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    • 3. 发明授权
    • Toner containing resin prepared by a combination of emulsion followed by suspension polymerization
    • 通过乳液组合制备的含有调色剂的树脂,然后进行悬浮聚合
    • US06258504B1
    • 2001-07-10
    • US09417430
    • 1999-10-13
    • Jan BartusRobert JanulesJames BoswellJeffrey Clark
    • Jan BartusRobert JanulesJames BoswellJeffrey Clark
    • G03G500
    • G03G9/08702G03G9/08795G03G9/08797
    • A method for preparing thermoplastic toner resins is disclosed and the toner resins produced by said method. More particularly, an emulsion polymerized resin, constituting a high molecular weight component, is used as a seed for subsequent suspension polymerization of a lower molecular weight component. The emulsion micelles are swelled with monomers and subsequent suspension polymerization produces particles where the high and low molecular weight components are interpenetrated to form a resin with a bimodal distribution of molecular weight. A toner composition is made using the resin as the main component. The resin particle has a first resin portion having a particle size in the range of about 50 to about 200 nm. and a number average molecular weight in the range of about 104 to about 107, and a second resin portion formed around the first resin portion with a number average molecular weight lower than that of said first resin portion, the resin having a polydispersity in the range of 5 to 50.
    • 公开了制备热塑性调色剂树脂的方法和通过所述方法制备的调色剂树脂。 更具体地,使用构成高分子量组分的乳液聚合树脂作为用于随后的低分子量组分的悬浮聚合的种子。 乳液胶束用单体溶胀,随后的悬浮聚合产生颗粒,其中高分子量组分和低分子量组分互穿形成具有分子量双峰分布的树脂。 使用树脂作为主要成分制成调色剂组合物。 树脂颗粒具有粒径在约50至约200nm范围内的第一树脂部分。 数均分子量在约104至约107的范围内,第二树脂部分形成在第一树脂部分周围,数均分子量低于所述第一树脂部分的数均分子量,该树脂的多分散性在该范围内 为5至50。
    • 4. 发明申请
    • Equalization Contouring by a Control Curve
    • 控制曲线的均衡轮廓
    • US20170026016A1
    • 2017-01-26
    • US14805118
    • 2015-07-21
    • Jeffrey Clark
    • Jeffrey Clark
    • H03G5/16
    • H03G5/165H03G5/025
    • A method for equalization contouring provides a reduction of equalization in certain frequency regions either by user control or by automated selection of frequency, without introducing artifacts. A control curve smoothly scales the magnitude of the equalization in the areas where less equalization is desired to obtain a contoured equalization. The control curve varies by frequency and may be defined specifically for every sampled frequency value of the equalization, may be a continuous function of frequency, or may be a function of control points at a select number of frequency points. The control curve may also have automatic inputs, e.g. a machine-detected cutoff frequency of a speaker may be used to determine a control point in the control curve. As another example, the reverberation time (e.g. RT60) may be used to determine a control point in the control curve. The result is a contoured equalization curve without sudden steps.
    • 用于均衡轮廓的方法通过用户控制或通过频率的自动选择来减少某些频率区域中的均衡,而不引入伪像。 控制曲线在需要较小均衡的区域中平滑地缩放均衡的大小以获得轮廓均衡。 控制曲线根据频率而变化,并且可以针对均衡的每个采样频率值进行具体定义,可以是频率的连续函数,或者可以是选择频率点的控制点的函数。 控制曲线也可以具有自动输入,例如, 可以使用扬声器的机器检测的截止频率来确定控制曲线中的控制点。 作为另一示例,可以使用混响时间(例如RT60)来确定控制曲线中的控制点。 结果是没有突然的步骤的轮廓均衡曲线。
    • 6. 发明申请
    • Precision slicing of large work pieces
    • 大型工件精密切片
    • US20070251516A1
    • 2007-11-01
    • US11413679
    • 2006-04-28
    • Albert NieberCharles DarcangeloJeffrey ClarkWilliam Angell
    • Albert NieberCharles DarcangeloJeffrey ClarkWilliam Angell
    • B28D1/08
    • B23D57/0023B23D61/185B28D1/08B28D5/045
    • Disclosed is a process capable of precision slicing substrates with a dimension in the linear direction of at least I meter, comprising the following steps: (I) affixing the work piece to a stage; (11) providing multiple essentially parallel, essentially straight wires having a diameter in the range from about 100 μm to about 600 μm, and allowing the multiple wires to contact the surface of the work piece; (III) allowing the multiple wires to travel in linear directions, optionally with cutting slurry dispensed thereon; and (IV) allowing the multiple wires to move in the slicing directions relative to the work piece; wherein in step (IV), the multiple wires maintain essentially straight and essentially parallel to each other. The process can be used for slicing silica glass substrates having a diameter large than 2 meters in producing slices thereof with a high surface flatness and a low thickness variation.
    • 公开了一种能够将直径至少为1米的尺寸进行精密切片的方法,其包括以下步骤:(I)将工件固定在台面上; (11)提供多个基本上平行的,基本上直的导线,其直径在约100μm至约600μm之间,并且允许多个线接触工件的表面; (III),允许多根线材在线性方向上行进,任选地切割分配在其上的浆料; 和(IV)允许多条线相对于工件在切片方向上移动; 其中在步骤(IV)中,所述多条丝基本上保持基本上是直的并且基本上彼此平行。 该方法可用于切割直径大于2米的石英玻璃基板,以高表面平整度和低厚度变化制造切片。