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    • 1. 发明申请
    • UNIFIED SIMD PROCESSOR
    • 统一SIMD处理器
    • WO2005037326A2
    • 2005-04-28
    • PCT/GB2004004377
    • 2004-10-13
    • CLEARSPEED TECHNOLOGY PLCSTUTTARD DAVIDWILLIAMS DAVIDPACKER JAMESDAVIDSON COLINHICKEY NEILDAY TIMOTHY
    • STUTTARD DAVIDWILLIAMS DAVIDPACKER JAMESDAVIDSON COLINHICKEY NEILDAY TIMOTHY
    • G06F15/80A61K51/04A61K31/16A61P35/00
    • G06F9/3887G06F9/3885
    • A data processor comprises a single control unit and an integral execution unit adapted to operate on both parallel and scalar data under the same instruction set. The execution unit comprises a SMO part comprising an array of processing elements adapted to operate on the parallel data and a scalar part adapted to operate on the scalar data. Substantially all the instructions are operable on the parallel and/or the scalar data. Preferably, both the scalar part and the SIMD part have a complete range of addressing modes that allow them to support: scalar variables pointing to data in scalar memory; scalar variables pointing to data in memory in the SIMD part of the execution unit; SHVM variables pointing to memory in the SIMD part of the execution unit; and SIMD variables pointing to data in scalar memory. The scalar part, the SIMD part, and I/O means are adapted to be operated in parallel by the same instruction stream.
    • 数据处理器包括单个控制单元和适于在相同指令集下的并行和标量数据上操作的整体执行单元。 执行单元包括SMO部分,其包括适于对并行数据进行操作的处理元件阵列和适于对标量数据进行操作的标量部分。 基本上所有的指令都可以在并行和/或标量数据上操作。 优选地,标量部分和SIMD部分都具有允许它们支持的完整范围的寻址模式:指向标量存储器中的数据的标量变量; 标量变量指向执行单元的SIMD部分中的存储器中的数据; SHVM变量指向执行单元的SIMD部分中的存储器; 和SIMD变量指向标量存储器中的数据。 标量部分,SIMD部分和I / O装置适于由相同的指令流并行操作。
    • 5. 发明申请
    • FIELD SERVICEABLE ELECTRONIC DISPLAY
    • 现场可维修电子显示屏
    • WO2011059793A3
    • 2011-09-09
    • PCT/US2010054616
    • 2010-10-29
    • MRI INCDUNN WILLIAMBEDELL WARELE DONWILLIAMS DAVID
    • DUNN WILLIAMBEDELL WARELE DONWILLIAMS DAVID
    • H04N5/64
    • H04N5/64A47B81/06H05K5/0017H05K5/0204H05K5/0221H05K5/0226H05K5/06Y10T29/4973
    • An electronic display which can be serviced without having to remove the display from its mounted position. A front housing and a rear housing are hingedly attached so that the front housing can rotate and allow access to the interior of the display. An axial force mechanism can be used to aid in rotating the front housing to an open position. A locking collar, support member, or axial locking member may be used to ensure that the front housing remains open. A removable front glass assembly or removable glass panel may be used with an exemplary embodiment. The front glass assembly or glass panel can be easily replaced if it becomes damaged by minimally- trained personnel. Gutters may be used between the front and rear housing as well as the front housing and front glass assembly to ensure an adequate seal against contaminates.
    • 一种电子显示器,可以在不必将显示器从其安装位置移除的情况下进行维修。 前壳体和后壳体铰接地连接,使得前壳体可以旋转并允许进入显示器的内部。 可以使用轴向力机构来帮助将前壳体旋转到打开位置。 可以使用锁定环,支撑构件或轴向锁定构件来确保前壳体保持打开。 可以使用可拆卸的前玻璃组件或可移除的玻璃面板,其中示例性实施例。 如果受到受过训练的人员造成损坏,前玻璃组件或玻璃面板可以轻松更换。 可以在前壳体和后壳体以及前壳体和前玻璃组件之间使用沟槽,以确保对污染物的足够的密封。
    • 6. 发明申请
    • COMBINED SERIAL/PARALLEL LED CONFIGURATION AND SINGLE LAYER PCB CONTAINING THE SAME
    • 组合式串行/并行LED配置和包含此功能的单层PCB
    • WO2010085748A3
    • 2010-09-30
    • PCT/US2010021988
    • 2010-01-25
    • MFG RESOURCES INT INCDUNN WILLIAMWILLIAMS DAVID
    • DUNN WILLIAMWILLIAMS DAVID
    • H05B37/02
    • H05B33/0821
    • An LED circuit using a combination of series and parallel arrangements for optimum current sharing between LEDs. The current paths allow an LED to fail without resulting in other LEDs failure or noticeable luminance variance across the circuit. Some embodiments use metallic PCB technology which permits optimum thermal regulation of heat generated by the LEDs. Exemplary embodiments can be used with a single-layer PCB where only one layer of conducting material must be placed on the substrate. This results in a thinner, lighter, and cheaper assembly. The rear surface of the PCB may contain heat sinks or fins and may have air (or other gaseous matter) moved across the surface and/or heat sinks to facilitate cooling of the assembly. An LCD assembly using the same is also disclosed.
    • 采用串联和并联配置组合的LED电路,可实现LED之间的最佳电流分配。 电流路径允许LED发生故障,而不会导致其他LED发生故障或整个电路发生明显的亮度变化。 一些实施例使用金属PCB技术,其允许由LED产生的热量的最佳热调节。 示例性实施例可与单层PCB一起使用,其中仅一层导电材料必须放置在基板上。 这导致更薄,更轻,更便宜的组件。 PCB的后表面可以包含散热器或散热片,并且可以具有移动穿过表面和/或散热器的空气(或其他气体物质)以促进组件的冷却。 还公开了使用其的LCD组件。