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    • 5. 发明授权
    • Electro-absorptive optical modulator module having monolithic integrated photo detector
    • 具有单片集成光电检测器的吸收光调制器模块
    • US07142343B2
    • 2006-11-28
    • US10837938
    • 2004-05-03
    • In KimYoung-Hyun KimByung-Kwon Kang
    • In KimYoung-Hyun KimByung-Kwon Kang
    • G02F1/03G02F1/07
    • H01S5/12H01S5/0264H01S5/0265H01S5/106H01S5/1064H01S5/1203
    • An electro-absorptive optical modulator module monolithic-integrated on a semiconductor substrate, which includes a distributed feedback laser having a grating for oscillating light and to output the oscillated light through a first end and a second end of the module. An electro-absorptive modulator modulates a first light output through the first end of the distributed feedback laser, and an optical detector provides detection of a second light output through the second end of the module. The optical detector is formed opposite to the second end of the distributed feedback laser on the semiconductor substrate. A first inner window permits attenuation of the intensity of the second light and electrically insulates the distributed feedback laser and the optical detector from each other, with the first inner window being arranged between the distributed feedback laser and the optical detector.
    • 一种单片集成在半导体衬底上的电吸收光调制器模块,其包括具有用于振荡光的光栅的分布式反馈激光器,并且通过模块的第一端和第二端输出振荡的光。 电吸收调制器通过分布式反馈激光器的第一端调制第一光输出,并且光学检测器提供通过模块的第二端的第二光输出的检测。 光检测器形成在半导体衬底上与分布反馈激光器的第二端相对。 第一内部窗口允许衰减第二光的强度并使分布式反馈激光器和光学检测器彼此电绝缘,其中第一内部窗口布置在分布式反馈激光器和光学检测器之间。
    • 7. 发明申请
    • Semiconductor optical device and semiconductor optical package using the same
    • 半导体光学器件和半导体光学封装采用相同的
    • US20050158058A1
    • 2005-07-21
    • US10896343
    • 2004-07-21
    • Yu-Dong BaeByung-Kwon Kang
    • Yu-Dong BaeByung-Kwon Kang
    • H01S5/026G02B6/12G02F1/015H01S5/022H04B10/04H04B10/12
    • G02F1/015G02F2001/0157
    • A semiconductor optical device, which includes a semiconductor substrate, an electro-absorption modulator, and at least one optical device is monolithically integrated on the semiconductor substrate. An insulative layer surrounds the electro-absorption modulator and the optical devices on the semiconductor substrate, at least two metallic pads, one of which being an electrode of the modulator, are formed at a distance from each other on the insulative layer. A plurality of metallic wires are adapted for electrically connecting the electro-absorption modulator to the metallic pads and adjusting a value of inductance of the electro-absorption modulator. The metallic wires are formed on the insulative layer. A dielectric layer formed under the insulative layer provides a minimizing of parasitic capacitance generated in the metallic pads and the metallic wires by being formed under the metallic pads and the metallic wires.
    • 包括半导体衬底,电吸收调制器和至少一个光学器件的半导体光学器件被单片集成在半导体衬底上。 绝缘层围绕电吸收调制器和半导体衬底上的光学器件,至少两个金属焊盘(其中一个是调制器的电极)在绝缘层上形成为彼此距离一定距离。 多个金属线适于将电吸收调制器电连接到金属焊盘并调节电吸收调制器的电感值。 金属线形成在绝缘层上。 形成在绝缘层下面的电介质层通过形成在金属焊盘和金属线下面,使金属焊盘和金属线中产生的寄生电容最小化。
    • 8. 发明授权
    • Semiconductor optical device and semiconductor optical package using the same
    • 半导体光学器件和半导体光学封装采用相同的
    • US07414767B2
    • 2008-08-19
    • US10896343
    • 2004-07-21
    • Yu-Dong BaeByung-Kwon Kang
    • Yu-Dong BaeByung-Kwon Kang
    • G02B1/03
    • G02F1/015G02F2001/0157
    • A semiconductor optical device, which includes a semiconductor substrate, an electro-absorption modulator, and at least one optical device is monolithically integrated on the semiconductor substrate. An insulative layer surrounds the electro-absorption modulator and the optical devices on the semiconductor substrate, at least two metallic pads, one of which being an electrode of the modulator, are formed at a distance from each other on the insulative layer. A plurality of metallic wires are adapted for electrically connecting the electro-absorption modulator to the metallic pads and adjusting a value of inductance of the electro-absorption modulator. The metallic wires are formed on the insulative layer. A dielectric layer formed under the insulative layer provides a minimizing of parasitic capacitance generated in the metallic pads and the metallic wires by being formed under the metallic pads and the metallic wires.
    • 包括半导体衬底,电吸收调制器和至少一个光学器件的半导体光学器件被单片集成在半导体衬底上。 绝缘层围绕电吸收调制器和半导体衬底上的光学器件,至少两个金属焊盘(其中一个是调制器的电极)在绝缘层上形成为彼此距离一定距离。 多个金属线适于将电吸收调制器电连接到金属焊盘并调节电吸收调制器的电感值。 金属线形成在绝缘层上。 形成在绝缘层下面的电介质层通过形成在金属焊盘和金属线下面,使金属焊盘和金属线中产生的寄生电容最小化。