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1. 发明授权

US5590232A Optical package and method of making 失效
标题翻译：光学封装及其制作方法
公开(公告)号：US5590232A
公开(公告)日：1996-12-31
申请号：US390209
申请日：1995-02-16
申请人： Robert M. Wentworth , David Galloway , Garland D. Cotney , Brian A. Webb
发明人： Robert M. Wentworth , David Galloway , Garland D. Cotney , Brian A. Webb
IPC分类号： G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/4249
摘要： An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.
摘要翻译：一种光学封装，包括壳体，其限定安装区域，其中形成在所述壳体中的引线各自具有在所述安装区域中的第一端和在所述壳体外部的第二端。其上具有光子器件的半导体裸片安装在安装区域中并电连接到引线。光子器件的有源光区域可通过安装区域访问。光纤对准结构安装在用于接收光纤的安装区域中，并将光纤与光子器件的有源光区域对准。

2. 发明授权

US5477084A Microelectronic device packaging containing a liquid and method 失效
标题翻译：含有液体的微电子器件封装和方法
公开(公告)号：US5477084A
公开(公告)日：1995-12-19
申请号：US367628
申请日：1995-01-03
申请人： Brian A. Webb , Robert M. Wentworth
发明人： Brian A. Webb , Robert M. Wentworth
IPC分类号： H01L21/54 , H01L23/22 , H01L23/42 , H01L25/04
CPC分类号： H01L23/22 , H01L21/54 , H01L23/42 , H01L2924/0002 , Y10T29/49146
摘要： A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).
摘要翻译：一种含液体微电子器件封装的制造方法。该方法包括以下步骤：提供（32）包括微电子器件（22）的底座（16）和围绕基座（16）围绕设置的密封区域，提供（34）盖子（12）并提供（34）密封剂（14）设置在基部（16）和盖（12）之间。该方法还包括以下步骤：将基底（16），密封剂（14）和盖（12）浸入温度高于密封剂活化温度的液体（24）中并保持（38）基底（16），密封剂（14）和液体（24）中的盖子（12）足以允许液体（24）进入基部（16）和盖（12）之间的时间，并加热并由此激活密封剂（14）。该方法还包括从液体（24）中移除（40）底座（16），盖子（12）和密封剂（14）以提供密封的含液体的微电子器件封装（10）。

3. 发明授权

US5413965A Method of making microelectronic device package containing a liquid 失效
标题翻译：制造含有液体的微电子器件封装的方法
公开(公告)号：US5413965A
公开(公告)日：1995-05-09
申请号：US119555
申请日：1993-09-13
申请人： Brian A. Webb , Robert M. Wentworth
发明人： Brian A. Webb , Robert M. Wentworth
IPC分类号： H01L21/54 , H01L23/22 , H01L23/42 , H01L21/56
CPC分类号： H01L23/22 , H01L21/54 , H01L23/42 , H01L2924/0002 , Y10T29/49146
摘要： A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).
摘要翻译：一种含液体微电子器件封装的制造方法。该方法包括以下步骤：提供（32）包括微电子器件（22）的底座（16）和围绕基座（16）围绕设置的密封区域，提供（34）盖子（12）并提供（34）密封剂（14）设置在基部（16）和盖（12）之间。该方法还包括以下步骤：将基底（16），密封剂（14）和盖（12）浸入温度高于密封剂活化温度的液体（24）中并保持（38）基底（16），密封剂（14）和液体（24）中的盖子（12）足以允许液体（24）进入基部（16）和盖（12）之间的时间，并加热并由此激活密封剂（14）。该方法还包括从液体（24）中移除（40）底座（16），盖子（12）和密封剂（14）以提供密封的含液体的微电子器件封装（10）。

4. 发明授权

US5475778A Smart optical coupler and smart optical coupler system 失效
标题翻译：智能光耦合器和智能光耦合器系统
公开(公告)号：US5475778A
公开(公告)日：1995-12-12
申请号：US139181
申请日：1993-10-21
申请人： Brian A. Webb
发明人： Brian A. Webb
IPC分类号： G02B6/42 , H04B10/12 , H04B10/13 , H04B10/135 , H04B10/14 , G02B6/28 , B29D11/00
CPC分类号： G02B6/4249
摘要： A smart optical connector (100) sends and recieves optical signals over optical fibers (200, 202). The smart otical connector (100) is capable of converting electrical signals to optical signals for transmission, and capable of converting optical signals to electrical signals for reception. Addtionally, the smart optical connector (100) comprises circuitry (217) for modifying the format of the electrical signals-to provide compatibility between various equiptment (414, 416, 418) which require differing formats.
摘要翻译：智能光连接器（100）通过光纤（200,202）发送和接收光信号。智能连接器（100）能够将电信号转换成光信号进行传输，并能将光信号转换成电信号进行接收。另外，智能光连接器（100）包括用于修改电信号的格式的电路（217），以提供需要不同格式的各种等式（414,416,418）之间的兼容性。

5. 发明授权

US5808325A Optical transmitter package assembly including lead frame having exposed flange with key 失效
标题翻译：光发射器封装组件，包括带有凸缘的引线框架
公开(公告)号：US5808325A
公开(公告)日：1998-09-15
申请号：US671864
申请日：1996-06-28
申请人： Brian A. Webb
发明人： Brian A. Webb
IPC分类号： H01L23/28 , H01L23/48 , H01L25/16 , H01L33/58 , H01L33/62 , H01S5/00 , H01S5/022 , H01L33/00
CPC分类号： H01L33/62 , H01L25/167 , H01S5/02244 , H01L2224/48091 , H01L2224/48247 , H01L33/58 , H01S5/02228
摘要： A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.
摘要翻译：封装组件（31）具有包括定位凸缘（30）的引线框架（10），安装在引线框架上的诸如激光二极管的光发射器（22）以及封装光传输器和一部分引线框架的定位凸缘设置在封装的外部。定位法兰用作参考基准，用于在制造过程中对准光发射机的相对高度和横向位置。此外，当安装到光学终端产品中的其他部件时，定位凸缘用作将包装组件与其他标准光学部件配合的参考基准。

6. 发明授权

US4903401A Leadframe silver bleed elimination 失效
标题翻译：引线框银流失消除
公开(公告)号：US4903401A
公开(公告)日：1990-02-27
申请号：US331972
申请日：1989-04-03
申请人： Brian A. Webb
发明人： Brian A. Webb
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , Y10T29/49121 , Y10T428/12896
摘要： A method of making a leadframe useful in packaging semiconductor devices eliminates silver bleed between adjacent leads of the leadframe. This is accomplished by leaving excess leadframe material along the edges of the leads prior to silver plating the flag area and the portion of the leads adjacent to the flag area. After the plating operation, this excess leadframe material is removed thereby leaving silver free leads which will be exposed outside of a resulting encapsulated semiconductor package.
摘要翻译：制造用于封装半导体器件的引线框架的方法消除引线框架的相邻引线之间的银渗漏。这是通过在镀银标志区域和引线的与标记区域相邻的部分进行镀银之前沿引线的边缘留下多余的引线框材料而实现的。在电镀操作之后，去除这种多余的引线框架材料，从而留下将被暴露在所得封装的半导体封装外部的无银引线。

7. 发明授权

US6046901A Support structure, electronic assembly 失效
标题翻译：支撑结构，电子组装
公开(公告)号：US6046901A
公开(公告)日：2000-04-04
申请号：US72196
申请日：1998-05-04
申请人： Benjamin R. Davis , Brian A. Webb
发明人： Benjamin R. Davis , Brian A. Webb
IPC分类号： H01L23/64 , H05K1/03 , H05K1/16 , H05K3/40 , H01G4/005 , H01G4/228 , H05K1/18
CPC分类号： H05K1/162 , H01L23/642 , H01L2224/05554 , H01L2224/05599 , H01L2224/48227 , H01L2224/49171 , H01L2224/85399 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H05K1/0306 , H05K2201/09309 , H05K3/403
摘要： An electronic assembly (10) includes a chip capacitor (11) having two major surfaces (12, 15) and a pair of electrodes (13, 14). A plurality of electrically conductive traces (20-23, 25-28) are formed on one (12) of the major surfaces. Some of the plurality of electrically conductive traces are electrically coupled to a first electrode (14) and some of the plurality of electrically conductive traces are coupled to a second electrode (14) of the pair of electrodes. Electronic circuit elements (16, 17, 18) are coupled to the plurality of electrically conductive traces (20-23, 25-28), thereby forming the electronic assembly (10).
摘要翻译：电子组件（10）包括具有两个主表面（12,15）和一对电极（13,14）的片状电容器（11）。多个导电迹线（20-23,25-28）形成在主表面的一个（12）上。多个导电迹线中的一些电耦合到第一电极（14），并且多个导电迹线中的一些耦合到该对电极的第二电极（14）。电子电路元件（16,17,18）耦合到多个导电迹线（20-23,25-28），从而形成电子组件（10）。

8. 发明授权

US5973337A Ball grid device with optically transmissive coating 失效
标题翻译：带光学透射涂层的球栅装置
公开(公告)号：US5973337A
公开(公告)日：1999-10-26
申请号：US917121
申请日：1997-08-25
申请人： James H. Knapp , Dwight L. Daniels , Keith E. Nelson , Brian A. Webb
发明人： James H. Knapp , Dwight L. Daniels , Keith E. Nelson , Brian A. Webb
IPC分类号： H01L23/28 , H01L21/60 , H01L23/29 , H01L23/31 , H01L23/48
CPC分类号： H01L23/315 , H01L23/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/8547 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107
摘要： A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).
摘要翻译：耦合到球栅阵列基板（11）并由光学透射材料（29,31）封装的半导体器件（10）。球栅阵列基板（11）在顶表面上具有导电互连（14）和半导体接收区（17）以及底表面上的焊盘（13）。光电子部件（24）安装在半导体接收区域（17）上并用光学透射材料（29,31）封装。在焊盘（13）上形成焊球（18）。

9. 发明申请

US20080125228A1 Evaluation of fantasy players 审中-公开
标题翻译：评估幻想球员
公开(公告)号：US20080125228A1
公开(公告)日：2008-05-29
申请号：US11606717
申请日：2006-11-29
申请人： Scott B. Ware , Brian A. Webb
发明人： Scott B. Ware , Brian A. Webb
IPC分类号： A63F9/24
CPC分类号： A63F13/828 , A63F13/10 , A63F13/12 , A63F13/35
摘要： The evaluation of players in the context of a fantasy sports league is disclosed. In order to evaluate whether a fantasy team owner should add one player to the starting lineup of the team and drop another, player stat predictions are first used to predict end-of-season stats for the current starting lineup of a team. Historical and current league stat/point functions may then be used to determine how many points the team is expected to earn during the course of a full season based on the predicted end-of-season stats. This same methodology is then applied to a proposed revised lineup to determine how many points the revised team is expected to earn during the course of a full season. The difference between the projected point totals for the current team and the revised team are an indication of the value of this specific transaction to this specific team.
摘要翻译：披露了在幻想运动联盟背景下对球员的评价。为了评估一个幻想团队所有者是否应该将一名球员添加到球队的首发阵容中，并且放弃另一个球员，球员统计预测首先用于预测球队当前阵容的季末统计数据。根据预测的季末统计数据，历史和现有的联赛统计/积分函数可用于确定团队在整个赛季期间预计将获得多少积分。然后，将相同的方法应用于拟议的修订阵容，以确定在整个赛季期间修改后的球队预计将获得多少积分。现有团队和经过修订的团队的预计总点数之间的差异，表明了这个特定团队的具体交易价值。

10. 发明授权

US06171877B2 Optical transmitter package assembly and methods of manufacture 失效
标题翻译：光发射机封装组装及制造方法
公开(公告)号：US06171877B2
公开(公告)日：2001-01-09
申请号：US09099022
申请日：1998-06-17
申请人： Brian A. Webb
发明人： Brian A. Webb
IPC分类号： H01L2100
CPC分类号： H01L33/62 , H01L25/167 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01S5/02228 , H01S5/02244 , H01L2924/00012
摘要： A package assembly (31) has a leadframe (10) including a locating flange (30), an optical transmitter (22) such as a laser diode mounted to the leadframe, and a package (32) enclosing both the optical transmitter and a portion of the leadframe so that the locating flange of the leadframe is disposed outside of the package. The locating flange is used as a reference datum to align the optical transmitter's relative height and lateral position during manufacture. Also, the locating flange is used as a reference datum in mating the package assembly to other, standard optical components when mounting to other components in an optical end product.
摘要翻译：包装组件（31）具有包括定位凸缘（30）的引线框架（10），安装在引线框架上的诸如激光二极管的光发射器（22）以及包围光发送器和一部分引线框架的定位凸缘设置在封装的外部。定位法兰用作参考基准，用于在制造过程中对准光发射机的相对高度和横向位置。此外，当安装到光学终端产品中的其他部件时，定位凸缘用作将包装组件与其他标准光学部件配合的参考基准。

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