会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Process for applying a lead-free coating to untreated metal substrates via electrodeposition
    • 通过电沉积将未经处理的金属基材施加无铅涂层的方法
    • US06168868A
    • 2001-01-02
    • US09309850
    • 1999-05-11
    • Brian T. HauserRichard F. KarabinThor G. Lingenfelter
    • Brian T. HauserRichard F. KarabinThor G. Lingenfelter
    • C23C2800
    • C23C22/34C25D13/20Y10T428/31678
    • An improved process for applying a lead-free coating by electrodeposition to an untreated ferrous metal substrate is provided. The substrate need not be phosphated prior to treatment. The process includes the following steps: a) contacting the substrate surface with a group IIIB or IVB metal compound in a medium that is essentially free of accelerators needed to form phosphate conversion coatings; followed by b) electrocoating the substrate with a substantially lead-free, curable electrodepositable composition; and c) curing the electrodepositable composition. The group IIIB or IVB metal compound is preferably a zirconium compound and is typically in an aqueous medium. The process may further include initial steps of cleaning the substrate with an alkaline cleaner and rinsing with an acidic rinse. Substrates treated by the process of the present invention demonstrate excellent corrosion resistance.
    • 提供了一种通过电沉积施加到未处理的黑色金属基底上的无铅涂层的改进方法。 在处理之前,基板不需要磷化。 该方法包括以下步骤:a)在基本上不含形成磷酸盐转化涂层所需的促进剂的介质中使基材表面与IIIB或IVB族金属化合物接触; 随后b)用基本上无铅的可固化的可电沉积组合物电镀基材; 并且c)固化可电沉积组合物。组IIIB或IVB金属化合物优选是锆化合物,并且通常在水性介质中。该方法还可以包括用碱性清洁剂清洁基底并用酸性漂洗物冲洗的初始步骤。 通过本发明的方法处理显示出优异的耐腐蚀性。