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    • 1. 发明申请
    • FETS WITH SELF-ALIGNED BODIES AND BACKGATE HOLES
    • 具有自对准体和背部孔的FET
    • US20080083951A1
    • 2008-04-10
    • US11869766
    • 2007-10-10
    • Brent AndersonAndres BryantEdward NowakRichard Williams
    • Brent AndersonAndres BryantEdward NowakRichard Williams
    • H01L27/12
    • H01L29/78612H01L29/66772H01L29/78621H01L29/78648
    • Embodiments of the invention disclose a design structure for a FET with a shallow source/drain region, a deep channel region, a gate stack and a back gate that is surrounded by dielectric. The FET structure also includes halo or pocket implants that extend through the entire depth of the channel region. Because a portion of the halo and well doping of the channel is deeper than the source/drain depth, better threshold voltage and process control is achieved. A back-gated FET structure is also provided having a first dielectric layer in this structure that runs under the shallow source/drain region between the channel region and the back gate. This first dielectric layer extends from under the source/drain regions on either side of the back gate and is in contact with a second dielectric such that the back gate is bounded on each side or isolated by dielectric.
    • 本发明的实施例公开了具有浅电源/漏极区域,深沟道区域,栅极叠层和被电介质包围的背栅的FET的设计结构。 FET结构还包括延伸通过通道区域的整个深度的晕或凹坑植入物。 因为沟道的一部分光晕和阱掺杂比源极/漏极深度更深,所以实现了更好的阈值电压和过程控制。 还提供了后栅化FET结构,其具有在该结构中的第一介电层,其在沟道区域和后栅极之间的浅源极/漏极区域下方延伸。 该第一电介质层从背栅的两侧的源极/漏极区下方延伸并与第二电介质接触,使得后栅极在每一侧上界定或通过电介质隔离。
    • 3. 发明申请
    • Structure and method for dual-gate FET with SOI substrate
    • 具有SOI衬底的双栅极FET的结构和方法
    • US20060240610A1
    • 2006-10-26
    • US11265464
    • 2005-11-02
    • Edward NowakRichard Williams
    • Edward NowakRichard Williams
    • H01L21/8234
    • H01L29/785H01L29/41791H01L29/42384H01L29/66795H01L2029/7858
    • A method of forming a dual gate fin-type field effect transistor (FinFET) structure patterns silicon fins over an insulator and patterns a gate conductor at an angle to the fins. The gate conductor is formed laterally adjacent to and over center portions of the fins. The gate conductor is planarized such that the gate conductor is separated into distinct gate conductor portions that are separated by the fins. These gate conductor portions include front gates and back gates. The front gates and the back gates alternate along the structure, such that each fin has a front gate on one side and a back gate on the opposite side. Then front gate wiring is formed to the front gates and back gate wiring is formed to the back gates.
    • 形成双栅极鳍型场效应晶体管(FinFET)结构的方法在绝缘体上形成硅散热片,并以与鳍片成角度的方式形成栅极导体。 栅极导体横向地形成在鳍片的中心部分附近并且越过其中心部分。 栅极导体被平坦化,使得栅极导体分离成由鳍分开的不同的栅极导体部分。 这些栅极导体部分包括前门和后门。 前门和后门沿着结构交替,使得每个鳍具有一侧的前门和相对侧上的后门。 然后,前栅极布线形成于前栅极,并且后栅极布线形成于后栅极。
    • 5. 发明申请
    • INTEGRATED CIRCUIT (IC) WITH HIGH-Q ON-CHIP DISCRETE CAPACITORS
    • 集成电路(IC)与高Q片上分离电容器
    • US20060244061A1
    • 2006-11-02
    • US10908081
    • 2005-04-27
    • Edward NowakRichard Williams
    • Edward NowakRichard Williams
    • H01L27/12
    • H01L27/1203H01L27/0805H01L29/94
    • A semiconductor structure that may be a discrete capacitor, a Silicon On Insulator (SOI) Integrated Circuit (IC) including circuits with discrete such capacitors and/or decoupled by such discrete capacitors and an on-chip decoupling capacitor (decap). One capacitor plate may be a well (N-well or P-well) in a silicon bulk layer or a thickened portion of a surface silicon layer. The other capacitor plate may be doped polysilicon and separated from the first capacitor plate by capacitor dielectric, e.g., CVD or thermal oxide. Contacts to each of the capacitor plates directly connect and extend from the respective plates, such that direct contact is available from both plates.
    • 可以是分立电容器的半导体结构,包括具有离散这种电容器的电路和/或由这种分立电容器去耦合的片上绝缘体(SOI)集成电路(IC)和片上去耦电容器(decap))。 一个电容器板可以是硅本体层中的阱(N阱或P阱)或表面硅层的增厚部分。 另一个电容器板可以是掺杂多晶硅并且通过电容器电介质例如CVD或热氧化物与第一电容器板分离。 与每个电容器板的接触件从相应的板直接连接和延伸,使得从两个板可以直接接触。
    • 7. 发明申请
    • DOPED SINGLE CRYSTAL SILICON SILICIDED EFUSE
    • 单晶硅晶硅胶
    • US20070026579A1
    • 2007-02-01
    • US11161320
    • 2005-07-29
    • Edward NowakJed RankinWilliam TontiRichard Williams
    • Edward NowakJed RankinWilliam TontiRichard Williams
    • H01L21/84
    • H01L27/10H01L23/5256H01L2924/0002H01L2924/3011H01L2924/00
    • An eFuse begins with a single crystal silicon-on-insulator (SOI) structure that has a single crystal silicon layer on a first insulator layer. The single crystal silicon layer is patterned into a strip. Before or after the patterning, the single crystal silicon layer is doped with one or more impurities. At least an upper portion of the single crystal silicon layer is then silicided to form a silicided strip. In one embodiment the entire single crystal silicon strip is silicided to create a silicide strip. Second insulator(s) is/are formed on the silicide strip, so as to isolate the silicided strip from surrounding structures. Before or after forming the second insulators, the method forms electrical contacts through the second insulators to ends of the silicided strip. By utilizing a single crystal silicon strip, any form of semiconductor, such as a diode, conductor, insulator, transistor, etc. can form the underlying portion of the fuse structure. The overlying silicide material allows the fuse to act as a conductor in its unprogrammed state. However, contrary to metal or polysilicon based eFuses which only comprise an insulator in the programmed state, when the inventive eFuse is programmed (and the silicide is moved or broken) the underlying semiconductor structure operates as an active semiconductor device.
    • eFuse从在第一绝缘体层上具有单晶硅层的单晶硅绝缘体(SOI)结构开始。 将单晶硅层图案化成条带。 在构图之前或之后,单晶硅层掺杂有一种或多种杂质。 至少单晶硅层的上部然后被硅化以形成硅化带。 在一个实施例中,整个单晶硅带被硅化以产生硅化物条。 在硅化物条上形成第二绝缘体,从而将硅化物带与周围结构隔离。 在形成第二绝缘体之前或之后,该方法通过第二绝缘体形成与硅化带的端部的电接触。 通过使用单晶硅条,任何形式的半导体,例如二极管,导体,绝缘体,晶体管等都可以形成熔丝结构的下面部分。 上覆的硅化物材料允许熔丝作为未编程状态的导体。 然而,与仅编程状态的仅包含绝缘体的金属或多晶硅基eFuse相反,当本发明的eFuse被编程(并且硅化物被移动或断开)时,下面的半导体结构作为有源半导体器件工作。