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    • 3. 发明申请
    • Method and apparatus for providing capacitor feedthrough
    • 用于提供电容器馈通的方法和装置
    • US20060017089A1
    • 2006-01-26
    • US11182729
    • 2005-07-15
    • James TallerMichael O'Phelan
    • James TallerMichael O'Phelan
    • H01L29/94H01L21/8242
    • H01G9/14A61N1/3968A61N1/3975H01G2/103H01G2/106H01G9/08H01G9/10
    • A capacitor feedthrough assembly with a cavity, comprising a capacitor stack, including one or more substantially flat anode layers and one or more substantially flat cathode layers in a case with a cover, the case having a first opening sized for passage of the capacitor stack and a second opening defined by a lip. Additionally, the capacitor includes a conductive member attached to the capacitor stack and disposed at least part way through the second opening in the case, and an isolating element disposed between the lip and at least a portion of the connected stack and conductive member. Also, the capacitor includes a curable resin sealingly disposed in the cavity defined by the second opening, the isolating element, and the conductive member, the curable resin electrically isolating the case from the conductive member.
    • 一种具有空腔的电容器馈通组件,包括电容器堆叠,其包括一个或多个基本上平坦的阳极层和在具有盖的壳体中的一个或多个基本上平坦的阴极层,所述壳体具有尺寸适于通过所述电容器堆叠的第一开口, 由嘴唇限定的第二个开口。 另外,电容器包括附接到电容器堆叠并且至少部分地布置在壳体中的第二开口的导电构件,以及设置在唇缘和连接的叠层和导电构件的至少一部分之间的隔离元件。 此外,电容器包括密封地设置在由第二开口,隔离元件和导电构件限定的空腔中的可固化树脂,固化树脂将壳体与导电构件电隔离。
    • 4. 发明申请
    • Method and apparatus for openings in a capacitor case
    • 用于电容器壳体中的开口的方法和装置
    • US20060018079A1
    • 2006-01-26
    • US11183235
    • 2005-07-15
    • A. BarrJames TallerBrian Schmidt
    • A. BarrJames TallerBrian Schmidt
    • H01G4/30
    • H01G9/008H01G9/10H01G9/14Y10T29/417
    • An capacitor, comprising a capacitor stack, including one or more substantially planar anode layers, and one or more substantially planar cathode layers, the capacitor including a case with a first opening and a second opening, the first opening sized for passage of the capacitor stack and the second opening defined by walls having a first thickness. Additionally, the capacitor has a cover substantially conforming to the first opening and sealingly connected to the first opening, and a plate substantially conforming to the second opening, the plate adapted for attachment of a terminal, and sealingly connected to the second opening. The plate has a second thickness which is approximately greater than the first thickness of the walls defining the second opening. The capacitor stack is disposed in the case, and the terminal is in electrical connection with the case and at least one capacitor electrode.
    • 一种电容器,包括电容器堆叠,其包括一个或多个基本上平面的阳极层,以及一个或多个基本平坦的阴极层,所述电容器包括具有第一开口和第二开口的壳体,所述第一开口的尺寸适于使电容器堆叠通过 并且由具有第一厚度的壁限定的第二开口。 此外,电容器具有基本上符合第一开口并且密封地连接到第一开口的盖,以及基本上符合第二开口的板,该板适于连接端子,并且密封地连接到第二开口。 板具有大致大于限定第二开口的壁的第一厚度的第二厚度。 电容器堆叠设置在壳体中,并且端子与壳体和至少一个电容器电极电连接。
    • 5. 发明申请
    • METHOD AND APPARATUS FOR OPENINGS IN A CAPACITOR CASE
    • 电容器中开口的方法和装置
    • US20070097600A1
    • 2007-05-03
    • US11567940
    • 2006-12-07
    • A. BarrJames TallerBrian Schmidt
    • A. BarrJames TallerBrian Schmidt
    • H01G9/10H05K5/03H01G4/228
    • H01G9/008H01G9/10H01G9/14Y10T29/417
    • One embodiment of the present subject matter includes an apparatus which includes a capacitor stack, including at least one substantially planar capacitor electrode, a case having a first opening and a second opening, the first opening sized for passage of the capacitor stack, the second opening defined by walls having a first thickness, a cover substantially conforming to the first opening and sealingly connected to the first opening and a plate substantially conforming to the second opening, the plate sealingly connected to the second opening, the plate having a second thickness which is approximately greater than the first thickness of the walls defining the second opening, wherein the capacitor stack is disposed in the case.
    • 本主题的一个实施例包括一种装置,其包括电容器堆叠,其包括至少一个基本上平面的电容器电极,具有第一开口和第二开口的壳体,第一开口的尺寸设置成用于电容器堆叠的通过,第二开口 由具有第一厚度的壁限定,基本上符合第一开口并密封地连接到第一开口的盖和基本上符合第二开口的板,密封地连接到第二开口的板,该板具有第二厚度, 大致大于限定第二开口的壁的第一厚度,其中电容器叠层设置在壳体中。