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1. 发明申请

US20100051332A1 CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME 有权
标题翻译：用于安装电子元件的电路基板和具有相同电路元件的电路基板组件
公开(公告)号：US20100051332A1
公开(公告)日：2010-03-04
申请号：US12471396
申请日：2009-05-24
申请人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , MENG-CHIEH HSU , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , MENG-CHIEH HSU , CHENG-HSIEN LIN
IPC分类号： H05K1/02
CPC分类号： H05K1/186 , B82Y10/00 , H01L23/373 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/9222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/18162 , H01L2924/19042 , H05K3/4038 , H05K2201/026
摘要： A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
摘要翻译：电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。通孔被配置为具有安装在其上的电子部件。复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

2. 发明申请

US20100051331A1 CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME 审中-公开
标题翻译：用于安装电子元件的电路基板和具有相同电路元件的电路基板组件
公开(公告)号：US20100051331A1
公开(公告)日：2010-03-04
申请号：US12468841
申请日：2009-05-19
申请人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , HUNG-YI CHANG , CHIA-CHENG CHEN , CHENG-HSIEN LIN
IPC分类号： H05K1/03
CPC分类号： H05K1/056 , B82Y10/00 , H01L23/373 , H01L23/4985 , H01L2224/48091 , H01L2924/01078 , H01L2924/15153 , H01L2924/1517 , H05K1/0204 , H05K1/021 , H05K1/182 , H05K2201/026 , H05K2201/0323 , H01L2924/00014
摘要： A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.
摘要翻译：用于安装电子部件的电路基板包括金属基底层，具有导电迹线的导电层和设置在金属基底层和导电层之间的复合层。复合层包括聚合物基质和嵌入聚合物基质中的多个碳纳米管。复合层具有与金属基底接触的第一表面和相对的第二表面。每个碳纳米管从第一表面延伸到第二表面，相对于第一表面以80°至100°的角度倾斜。

3. 发明申请

US20100038116A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20100038116A1
公开(公告)日：2010-02-18
申请号：US12389521
申请日：2009-02-20
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H05K1/00 , H05K1/09 , H05K3/46 , C25D5/16
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译：印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。铜层在其给定部分包括多个电迹线。加强层的厚度在远离给定部分的方向上增加。在本公开中还提供了制造印刷电路板的方法。

4. 发明申请

US20100003784A1 METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD 有权
标题翻译：打印电路板上电子元件安装方法
公开(公告)号：US20100003784A1
公开(公告)日：2010-01-07
申请号：US12466361
申请日：2009-05-14
申请人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , CHIA-CHENG CHEN , HUNG-YI CHANG , TUNG-YAO KUO , CHENG-HSIEN LIN
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译：一种用于在印刷电路板上组装电子部件的方法包括以下步骤。首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。第三，电子部件安装在主体部分上并与导电图形电连接。第五，去除不想要的部分。

5. 发明申请

US20100044237A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20100044237A1
公开(公告)日：2010-02-25
申请号：US12426276
申请日：2009-04-19
申请人： CHUNG-JEN TSAI , YU-CHENG HUANG , HUNG-YI CHANG , CHENG-HSIEN LIN
发明人： CHUNG-JEN TSAI , YU-CHENG HUANG , HUNG-YI CHANG , CHENG-HSIEN LIN
IPC分类号： C25D5/02 , C25D7/00
CPC分类号： H05K3/427 , H05K3/421 , H05K3/423 , H05K2201/0394 , H05K2201/09563 , H05K2203/025 , H05K2203/0346
摘要： A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled.
摘要翻译：涉及PCB的制造方法。该方法包括向基板提供两个相对的导电层并限定穿过两个导电层的通孔; 使用无电镀工艺在所述通孔中的所述基板的内表面上形成第一导电金属层; 在所述第一导电金属层上使用电镀工艺形成第二导电金属层，直到所述通孔被填充。

6. 发明申请

US20090014031A1 CLEANING APPARATUS 有权
标题翻译：清洁装置
公开(公告)号：US20090014031A1
公开(公告)日：2009-01-15
申请号：US11967006
申请日：2007-12-29
申请人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO , CHENG-HSIEN LIN
发明人： TSO-HUNG YEH , HUNG-YI CHANG , CHIH-LUNG HSIAO , CHENG-HSIEN LIN
IPC分类号： B08B1/02
CPC分类号： H05K3/26 , H05K2203/0143 , H05K2203/0191 , H05K2203/1545
摘要： The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.
摘要翻译：本发明涉及一种用于印刷电路板的清洁装置。清洁装置包括基座，固定到基座的夹板，至少一个保持构件，至少一个清洁辊和驱动机构。保持构件弹性地支撑在基座上。所述至少一个清洁辊分别枢转地设置在所述至少一个保持构件上。清洁辊包括附接到清洁辊的表面的清洁层。夹紧板与清洁辊相对并离开一段距离。所述驱动机构与所述清洁辊连接并构造成驱动所述清洁辊旋转。清洁装置可以高效地清洁印刷电路板。

7. 发明申请

US20090007421A1 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARDS 有权
标题翻译：制造柔性印刷电路板的方法
公开(公告)号：US20090007421A1
公开(公告)日：2009-01-08
申请号：US11959194
申请日：2007-12-18
申请人： CHIA-CHENG CHEN , CHAO-CHING WANG , CHIANG-HUA HUANG , CHENG-HSIEN LIN
发明人： CHIA-CHENG CHEN , CHAO-CHING WANG , CHIANG-HUA HUANG , CHENG-HSIEN LIN
IPC分类号： H01R43/00
CPC分类号： H05K3/281 , H05K1/0269 , H05K1/0393 , H05K3/027 , H05K2201/0355 , H05K2201/09063 , H05K2201/09918 , H05K2203/063 , H05K2203/1545 , H05K2203/166 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.
摘要翻译：提供了制造柔性印刷电路板的示例性方法。从第一供给辊供给金属箔。金属箔在金属箔的两个相对侧上具有第一表面和第二表面。具有限定在其中的多个第一开口的第一覆盖物从第二馈电辊供应并层压在金属箔的第一表面上。用金属箔形成电迹线。具有限定在其中的多个第二开口的第二覆盖物从第三进料辊供应并层压在金属箔的第二表面上。每个第二开口与相应的第一开口对准，使得电迹线从相应的第一和第二开口露出。该方法可以提高以空心形式制造柔性印刷电路板的质量和效率。

8. 发明申请

US20120009669A1 BIFUNCTIONAL COMPOUND WITH MONOSACCHARIDE AND N2S2 LIGAND, AND PREPARATION AND USE THEREOF 有权
标题翻译：具有单糖和N2S2配体的双功能化合物，其制备和使用
公开(公告)号：US20120009669A1
公开(公告)日：2012-01-12
申请号：US13087664
申请日：2011-04-15
申请人： SHOW-WEN LIU , CHENG-HSIEN LIN , YU CHANG , CHENG-FANG HSU , TSYH-LANG LIN
发明人： SHOW-WEN LIU , CHENG-HSIEN LIN , YU CHANG , CHENG-FANG HSU , TSYH-LANG LIN
IPC分类号： C07H15/04 , C12N5/071 , C07K14/00
CPC分类号： C07H15/04
摘要： A bifunctional compound with a monosaccharide and a N2S2 ligand, and more particularly, a bifunctional compound with a N2S2 ligand and aminohexylacetyl galactosamine (ah-GalNAc4) is provided. A method for preparing the bifunctional compound with a monosaccharide and a N2S2 ligand is also provided, including activating a carboxyl group in an organic ligand, reacting the activated carboxyl group with a galactopyranoside through amidation, and then hydrolyzing. The bifunctional compound of the present invention is widely useful in nuclear medicine for preparation of liver imaging agents for assisting in correct diagnosis of diseases.
摘要翻译：提供了具有单糖和N2S2配体的双官能化合物，更具体地，提供了具有N 2 S 2配体和氨基己基乙酰基半乳糖胺（ah-GalNAc 4）的双官能化合物。还提供了用单糖和N 2 S 2配体制备双功能化合物的方法，包括活化有机配体中的羧基，通过酰胺化使活化的羧基与吡喃半乳糖苷反应，然后水解。本发明的双功能化合物在制备用于辅助正确诊断疾病的肝成像剂的核医学中广泛有用。

9. 发明申请

US20110313183A1 METHOD FOR PREPARATION OF N-METHYL-3-(2-TRIBUTYLSTANNYLPHENOXY)-3-PHENYLPROPANAMINE, AND USE THEROF 有权
标题翻译： N-甲基-3-（2-三氟甲基苯氧基）-3-苯基丙胺的制备方法及其用途
公开(公告)号：US20110313183A1
公开(公告)日：2011-12-22
申请号：US13087862
申请日：2011-04-15
申请人： SHOW-WEN LIU , CHENG-HSIEN LIN , TSYH-LANG LIN , CHENG-FANG HSU , YU CHANG
发明人： SHOW-WEN LIU , CHENG-HSIEN LIN , TSYH-LANG LIN , CHENG-FANG HSU , YU CHANG
IPC分类号： C07F7/22 , C07C213/10
CPC分类号： C07F7/2208
摘要： A method for preparation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine is provided, which includes formation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine, useful as a precursor of a norepinephrine transporter (NET) contrast label [123Iodine](R)—N-methyl-3-(2-iodophenoxy)-3-phenylpropanamine ([123I]MIPP) with a leaving group Bu3Sn.
摘要翻译：提供了制备N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺的方法，包括形成N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺，可用作去甲肾上腺素的前体转运蛋白（NET）对比标记物[123碘]（R）-N-甲基-3-（2-碘苯氧基）-3-苯基丙胺（[123 I] MIPP）与离去基团Bu 3 Sn。

10. 发明申请

US20090050354A1 PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
标题翻译：印刷电路板基板和具有该印刷电路板的印刷电路板
公开(公告)号：US20090050354A1
公开(公告)日：2009-02-26
申请号：US12057654
申请日：2008-03-28
申请人： WEN-CHIN LEE , CHENG-HSIEN LIN
发明人： WEN-CHIN LEE , CHENG-HSIEN LIN
IPC分类号： H05K1/03
CPC分类号： H05K1/056 , H05K1/0393 , H05K2201/0355 , H05K2201/0382
摘要： A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
摘要翻译：印刷电路板基板包括绝缘基体和防水层。绝缘矩阵包括与第一表面相对的第一表面和第二表面。防水层形成在绝缘基体中，并且布置在第一表面和第二表面之间，用于阻挡水在绝缘基体的厚度方向上穿过其中。

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