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    • 4. 发明授权
    • Complementary metal oxide semiconductor with improved single event performance
    • 具有改善的单一事件性能的互补金属氧化物半导体
    • US06653708B2
    • 2003-11-25
    • US09918208
    • 2001-07-30
    • Brent R. Doyle
    • Brent R. Doyle
    • H01L2900
    • H01L27/0921
    • A junction isolated Complementary Metal Oxide Semiconductor (CMOS) transistor device includes a substrate of a first conductivity type and first and second buried layers formed within the substrate and having a second conductivity type opposite from the first conductivity type. First and second well regions of respective first and second conductivity are formed above respective first and second buried layers. An NMOS transistor and PMOS transistor are formed in the respective first and second well regions. The buried layer of the NMOS transistor is at −V (typically ground) and the buried layer of the PMOS transistor is biased at a positive supply voltage and spaced sufficiently from the NMOS transistor to improve single event effects occurrence.
    • 接合隔离的互补金属氧化物半导体(CMOS)晶体管器件包括第一导电类型的衬底和形成在衬底内并具有与第一导电类型相反的第二导电类型的第一和第二掩埋层。 各自的第一和第二导电性的第一和第二阱区形成在相应的第一和第二埋层之上。 在相应的第一和第二阱区域中形成NMOS晶体管和PMOS晶体管。 NMOS晶体管的掩埋层处于-V(通常接地),并且PMOS晶体管的掩埋层被偏置在正电源电压并且与NMOS晶体管充分隔开以改善单个事件效应的出现。
    • 10. 发明授权
    • Method of fabricating up diffused substrate FED logic utilizing a
two-step epitaxial deposition
    • 使用两步外延沉积制造扩散衬底FED逻辑的方法
    • US4240846A
    • 1980-12-23
    • US919632
    • 1978-06-27
    • Brent R. Doyle
    • Brent R. Doyle
    • H01L21/20H01L21/74H01L21/822H01L21/8228H01L27/02
    • H01L27/0237H01L21/74H01L21/822H01L21/82285
    • A complementary pair of vertically aligned, inversely operated transistors formed from a P type substrate, a first N type epitaxial layer, a second N type epitaxial layer and a buried, updiffused P type region between the two epitaxial layers. The impurity concentration of the buried region decreases from its junction with the first epitaxial layer to its junction with the second epitaxial layer whose impurity concentration is less than that of the first epitaxial layer. High impurity concentration N type guard ring and P type base ring are diffused simultaneously with the out diffusion of the buried P type region into the second epitaxial layer. The substrate, first epitaxial layer and buried region constitute the emitter, base, and collector of the inverse vertical PNP transistor and the first epitaxial layer, buried region and second epitaxial layer constitute the emitter, base, and collector of the inverse vertical NPN transistor.
    • 在两个外延层之间由P型衬底,第一N型外延层,第二N型外延层和埋入式更新的P型区域形成的互补对垂直对准的反向操作的晶体管。 掩埋区域的杂质浓度从其与第一外延层的接合到其与杂质浓度小于第一外延层的杂质浓度的第二外延层的结的下降。 高杂质浓度N型保护环和P型基环与掩埋P型区域扩散到第二外延层同时扩散。 衬底,第一外延层和掩埋区域构成反垂直PNP晶体管的发射极,基极和集电极,第一外延层,埋入区和第二外延层构成反向垂直NPN晶体管的发射极,基极和集电极。