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    • 3. 发明申请
    • ENCAPSULATED MICROSTRUCTURE AND METHOD OF PRODUCING ONE SUCH MICROSTRUCTURE
    • 包封微观结构和生产一种这样的微观结构的方法
    • WO2004058628A3
    • 2004-08-19
    • PCT/FR0350189
    • 2003-12-18
    • COMMISSARIAT ENERGIE ATOMIQUEDIEM BERNARDDELAPIERRE GILLES
    • DIEM BERNARDDELAPIERRE GILLES
    • B81B3/00B81B7/00
    • B81B7/007B81C2203/0145
    • The invention relates to an encapsulated microstructure and to a method of producing one such microstructure. The inventive microstructure comprises a first layer which is insulated from a substrate (6) by an insulting layer (7), said first layer containing: at least one sensitive element (1) which is connected to at least one contact pad (3) by means of an electrical connection (2) and which is protected by a cap (5). According to the invention, the sensitive element (1), the electrical connection (2) and the contact pad (3) form an assembly (10) that is defined in the first layer by at least one channel (11), said assembly (10) being covered by the cap (5). The cap (5), which comprises at least one opening (12) above the contact pad (3), is solidly connected to (i) the contact pad (3) at the periphery of the opening (12) and (ii) an area (9) located beyond the channel (11) in relation to the assembly (10). The invention is suitable for micro-electro-mechanical structures.
    • 本发明涉及一种封装的微结构和一种制造这种微结构的方法。 本发明的微结构包括通过绝缘层(7)与衬底(6)绝缘的第一层,所述第一层包含:至少一个敏感元件(1),其通过至少一个接触垫 电连接(2)的装置并且由帽(5)保护。 根据本发明,敏感元件(1),电连接(2)和接触垫(3)形成通过至少一个通道(11)限定在第一层中的组件(10),所述组件 10)被盖帽(5)覆盖。 包括在接触垫(3)上方的至少一个开口(12)的帽(5)牢固地连接到(i)在开口(12)的周边处的接触垫(3),和(ii) 区域(9)相对于组件(10)位于通道(11)之外。 本发明适用于微机电结构。