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1. 发明授权

US06625026B1 Heat-activated self-aligning heat sink 失效
标题翻译：热活化自对准散热片
公开(公告)号：US06625026B1
公开(公告)日：2003-09-23
申请号：US10210000
申请日：2002-07-31
申请人： Brent A. Boudreaux , Stacy Fraker , Roy M. Zeighami , Eric C. Peterson , Christian L. Belady
发明人： Brent A. Boudreaux , Stacy Fraker , Roy M. Zeighami , Eric C. Peterson , Christian L. Belady
IPC分类号： H05K720
CPC分类号： F28F13/00 , F28F2013/005 , H01L21/4882 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
摘要翻译：热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上，其中发热装置可能由于公差叠加而彼此不共面或与散热器主体平行。基座附接到基板以支撑散热体。插头或浮动底座放置在每个发热装置的顶部并且保持在基座内，允许足够的运动使插塞的底表面完全接触发热装置的顶表面。将一定数量的低熔点温度的导热材料，例如焊料或导热液体放置在每个塞子上，并将散热器主体放置在组件上。当加热时，热材料熔化，在插头和散热器本体之间形成低阻抗热连接，而与两个器件之间的平面度差异无关。

2. 发明授权

US06695042B1 Adjustable pedestal thermal interface 失效
标题翻译：可调基座热接口
公开(公告)号：US06695042B1
公开(公告)日：2004-02-24
申请号：US10209981
申请日：2002-07-31
申请人： Brent A. Boudreaux , Stacy Fraker , Eric C. Peterson , Christian L. Belady
发明人： Brent A. Boudreaux , Stacy Fraker , Eric C. Peterson , Christian L. Belady
IPC分类号： F28D1500
CPC分类号： F28F13/00 , F28F2013/006 , H01L21/4882 , H01L23/4338 , H01L2924/0002 , H01L2924/3011 , Y10T29/49353 , H01L2924/00
摘要： A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.
摘要翻译：构造了散热器，其包括至少一个导热基座，允许散热器的配置与多个发热电子器件接触，其中由于公差叠加，器件可能不是共面的。基座可以根据需要升高和降低并倾斜以匹配电子设备的高度和倾斜度。在散热器内部是在基座上方的空腔，其可以在构造期间填充有导热材料，例如焊料或导热液体，以在基座和散热鳍片之间产生低热阻接触。此外，可以在发热装置和基座之间使用导热材料，例如热膏或热垫，以产生低热阻接触。

3. 发明授权

US07475175B2 Multi-processor module 失效
标题翻译：多处理器模块
公开(公告)号：US07475175B2
公开(公告)日：2009-01-06
申请号：US10800837
申请日：2004-03-15
申请人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
发明人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
IPC分类号： H01L23/34 , H01L23/12 , H05K7/20 , G06F13/00
CPC分类号： G06F15/0216 , G06F15/7864
摘要： An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.
摘要翻译：一种装置包括多个逻辑上独立的处理器，系统总线以及与多个处理器通信的高速缓存控制和总线桥接器件，使得高速缓存控制和总线桥接器件被逻辑地插入在处理器和系统总线之间，以及其中所述处理器和高速缓存控制和总线桥接器件以模块形式被布置，使得所述设备是用于标准单处理器模块的插入式替换。

4. 发明授权

US06819562B2 Cooling apparatus for stacked components 有权
标题翻译：用于堆叠部件的冷却装置
公开(公告)号：US06819562B2
公开(公告)日：2004-11-16
申请号：US10355424
申请日：2003-01-31
申请人： Brent A. Boudreaux , Roy M. Zeighami , Christian L. Belady
发明人： Brent A. Boudreaux , Roy M. Zeighami , Christian L. Belady
IPC分类号： H05K720
CPC分类号： H01L23/4338 , B41J29/377 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus for stacked components. Heat generating components may be mounted on two sides of a first printed circuit board. A second circuit board may be stacked over the first circuit board with a thermally conductive frame disposed between the two boards. The frame includes a cross member thermally coupled to the heat generating component on the top side of the first circuit board. The heat generating component on the bottom side of the first circuit board is thermally coupled to one leg of a thermally-conductive strap. The strap has a second leg that is thermally coupled to one end of the thermally conductive frame and also to one end of a heat distribution member mounted adjacent the second circuit board. The apparatus functions to channel heat from the first board's top and bottom components to the heat distribution member via the thermally-conductive frame and the thermally-conductive strap.
摘要翻译：一种用于堆叠部件的冷却装置。发热部件可以安装在第一印刷电路板的两侧。第二电路板可以堆叠在第一电路板上，其中设置在两个板之间的导热框架。框架包括热耦合到第一电路板的顶侧上的发热部件的横向部件。第一电路板的底侧上的发热部件热耦合到导热带的一个支脚。带子具有热耦合到导热框架的一端的第二腿部，并且还连接到邻近第二电路板安装的配热构件的一端。该装置用于将热量从第一板的顶部和底部部件经由导热框架和导热带引导到散热构件。

5. 发明授权

US07345885B2 Heat spreader with multiple stacked printed circuit boards 失效
标题翻译：具有多层叠印刷电路板的散热器
公开(公告)号：US07345885B2
公开(公告)日：2008-03-18
申请号：US11023213
申请日：2004-12-22
申请人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
发明人： Brent A. Boudreaux , Shaun L Harris , Eric C. Peterson , Christian L Belady , Gary W. Williams , Stuart C. Haden
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H05K1/144 , H01L2924/0002 , H05K1/0204 , H05K3/0061 , H05K2201/09054 , H05K2201/1056 , H01L2924/00
摘要： A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
摘要翻译：具有多个堆叠印刷电路板（PCBS）的散热器包括顶部和侧部，其中容纳第一PCB，并且底部边缘延伸到第二PCB。散热器和第二PCB基本上围绕其中的第一PCB。

6. 发明授权

US06910271B2 Mechanical highly compliant thermal interface pad 有权
标题翻译：机械高度兼容的热界面垫
公开(公告)号：US06910271B2
公开(公告)日：2005-06-28
申请号：US10283907
申请日：2002-10-29
申请人： Eric C. Peterson , Brent A. Boudreaux , Christian L. Belady
发明人： Eric C. Peterson , Brent A. Boudreaux , Christian L. Belady
IPC分类号： H05K7/20 , F28F23/00 , H01L23/36 , B21D53/02
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译：热界面垫由多个热界面板组件构成。替代的热界面板组件在衬垫内相互旋转约180度。每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。热界面板组件被配置为允许热界面垫的厚度变化很大。垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。插入板中的开口中的杆可以用于对准板组件并且向板施加压力，从而改善相邻板之间的热导率并大大降低热界面垫的整体热阻。

7. 发明授权

US07131199B2 Mechanical highly compliant thermal interface pad 有权
标题翻译：机械高度兼容的热界面垫
公开(公告)号：US07131199B2
公开(公告)日：2006-11-07
申请号：US11049346
申请日：2005-02-01
申请人： Eric C. Peterson , Brent A. Boudreaux , Christian L. Belady
发明人： Eric C. Peterson , Brent A. Boudreaux , Christian L. Belady
IPC分类号： B21D53/02 , H05K7/20
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译：热界面垫由多个热界面板组件构成。替代的热界面板组件在衬垫内相互旋转约180度。每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。热界面板组件被配置为允许热界面垫的厚度变化很大。垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。插入板中的开口中的杆可以用于对准板组件并且向板施加压力，改善相邻板之间的热导率并大大降低热界面垫的总体热阻。

8. 发明授权

US07117929B2 Heat sink 失效
标题翻译：散热器
公开(公告)号：US07117929B2
公开(公告)日：2006-10-10
申请号：US10976033
申请日：2004-10-27
申请人： Robert Curtis , Brent A. Boudreaux , Christian L. Belady , Eric C. Peterson , Shaun L. Harris
发明人： Robert Curtis , Brent A. Boudreaux , Christian L. Belady , Eric C. Peterson , Shaun L. Harris
IPC分类号： F28F7/00
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.
摘要翻译：建造了第一个散热器，其中包括两组散热片，两组散热片之间具有间隙。间隙被配置为允许将第二散热器放置在第一散热器的两个翅片组之间。第一散热器还包括开槽的安装凸耳，以允许第二散热器安装到第一散热器，从而允许由第一和第二散热器冷却的发热装置的叠加公差变化。

9. 发明授权

US06873530B2 Stack up assembly 有权
公开(公告)号：US06873530B2
公开(公告)日：2005-03-29
申请号：US10890937
申请日：2004-07-13
申请人： Christian L. Belady , Shaun L. Harris , Gary Wayne Williams , Brent A. Boudreaux
发明人： Christian L. Belady , Shaun L. Harris , Gary Wayne Williams , Brent A. Boudreaux
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.

10. 发明授权

US06771507B1 Power module for multi-chip printed circuit boards 失效
标题翻译：多芯片印刷电路板电源模块
公开(公告)号：US06771507B1
公开(公告)日：2004-08-03
申请号：US10355707
申请日：2003-01-31
申请人： Christian L. Belady , Shaun L. Harris , Gary Wayne Williams , Brent A. Boudreaux
发明人： Christian L. Belady , Shaun L. Harris , Gary Wayne Williams , Brent A. Boudreaux
IPC分类号： H05H720
CPC分类号： H01L23/4338 , H01L23/4006 , H01L2924/0002 , H05K1/0204 , H01L2924/00
摘要： A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.
摘要翻译：一种用于多芯片印刷电路板的功率模块组件：散热板具有一体地形成在其中的第一和第二接地部分。插座上装有第一和第二导热销。功率模块印刷电路板安装在配热板上，并在其中形成有第一和第二间隙孔。销的第一和第二领域突出穿过第一和第二间隙孔。多芯片印刷电路板可以安装在功率模块的下方，使得导热针接触第一和第二提供芯片的表面。提供的芯片在物理上靠近电源模块，并且借助于所提供的芯片和导热引脚之间的接触来提供所提供的芯片的热管理。多芯片印刷电路板上的空间是保守的。

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