01M10/04H01M4/04H01M10/052H01M10/0562H01M10/0585H01M10/36
    • H01M10/0585H01M2/0257H01M4/0421H01M6/40H01M10/0436H01M10/052H01M10/0562Y10T29/49115
    • The invention relates to a microbattery comprising through-connections and to the production method thereof. The inventive microbattery comprises a support (1) having a front face (2) and a rear face (3) and first (4) and second (5) current collectors which are disposed on the front face (2) of the support (1). A stack comprising a cathode (8) and an anode (6) which are separated by an electrolyte (7) is disposed on the current collectors (4 and 5). The anode (6) and the cathode (8) are in contact with the first (4) and second (5) current collectors respectively. The aforementioned stack is covered with a protective layer (9). In addition, the microbattery comprises connections (10) which pass through the support (1) from the front face (2) to the rear face (3) thereof and which are in contact with the first (4) and second (5) current collectors. The stack preferably covers essentially all of the front face (2) of the support (1). The invention also relates to a method of producing the microbattery, which comprises: the etching of cavities in the front face (2) of the support (1), said cavities having a depth less than the thickness of the support (1); the filling of the cavities with a conductive material; and the removal of a layer of the rear face (3) from the support (1), in order to reveal the conductive material contained in the cavities.
    • 本发明涉及一种包括通孔连接的微电池及其制造方法。 本发明的微电池包括具有前表面(2)和后表面(3)的支撑件(1)和设置在支撑件(1)的前表面(2)上的第一(4)和第二(5)集电器 )。 包括由电解质(7)分离的阴极(8)和阳极(6)的堆叠设置在集流器(4和5)上。 阳极(6)和阴极(8)分别与第一集电体(4)和第二集电体(5)接触。 上述叠层被保护层(9)覆盖。 此外,微电池包括从前表面(2)穿过支撑件(1)到其后表面(3)的连接件(10),它们与第一(4)和第二(5)电流接触 收藏家。 堆叠优选地覆盖支撑件(1)的基本上所有的前表面(2)。 本发明还涉及一种生产微电池的方法,其包括:蚀刻支撑体(1)的前表面(2)中的空腔,所述空腔的深度小于支撑件(1)的厚度; 用导电材料填充空腔; 以及从支撑件(1)去除后表面(3)的层,以便露出包含在空腔中的导电材料。