会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • Sustained release of antiinfectives
    • 持续释放抗感染药
    • US07718189B2
    • 2010-05-18
    • US11185448
    • 2005-07-19
    • Lawrence T. BoniBrian S. MillerVladimir MalininXingong Li
    • Lawrence T. BoniBrian S. MillerVladimir MalininXingong Li
    • A61K9/127
    • A61K47/28A61K9/0078A61K9/127A61K9/1277A61K31/407A61K31/4709A61K31/496A61K31/545A61K31/7036A61K31/704A61K45/06Y02A50/473
    • Provided are lipid antiinfective formulations substantially free of anionic lipids with a lipid to antiinfective ratio is about 1:1 to about 4:1, and a mean average diameter of less than about 1 μm. Also provided is a method of preparing a lipid antiinfective formulation comprising an infusion process. Also provided are lipid antiinfective formulations wherein the lipid to drug ratio is about 1:1 or less, about 0.75:1 or less, or about 0.50:1 or less prepared by an in line fusion process. The present invention also relates to a method of treating a patient with a pulmonary infection comprising administering to the patient a therapeutically effective amount of a lipid antiinfective formulation of the present invention. The present invention also relates to a method of treating a patient for cystic fibrosis comprising administering to the patient a therapeutically effective amount of a lipid antiinfective formulation of the present invention.
    • 提供基本上不含阴离子脂质的脂质抗感染制剂,其脂质与抗感染比为约1:1至约4:1,平均平均直径小于约1μm。 还提供了制备包含输注方法的脂质抗感染制剂的方法。 还提供了脂质抗感染制剂,其中通过在线融合方法制备的脂质与药物的比例为约1:1或更低,约0.75:1或更低,或约0.50:1或更低。 本发明还涉及治疗患有肺部感染的患者的方法,其包括向患者施用治疗有效量的本发明的抗脂质抗感染药物。 本发明还涉及一种治疗患者囊性纤维化的方法,其包括向患者施用治疗有效量的本发明的抗脂质抗感染制剂。
    • 9. 发明授权
    • Indium bump hybrid bonding method and system
    • 铟凸块混合键合方法及系统
    • US4573627A
    • 1986-03-04
    • US684223
    • 1984-12-20
    • Brian S. MillerAubrey J. Dunn
    • Brian S. MillerAubrey J. Dunn
    • B23K20/02H01L21/98B23K20/00B23K31/02
    • H01L25/50B23K20/02H01L2924/0002
    • In order to ensure total bonding together of two-dimensional arrays of inm bumps on circuit boards, additional bumps are placed on each board in a triangular pattern which contains the array of that board. Opposing sets of thrusters are used to move the boards and their bumps toward each other, after the arrays are aligned with the boards juxtaposed and substantially parallel to each other. As corresponding sets of additional bumps touch each other, the set of thrusters moving the boards at those points hold their positions, until all sets of additional bumps are in touch; all of the thrusters of at least one board are then simultaneously energized until a predetermined pressure is achieved between the boards.
    • 为了确保电路板上的铟凸块的二维阵列的全部结合在一起,附加的凸块以包含该板的阵列的三角形图案放置在每个板上。 在将阵列与彼此并置并且基本上彼此平行的板对准之后,相反的推进器组被用于将板和它们的凸起朝向彼此移动。 当相应的附加凸块相互接触时,在那些位置移动板的推进器组保持它们的位置,直到所有的附加凸块组合在一起; 然后至少一个板的所有推进器同时通电,直到板之间达到预定的压力。