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1. 发明授权

US06544898B2 Method for improved die release of a semiconductor device from a wafer 失效
标题翻译：用于从晶片改进半导体器件脱模的方法
公开(公告)号：US06544898B2
公开(公告)日：2003-04-08
申请号：US09891105
申请日：2001-06-25
申请人： Bruce Polson , Nan Zhang , Howard P. Wilson
发明人： Bruce Polson , Nan Zhang , Howard P. Wilson
IPC分类号： H01L2100
CPC分类号： B81C1/00873 , B81C2201/014
摘要： A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.
摘要翻译：提供了一种微机电（MEMS）器件和MEMS器件的制造方法。制造MEMS器件的方法包括以下步骤：蚀刻具有手柄层的晶片的主手柄层中的裸片释放沟槽，设置在主手柄层上的蚀刻停止层以及设置在蚀刻上的器件层停留层图案化在与主手柄层中的释放沟槽对准的器件层中的释放沟槽; 临时附加手柄层到主手柄层; 蚀刻器件层以限定器件层中的结构; 去除蚀刻停止层; 并移除附加手柄层以释放模具。

2. 发明授权

US5045921A Pad array carrier IC device using flexible tape 失效
标题翻译：垫阵列载体IC器件采用软磁带
公开(公告)号：US5045921A
公开(公告)日：1991-09-03
申请号：US457002
申请日：1989-12-26
申请人： Paul T. Lin , Howard P. Wilson
发明人： Paul T. Lin , Howard P. Wilson
IPC分类号： H01L23/057 , H01L23/495 , H01L23/498 , H05K3/30 , H05K3/36
CPC分类号： H05K3/303 , H01L23/057 , H01L23/49572 , H01L23/49827 , H01L23/4985 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H05K2201/10568 , H05K2201/10681 , H05K2201/10734 , H05K2201/2036 , H05K3/363 , Y02P70/613
摘要： An electronic pad array carrier IC device for mounting on a printed circuit board (PCB) or flex circuit substrate has a thin, flexible "tape" substrate having a plurality of traces. The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement. An integrated circuit die is mounted in proximity with or on the substrate and electrical connections between the integrated circuit chip and the traces are made by any conventional means. The substrate traces are provided at their outer ends with solder balls or pads for making connections to the PCB. A package body covers the die, which body may be optionally used to stand off the package a set distance from the PCB so that the solder balls will form the proper concave structure. Alternatively, a carrier structure may be provided around the periphery of the substrate to add rigidity during handling, testing and mounting, but which may also provide the stand-off function. The thin, flexible substrate can absorb a relatively large lateral or even vertical mechanical displacement over a rather large package area that may accommodate as few as 20 or as many 500 or more connections. The substrate may be optionally transparent or translucent to permit inspection of the bonds after mounting to the PCB. The PCB or flex circuit may also be transparent or translucent for bond inspection purposes. The solder pads or balls may be joined to a via through the substrate at least partially filled with electrically conductive material to permit back side testing of the carrier before or after mounting of the package to the PCB. Additionally, a heat sink structure may be directly bonded to the die in the pad array carrier IC device.
摘要翻译：用于安装在印刷电路板（PCB）或柔性电路基板上的电子焊盘阵列载体IC器件具有具有多个迹线的薄的，柔性的“带”衬底。衬底可以是聚酰亚胺或能承受相对大的横向机械位移的其他材料。集成电路管芯安装在衬底附近或衬底上，并且集成电路芯片和迹线之间的电连接通过任何常规方式制成。衬底迹线在其外端设置有用于连接到PCB的焊球或焊盘。封装体覆盖模具，该主体可以可选地用于将封装与PCB隔开一定距离，使得焊球将形成适当的凹形结构。或者，可以在基板的周边周围设置载体结构，以在处理，测试和安装期间增加刚性，但是也可以提供隔离功能。薄的柔性基底可以在相当大的封装区域上吸收相对较大的侧向或甚至垂直的机械位移，其可以容纳少至20个或多于500个或更多个连接。衬底可以是任选的透明或半透明的，以允许在安装到PCB之后检查焊接。 PCB或柔性电路也可以是透明或半透明的，用于粘合检查目的。焊盘或球可以通过至少部分地填充有导电材料的基板连接到通孔，以允许在将封装安装到PCB之前或之后的载体的背侧测试。此外，散热器结构可以直接接合到焊盘阵列载体IC器件中的管芯。

3. 发明授权

US06621949B2 Fiber optic switch package and a method of assembling a fiber optic switch package having an inverted ring structure 失效
公开(公告)号：US06621949B2
公开(公告)日：2003-09-16
申请号：US09808638
申请日：2001-03-14
申请人： Howard P. Wilson , Gary F. Nault
发明人： Howard P. Wilson , Gary F. Nault
IPC分类号： G02B626
CPC分类号： G02B6/3582 , G02B6/3514 , G02B6/3546 , G02B6/3897
摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. A fiber support device has passages that receive optic fibers and help align those fibers with respect to an optic switch component. In addition, the fibers that extend into the interior of the fiber support device are isolated from strains that may occur on the fibers that extend external to the fiber support device.

4. 发明授权

US5285352A Pad array semiconductor device with thermal conductor and process for making the same 失效
标题翻译：具有热导体的焊盘阵列半导体器件和制造相同的工艺
公开(公告)号：US5285352A
公开(公告)日：1994-02-08
申请号：US913312
申请日：1992-07-15
申请人： John R. Pastore , Victor K. Nomi , Howard P. Wilson
发明人： John R. Pastore , Victor K. Nomi , Howard P. Wilson
IPC分类号： H01L23/12 , H01L23/36 , H01L23/367 , H05K7/20
CPC分类号： H01L23/36 , H01L23/3677 , H01L2224/32013 , H01L2224/32188 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/30107
摘要： A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surrounded by a metallized area (37, 39), which together may serve as a ground plane in the device. Preferably one or more terminals (26) are attached to the thermal conductor for improved thermal and electrical performance. One method of integrating the thermal conductor in the substrate is to position a metal plug into an opening 30 of the substrate. The plug is then compressed or otherwise plastically deformed to fill the opening and create a substantially planar substrate surface.
摘要翻译：焊盘阵列半导体器件（35）包括集成到电路化衬底（14）中的热导体（28）。半导体管芯（12）安装在覆盖导热体的衬底上，以建立远离管芯的热路径。热导体也可以被金属化区域（37,39）覆盖或围绕，金属化区域可一起用作设备中的接地平面。优选地，一个或多个端子（26）附接到热导体以改善热和电性能。将热导体集成在基板中的一种方法是将金属塞定位到基板的开口30中。然后塞子被压缩或以其他方式塑性变形以填充开口并产生基本平坦的基板表面。

5. 发明授权

US06549693B2 Fiber optic switch package and method of assembling a fiber optic switch package for redirecting fiber path 失效
标题翻译：光纤开关封装和组装光纤开关封装的方法，用于重新定向光纤路径
公开(公告)号：US06549693B2
公开(公告)日：2003-04-15
申请号：US09808637
申请日：2001-03-14
申请人： Howard P. Wilson , Souksamay Chounlamontry
发明人： Howard P. Wilson , Souksamay Chounlamontry
IPC分类号： G02B626
CPC分类号： G02B6/3582 , G02B6/3512 , G02B6/3546 , G02B6/355 , G02B6/3584
摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. The package redirects or bends optical fibers of a 2×2 or 1×2 MEMS optical switch in the package so that instead of exiting the package from four ends, the fibers exit the package from two ends. By exiting the package from two ends, real estate on a printed circuit board is conserved and packages can be located closer to other packages on a printed circuit board.
摘要翻译：一种光纤开关封装及其组装方法，具有改进的纤维保护和简单组装。该封装将2x2或1x2 MEMS光开关的光纤重定向或弯曲在封装中，从而不是从四端离开封装，而是从两端退出封装。通过从两端退出封装，印刷电路板上的空间被保存，并且封装可以更靠近印刷电路板上的其它封装。

6. 发明授权

US5006922A Packaged semiconductor device having a low cost ceramic PGA package 失效
标题翻译：具有低成本陶瓷PGA封装的封装半导体器件
公开(公告)号：US5006922A
公开(公告)日：1991-04-09
申请号：US480386
申请日：1990-02-14
申请人： Michael B. McShane , Paul T. Lin , Howard P. Wilson
发明人： Michael B. McShane , Paul T. Lin , Howard P. Wilson
IPC分类号： H01L23/04 , H01L23/057 , H01L23/498
CPC分类号： H01L23/49827 , H01L23/04 , H01L23/057 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L24/45 , H01L24/48 , H01L2924/01012 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/15312 , H01L2924/1532 , H01L2924/19041
摘要： An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/output pins are attached to through-holes in the base and extend through the base and are exposed by holes in the cap aligned to the through-holes in the base. Extensive glass sealing of the cap to the base, made possible by the substantially co-extensive nature of the cap with respect to the base, provides a sturdy highly reliable seal making the packaged semiconductor device better able to withstand mechanical stress.
摘要翻译：提供了一种改进的封装半导体器件，其具有封装在单层陶瓷PGA封装内的诸如集成电路的电子部件。与基座基本上相同的面积尺寸的盖子密封到形成其中安装集成电路的空腔的基座。输入/输出引脚连接到基座中的通孔并延伸穿过基座，并且通过与基座中的通孔对准的盖中的孔露出。通过盖相对于基座的基本上共同的性质，可以将盖子广泛地密封到基座上，从而提供坚固的高度可靠的密封，使得封装的半导体器件能够更好地承受机械应力。

7. 发明授权

US06470111B2 Fiber optic switch package and a method of assembling a fiber optic switch package 失效
标题翻译：光纤开关封装和组装光纤开关封装的方法
公开(公告)号：US06470111B2
公开(公告)日：2002-10-22
申请号：US09768926
申请日：2001-01-24
申请人： Douglas P. Mortenson , Howard P. Wilson
发明人： Douglas P. Mortenson , Howard P. Wilson
IPC分类号： G02B626
CPC分类号： G02B6/3582 , G02B6/3514 , G02B6/3546
摘要： A fiber optic switch package and method of assembling the same with improved protection of the fibers and simple assembly. A fiber support device has passages that receive optic fibers and help align those fibers with respect to an optic switch component. In addition, the fibers that extend into the interior of the fiber support device are isolated from strains that may occur on the fibers that extend external to the fiber support device.
摘要翻译：一种光纤开关封装及其组装方法，具有改进的纤维保护和简单组装。纤维支撑装置具有接收光纤的通道，并帮助光纤相对于光开关部件对准这些光纤。此外，延伸到纤维支撑装置内部的纤维与在纤维支撑装置外部延伸的纤维上可能发生的应变隔离。

8. 发明授权

US5612576A Self-opening vent hole in an overmolded semiconductor device 失效
标题翻译：包覆成型的半导体器件中的自开通气孔
公开(公告)号：US5612576A
公开(公告)日：1997-03-18
申请号：US960337
申请日：1992-10-13
申请人： Howard P. Wilson , Fonzell D. J. Martin
发明人： Howard P. Wilson , Fonzell D. J. Martin
IPC分类号： H01L23/28 , H01L23/31 , H01L23/29
CPC分类号： H01L24/32 , H01L23/3128 , H01L2224/32057 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83385 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/181
摘要： A self-opening vent hole semiconductor device (10) can be manufactured to reduce the risk of popcorning during solder reflow. The device contains a semiconductor die (22) mounted on a die mounting area (15) of a substrate (12). A venting hole (16) is approximately centrally located in the die mounting area. A venting hole sealing cap (20) covers and seals the venting hole. A layer of patterned solder resist (18) adheres to a lower surface of the substrate. The venting hole sealing cap can be made from the layer of solder resist, and can be configured to be either physically isolated from the solder resist layer or physically partially connected to the solder resist layer. The venting hole sealing cap is designed to be a weakest interface within the device so that it self-opens upon an internal pressure less than a destructive pressure to the device. Solder balls (30) provide external electrical connections for the device.
摘要翻译：可以制造自开通气孔半导体器件（10），以减少焊料回流期间爆裂的风险。该装置包含安装在基板（12）的管芯安装区域（15）上的半导体管芯（22）。排气孔（16）大致位于模具安装区域的中心。通气孔密封盖（20）覆盖并密封排气孔。图案化的阻焊剂层（18）粘附到基底的下表面。通气孔密封盖可以由阻焊层形成，并且可以被配置为与阻焊层物理隔离或物理上部分地连接到阻焊层。排气孔密封盖被设计为装置内最弱的界面，使得其在小于设备的破坏性压力的内部压力下自我打开。焊球（30）为器件提供外部电气连接。

9. 发明授权

US5731709A Method for testing a ball grid array semiconductor device and a device for such testing 失效
标题翻译：用于测试球栅阵列半导体器件的方法和用于这种测试的器件
公开(公告)号：US5731709A
公开(公告)日：1998-03-24
申请号：US592256
申请日：1996-01-26
申请人： John R. Pastore , Victor K. Nomi , Howard P. Wilson
发明人： John R. Pastore , Victor K. Nomi , Howard P. Wilson
IPC分类号： G01R1/04 , G01R31/02
CPC分类号： G01R1/0483 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L24/73 , H01L2924/01322 , H01L2924/15311
摘要： A ball grid array semiconductor device (30) includes a plurality of conductive balls (36) and a plurality of conductive castellations (18) around its periphery as redundant electrical connections to a semiconductor die (12). During testing of the device in a test socket (50), the conductive castellations are contacted by test contacts (54). The test contacts do not come in physical contact with the conductive balls. As a result, when testing is performed at elevated temperatures near the melting point of the conductive balls, the conductive balls are not deformed by the test contacts, thereby eliminating cosmetic-defects. Additionally, the absence of physical contact between the conductive balls and the test contacts during testing reduces the likelihood that conductive balls will inadvertently fuse to the test socket or create solder build-up on the test contacts.
摘要翻译：球栅阵列半导体器件（30）包括围绕其周边的多个导电球（36）和多个导电堰（18），作为到半导体管芯（12）的冗余电连接。在测试插座（50）中测试设备期间，导电蓖耳体被测试触点（54）接触。测试触点不会与导电球物理接触。结果，当在导电球的熔点附近的高温下进行测试时，导电球不会被测试触点变形，从而消除了美观缺陷。另外，在测试期间导电球和测试触点之间不存在物理接触会降低导电球将不经意地融合到测试插座或在测试触点上产生焊料积聚的可能性。

10. 发明授权

US5284287A Method for attaching conductive balls to a substrate 失效
标题翻译：将导电球附着于基板的方法
公开(公告)号：US5284287A
公开(公告)日：1994-02-08
申请号：US937267
申请日：1992-08-31
申请人： Howard P. Wilson , Fonzell D. J. Martin
发明人： Howard P. Wilson , Fonzell D. J. Martin
IPC分类号： H01L21/48 , H05K3/34 , H01L21/58
CPC分类号： H05K3/3478 , H01L21/4853 , H01L2224/11003 , H01L2224/11334 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/082 , H05K3/3489
摘要： Conductive balls (44), preferably solder balls, are attached to pads (32) on a substrate (30) using a vacuum pick-up tool (34). The pick-up tool lowers the conductive balls into a bath of flux (48) without allowing the balls to touch the bottom of a recess (47) in a flux plate (46), thereby reducing the likelihood of dislodging the solder balls from the pick-up tool. The pick-up tool withdraws the balls from the flux, and aligns the balls with the respective pads on the substrate. Once positioned, the balls are released from the pick-up tool. A reflow operation metallurgically bonds the balls to the pads.
摘要翻译：使用真空拾取工具（34）将导电球（44）（优选焊球）附接到衬底（30）上的焊盘（32）。拾取工具将导电球降低到通量（48）的浴中，而不允许球接触通量板（46）中的凹部（47）的底部，从而减少从焊球（46）移除焊球的可能性拾取工具。拾取工具从焊剂中取出球，并将球与衬底上的相应衬垫对准。一旦定位，球从拾取工具释放。回流焊接将球焊接到焊盘。

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