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    • 9. 发明申请
    • PICK-AND-PLACE METHOD AND CORRESPONDING PICK-AND-PLACE APPARATUS FOR MOUNTING COMPONENTS ON A SUBSTRATE
    • 拾取和放置方法以及用于安装在基板上的组件的拾光和放置装置
    • WO2009100769A1
    • 2009-08-20
    • PCT/EP2008/052728
    • 2008-03-06
    • AGC FLAT GLASS EUROPE SALEFEVRE, HuguesMARTIN, Eric
    • LEFEVRE, HuguesMARTIN, Eric
    • H05K13/04
    • H05K13/0404
    • The present invention relates to a pick-and-place method and a corresponding pick-and-place apparatus for mounting electronic components, for example surface mounted device (SMD) components, on a substrate, in particular on a large-surface/large-area substrate. According to the invention, the pick-and-place apparatus comprises a material transport and support device (2), an x-y-positioning device (4) with one or several mounted electronic component mounting heads (5), wherein in at least one electronic component mounting head (5) comprises a visual system (8) for identifying form and/or position parameters of the head, substrate and/or component/s, a head rotation or translation system (10), one or several electronic component feeders (12), an electronic component mounting device (16). The apparatus also preferably has an electronic component testing device (18) for directly testing the component after mounting, and a control interface (20) for adjusting the parameters of the apparatus, in particular the form and/or position parameters of the head, substrate and/or component/s.
    • 本发明涉及一种拾取和放置方法和相应的拾取和放置装置,用于将电子部件(例如表面安装器件(SMD)部件)安装在基板上,特别是在大表面/ 区域底物。 根据本发明,拾取和放置装置包括材料输送和支撑装置(2),具有一个或几个安装的电子部件安装头(5)的xy定位装置(4),其中在至少一个电子 部件安装头(5)包括用于识别头部,基底和/或部件的形式和/或位置参数的视觉系统(8),头部旋转或平移系统(10),一个或多个电子部件馈送器 12),电子部件安装装置(16)。 该装置还优选地具有用于在安装之后直接测试部件的电子部件测试装置(18)和用于调节装置的参数的控制接口(20),特别是头部,基板的形式和/或位置参数 和/或组件。