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1. 发明申请

US20070138644A1 Structure and method of making capped chip having discrete article assembled into vertical interconnect 审中-公开
标题翻译：将具有离散制品的封盖芯片组装成垂直互连的结构和方法
公开(公告)号：US20070138644A1
公开(公告)日：2007-06-21
申请号：US11300900
申请日：2005-12-15
申请人： Bruce McWilliams , Giles Humpston , Belgacem Haba , Robert Burtzlaff
发明人： Bruce McWilliams , Giles Humpston , Belgacem Haba , Robert Burtzlaff
IPC分类号： H01L23/48
CPC分类号： B81C1/00301 , B81B2207/095 , H01L27/14618 , H01L27/14636 , H01L2224/48091 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/3011 , H03H3/007 , H03H9/1092 , H01L2924/00014 , H01L2924/00
摘要： A capped chip is provided which includes a chip having a front surface, a plurality of conductive features exposed at the front surface and a cap. The cap has an inner surface facing the front surface of the chip, an outer surface opposite the inner surface, and a through hole extending from the outer surface to the inner surface. A conductive interconnect extends at least partially through the through hole. The interconnect includes a conductive article which occupies a substantial portion of a volume of the interconnect and the interconnect further includes a flowable conductive medium which joins the conductive article to at least one of the plurality of conductive features of the chip or to the cap.
摘要翻译：提供了一种封盖芯片，其包括具有前表面的芯片，在前表面处暴露的多个导电特征和盖。盖具有面向芯片的前表面的内表面，与内表面相对的外表面，以及从外表面延伸到内表面的通孔。导电互连件至少部分延伸穿过通孔。互连件包括占据互连体积的主要部分的导电制品，并且互连件还包括将导电制品连接到芯片的多个导电特征中的至少一个或帽的至少一个的可流动导电介质。

2. 发明申请

US20050087861A1 Back-face and edge interconnects for lidded package 有权
标题翻译：背面和边缘互连用于带盖的包装
公开(公告)号：US20050087861A1
公开(公告)日：2005-04-28
申请号：US10949844
申请日：2004-09-24
申请人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David Tuckerman , Michael Warner , Craig Mitchell
发明人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David Tuckerman , Michael Warner , Craig Mitchell
IPC分类号： H01L21/60 , H01L23/04 , H01L23/10 , H01L23/485 , H01L27/146 , H03H3/007 , H03H3/08 , H03H9/10 , H01L21/44 , H01L23/52
CPC分类号： H01L23/3114 , B81B2207/095 , B81C1/00293 , B81C1/00301 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , H01L21/76898 , H01L23/04 , H01L24/11 , H01L24/13 , H01L24/48 , H01L27/14618 , H01L27/14627 , H01L27/14636 , H01L33/62 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1401 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48247 , H01L2224/484 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H03H3/007 , H03H9/0547 , H03H9/0585 , H03H9/059 , H03H9/1057 , H03H9/1064 , H03H9/1071 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.
摘要翻译：提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。至少一些单元连接电连接到芯片。封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。

3. 发明授权

US07224056B2 Back-face and edge interconnects for lidded package 有权
标题翻译：背面和边缘互连用于带盖的包装
公开(公告)号：US07224056B2
公开(公告)日：2007-05-29
申请号：US10949844
申请日：2004-09-24
申请人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David B. Tuckerman , Michael Warner , Craig S. Mitchell
发明人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David B. Tuckerman , Michael Warner , Craig S. Mitchell
IPC分类号： H01L23/12
CPC分类号： H01L23/3114 , B81B2207/095 , B81C1/00293 , B81C1/00301 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , H01L21/76898 , H01L23/04 , H01L24/11 , H01L24/13 , H01L24/48 , H01L27/14618 , H01L27/14627 , H01L27/14636 , H01L33/62 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1401 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48247 , H01L2224/484 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H03H3/007 , H03H9/0547 , H03H9/0585 , H03H9/059 , H03H9/1057 , H03H9/1064 , H03H9/1071 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.
摘要翻译：提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。至少一些单元连接电连接到芯片。封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。

4. 发明申请

US20070096295A1 Back-face and edge interconnects for lidded package 审中-公开
公开(公告)号：US20070096295A1
公开(公告)日：2007-05-03
申请号：US11641141
申请日：2006-12-19
申请人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David Tuckerman , Michael Warner , Craig Mitchell
发明人： Robert Burtzlaff , Belgacem Haba , Giles Humpston , David Tuckerman , Michael Warner , Craig Mitchell
IPC分类号： H01L23/12
CPC分类号： H01L23/3114 , B81B2207/095 , B81C1/00293 , B81C1/00301 , B81C2203/0118 , B81C2203/0145 , B81C2203/019 , H01L21/76898 , H01L23/04 , H01L24/11 , H01L24/13 , H01L24/48 , H01L27/14618 , H01L27/14627 , H01L27/14636 , H01L33/62 , H01L2224/0401 , H01L2224/05624 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1401 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/4824 , H01L2224/48247 , H01L2224/484 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/16151 , H01L2924/16195 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H03H3/007 , H03H9/0547 , H03H9/0585 , H03H9/059 , H03H9/1057 , H03H9/1064 , H03H9/1071 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

5. 发明申请

US20050189622A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

6. 发明申请

US20050189635A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
标题翻译：封装的声学和电磁换能器芯片
公开(公告)号：US20050189635A1
公开(公告)日：2005-09-01
申请号：US11068831
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
摘要翻译：本文公开了封装芯片的各种实施例及其制造方法。本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。

7. 发明申请

US20070190747A1 Wafer level packaging to lidded chips 审中-公开
标题翻译：晶圆级封装成芯片
公开(公告)号：US20070190747A1
公开(公告)日：2007-08-16
申请号：US11655739
申请日：2007-01-19
申请人： Giles Humpston , Michael Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky
发明人： Giles Humpston , Michael Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky
IPC分类号： H01L21/00
CPC分类号： B81C1/00285 , B81C2203/0118 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/1461 , H01L2924/16235 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： Methods are provided for making a plurality of lidded microelectronic elements. In an exemplary embodiment, a lid wafer is assembled with a device wafer. Desirably, the lid wafer is severed into a plurality of lid elements to remove portions of the lid wafer overlying contacts at a front face of the device wafer adjacent to dicing lanes of the device wafer. Thereafter, desirably, the device wafer is severed along the dicing lanes to provide a plurality of lidded microelectronic elements.
摘要翻译：提供了制造多个带盖的微电子元件的方法。在示例性实施例中，盖晶片与装置晶片组装在一起。期望地，将盖晶片切割成多个盖元件以去除盖子晶片的覆盖在与器件晶片的切割通道相邻的器件晶片的正面处的触点的部分。此后，期望地，器件晶片沿着切割通道切断以提供多个带盖的微电子元件。

8. 发明授权

US07936062B2 Wafer level chip packaging 有权
标题翻译：晶圆级芯片封装
公开(公告)号：US07936062B2
公开(公告)日：2011-05-03
申请号：US11655777
申请日：2007-01-19
申请人： Giles Humpston , Michael J. Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Hayes Reifel
发明人： Giles Humpston , Michael J. Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Hayes Reifel
IPC分类号： H01L23/12
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.
摘要翻译：提供封装的微电子元件。在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。例如，盖可以具有面向正面的内表面。在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

9. 发明申请

US20070190691A1 Wafer level chip packaging 有权
标题翻译：晶圆级芯片封装
公开(公告)号：US20070190691A1
公开(公告)日：2007-08-16
申请号：US11655777
申请日：2007-01-19
申请人： Giles Humpston , Michael Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Reifel
发明人： Giles Humpston , Michael Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Reifel
IPC分类号： H01L21/00
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.
摘要翻译：提供封装的微电子元件。在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。例如，盖可以具有面向正面的内表面。在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

10. 发明申请

US20150015573A1 VISUALLY ADAPTIVE SURFACES 审中-公开
标题翻译：可视自适应表面
公开(公告)号：US20150015573A1
公开(公告)日：2015-01-15
申请号：US14380374
申请日：2013-02-22
申请人： Robert Burtzlaff , Carmen Falcone
发明人： Robert Burtzlaff , Carmen Falcone
IPC分类号： G06T15/00
CPC分类号： G06T15/005 , G06F3/041 , G06F3/04815 , G06F9/451 , G06F2203/04102 , G06T2200/16 , G09G3/003 , G09G2370/022
摘要： A display system can include an optionally removable display that at least partially conforms to a surface of an article. The article and display can be non-flat, having a curved or complex conforming shape. A processing module can automatically create images based on a set of rules operating on at least one of stored user settings, input from a user, local sensor data including but not limited to images captured by a user, or social or other network derived data. An intermediate image can be created for approval by a user, and the image can be modified to conform to display surface for enhanced visual appearance, fashion coordination, advertising, and/or branding of the article supporting the display.
摘要翻译：显示系统可以包括至少部分地符合制品表面的可选择地可移除的显示器。物品和显示器可以是非平坦的，具有弯曲或复杂的形状。处理模块可以基于在存储的用户设置，来自用户的输入，包括但不限于由用户捕获的图像或社交或其他网络导出的数据的本地传感器数据中的至少一个上操作的一组规则来自动创建图像。可以创建中间图像以供用户批准，并且可以修改图像以符合显示表面，以增强支持显示的文章的视觉外观，时尚协调，广告和/或品牌。

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