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1. 发明授权

US06544898B2 Method for improved die release of a semiconductor device from a wafer 失效
标题翻译：用于从晶片改进半导体器件脱模的方法
公开(公告)号：US06544898B2
公开(公告)日：2003-04-08
申请号：US09891105
申请日：2001-06-25
申请人： Bruce Polson , Nan Zhang , Howard P. Wilson
发明人： Bruce Polson , Nan Zhang , Howard P. Wilson
IPC分类号： H01L2100
CPC分类号： B81C1/00873 , B81C2201/014
摘要： A microelectromechanical (MEMS) device and a method of fabricating a MEMS device are provided. The method of fabricating the MEMS device includes the steps of: etching a die release trench in a primary handle layer of a wafer having the handle layer, an etch-stop layer disposed on the primary handle layer, and a device layer disposed on the etch-stop layer; patterning a release trench in the device layer that is aligned with the release trench in the primary handle layer; temporarily attaching an additional handle layer to the primary handle layer; etching the device layer to define a structure in the device layer; removing the etch-stop layer; and removing the additional handle layer to release the die.
摘要翻译：提供了一种微机电（MEMS）器件和MEMS器件的制造方法。制造MEMS器件的方法包括以下步骤：蚀刻具有手柄层的晶片的主手柄层中的裸片释放沟槽，设置在主手柄层上的蚀刻停止层以及设置在蚀刻上的器件层停留层图案化在与主手柄层中的释放沟槽对准的器件层中的释放沟槽; 临时附加手柄层到主手柄层; 蚀刻器件层以限定器件层中的结构; 去除蚀刻停止层; 并移除附加手柄层以释放模具。

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