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    • 6. 发明申请
    • Method for Production of a Radiation-Emitting Semiconductor Chip
    • 辐射发射半导体芯片的制造方法
    • US20080093611A1
    • 2008-04-24
    • US11579194
    • 2004-04-29
    • Berthold HahnStephan KaiserVolker Harle
    • Berthold HahnStephan KaiserVolker Harle
    • H01L21/04H01L33/00
    • H01L33/22H01L33/0079
    • A method for micropatterning a radiation-emitting surface of a semiconductor layer sequence for a thin-film light-emitting diode chip. The semiconductor layer sequence is grown on a substrate. A mirror layer is formed or applied on the semiconductor layer sequence, which reflects back into the semiconductor layer sequence at least part of a radiation that is generated in the semiconductor layer sequence during the operation thereof and is directed toward the mirror layer. The semiconductor layer sequence is separated from the substrate by means of a lift-off method, in which a separation zone in the semiconductor layer sequence is at least partly decomposed in such a way that anisotropic residues of a constituent of the separation zone, in particular a metallic constituent of the separation layer, remain at the separation surface of the semiconductor layer sequence, from which the substrate is separated. The separation surface—provided with the residues—of the semiconductor layer sequence with a dry etching method, a gaseous etchant or a wet-chemical etchant, wherein the anisotropic residues are at least temporarily used as an etching mask. A semiconductor chip is produced according to such a method.
    • 一种用于对薄膜发​​光二极管芯片的半导体层序列的辐射发射表面进行微图形化的方法。 半导体层序列在衬底上生长。 在半导体层序列上形成或施加镜层,其反射回到半导体层序列中,半导体层序列在其操作期间在半导体层序列中产生的辐射的至少一部分并且被指向镜层。 通过剥离方法将半导体层序列与衬底分离,其中半导体层序列中的分离区域至少部分地被分解,使得分离区的成分的各向异性残留物 分离层的金属成分保留在半导体层序列的分离表面,基板从该分离表面分离。 具有干蚀刻方法的半导体层序列的残留物的分离表面,气体蚀刻剂或湿化学蚀刻剂,其中各向异性残余物至少暂时用作蚀刻掩模。 根据这种方法制造半导体芯片。