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1. 发明申请

US20090288566A1 Method for Producing Printing Stencils, Particularly for Screen Printing Methods, and a Stencil Device 审中-公开
标题翻译：用于生产印刷模板的方法，特别是丝网印刷方法和模板装置
公开(公告)号：US20090288566A1
公开(公告)日：2009-11-26
申请号：US12087254
申请日：2007-01-02
申请人： Bernd Maihoefer , Andreas Meier , Mark Leverkoehne , Ulrich Speh , Gunther Lieb , Alexandra Dirscherl , Joerg Schaefer
发明人： Bernd Maihoefer , Andreas Meier , Mark Leverkoehne , Ulrich Speh , Gunther Lieb , Alexandra Dirscherl , Joerg Schaefer
IPC分类号： B05C17/08 , B41M1/12
CPC分类号： B41F15/34 , B41C1/14 , B41F15/36 , B41P2215/12 , H05K1/0306 , H05K3/005 , H05K3/1225 , H05K3/4053 , H05K3/4061
摘要： A method for producing printing stencils, especially for screen printing methods, and particularly those for use in filling at least one contact hole formed in a printed-circuit board, a pattern artwork being reproduced on the stencil, which corresponds to an arrangement of contact holes on the printed-circuit board. It is provided that the pattern artwork reproduced on the stencil be produced in the same working process, especially a punching process, using a cluster punching tool, as the at least one contact hole on the printed-circuit board. Also, a stencil device is provided.
摘要翻译：一种生产印刷模版的方法，特别是丝网印刷方法，特别是用于填充形成在印刷电路板中的至少一个接触孔的印刷模版的方法，在模板上再现的图案图案对应于接触孔的布置在印刷电路板上。提供了在模板上再现的图案图案在相同的工作过程中产生，特别是使用簇冲孔工具作为印刷电路板上的至少一个接触孔的冲压工艺。此外，还提供了模板装置。

2. 发明申请

US20110100684A1 METHOD FOR MANUFACTURING AN ELECTRICAL CONDUCTOR BY APPLYING AT LEAST ONE PASTE, IN PARTICULAR A THICK-FILM PASTE 审中-公开
标题翻译：通过应用至少一种浆料制造电导体的方法，特别是厚膜膏
公开(公告)号：US20110100684A1
公开(公告)日：2011-05-05
申请号：US12810738
申请日：2008-12-19
申请人： Peter Hornig , Mark Leverkoehne , Philipp Janovsky , Bernd Maihoefer , Juergen Egerter , Walter Roethlingshofer , Stefan Keil , Harald Neumann , Heike Schluckwerder , Markus Werner , Ulrich Speh , Frank Westphal , Josef Weber
发明人： Peter Hornig , Mark Leverkoehne , Philipp Janovsky , Bernd Maihoefer , Juergen Egerter , Walter Roethlingshofer , Stefan Keil , Harald Neumann , Heike Schluckwerder , Markus Werner , Ulrich Speh , Frank Westphal , Josef Weber
IPC分类号： H05K1/02 , H05K3/10 , H01C17/065 , B05D3/06
CPC分类号： H05K1/167 , H01C17/06506 , H05K3/1241 , H05K2203/0126 , H05K2203/0545
摘要： A method for manufacturing an electrical conductor by applying at least one paste, in particular a thick-film paste, to a substrate by a dispensing operation, wherein the paste is applied in at least one strand.
摘要翻译：一种用于通过分配操作将至少一种浆料，特别是厚膜浆料施加到基材上来制造电导体的方法，其中所述糊料以至少一根线材施加。

3. 发明申请

US20050178504A1 Apparatus and method for treating disc-shaped substrates 审中-公开
标题翻译：用于处理盘形基板的装置和方法
公开(公告)号：US20050178504A1
公开(公告)日：2005-08-18
申请号：US10501256
申请日：2002-12-20
申请人： Ulrich Speh , Eberhard Nagele
发明人： Ulrich Speh , Eberhard Nagele
IPC分类号： B08B3/02 , H01L21/00 , B44C1/22 , C23F1/00
CPC分类号： H01L21/6708 , B08B3/02 , H01L21/67051
摘要： In order to carry out simple, low-cost, uniform treatment of substrates, a device is provided for the processing of disk-shaped substrates, especially semiconductor wafers, comprising a substantially flat carrier ring, which can be rotated on a plane about an axis of rotation by means of a rotation device, and at least three support elements extending from the plane of the carrier ring, forming a multi-point support for the support at a distance from the plane of the carrier ring. The invention also relates to a device and a method for the treatment of disk-shaped substrates, especially semiconductor wafers, wherein the substrates are rotated about an axis of rotation which is disposed in a substantially vertical position with respect to the plane of the substrates and whereby at least one first group of nozzles are disposed at various distances from the axis of rotation, enabling a first fluid to be applied, said nozzles being controlled either individually or in sub-groups, in order to carry out selective treatment of surface areas of the substrate.
摘要翻译：为了进行基板的简单，低成本，均匀的处理，提供了一种用于处理盘状基板，特别是半导体晶片的装置，该半导体晶片包括基本平坦的载体环，其可在围绕轴线的平面上旋转通过旋转装置的旋转，以及从承载环的平面延伸的至少三个支撑元件，在与承载环的平面相距一定距离处形成用于支撑件的多点支撑。本发明还涉及一种用于处理盘形基底，特别是半导体晶片的器件和方法，其中基片围绕旋转轴线旋转，该旋转轴线相对于基底的平面设置在基本垂直的位置，由此至少一个第一组喷嘴设置在与旋转轴线不同的距离处，使得能够施加第一流体，所述喷嘴被单独地或分组地控制，以便执行选择性处理表面积底物。

4. 发明授权

US08281485B2 Method of producing a circuit board layer 有权
标题翻译：电路板层的制造方法
公开(公告)号：US08281485B2
公开(公告)日：2012-10-09
申请号：US12734467
申请日：2008-10-13
申请人： Peter Tauber , Tuncay Sentuerk , Ulrich Speh
发明人： Peter Tauber , Tuncay Sentuerk , Ulrich Speh
IPC分类号： H05K3/36
CPC分类号： H05K3/1225 , H01L21/486 , H01L21/4867 , H05K1/0306 , H05K3/0029 , H05K3/4061 , H05K2203/0191 , H05K2203/107 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.
摘要翻译：一种用于制造电路板层的方法，特别是用于多层电路板的陶瓷箔，其上使用载体箔，所述载体箔被激光穿孔以形成至少一个电路迹线，和/或载体箔和陶瓷箔通过激光穿孔在一起以形成至少一个馈通，随后通过印刷形成电路迹线和/或馈通，构成印刷丝网的载体箔，随后从陶瓷箔中去除载体箔。

5. 发明授权

US06799588B1 Apparatus for treating substrates 有权
标题翻译：用于处理基材的设备
公开(公告)号：US06799588B1
公开(公告)日：2004-10-05
申请号：US10031923
申请日：2002-04-17
申请人： Ulrich Speh , Jens Schneider , Marc Meuris
发明人： Ulrich Speh , Jens Schneider , Marc Meuris
IPC分类号： B08B304
CPC分类号： H01L21/67057 , H01L21/67051 , Y10S134/902
摘要： The aim of the invention is to attain a uniform and homogeneous treatment of substrates in a device comprising at least one process container which is arranged in a gas atmosphere and which contains a treatment fluid. Said process container also comprises at least two openings which are located underneath a treatment fluid surface and through which the substrates are linearly guided. In addition, an overflow for the treatment fluid is provided.
摘要翻译：本发明的目的是在包括至少一个处理容器的装置中实现均匀且均匀的处理基板，所述处理容器布置在气体气氛中并且包含处理流体。所述处理容器还包括位于处理流体表面下方的至少两个开口，并且基底线被直线地引导。此外，提供了处理流体的溢流。

6. 发明申请

US20100325881A1 METHOD FOR PRODUCING A CIRCUIT BOARD LAYER (CIRCUIT LEVEL), FOR AN IN PARTICULAR MULTILAYER CIRCUIT BOARD (CERAMIC SUBSTRATE) 有权
标题翻译：用于生产电路板层（电路层）的方法，用于特殊多层电路板（陶瓷基板）
公开(公告)号：US20100325881A1
公开(公告)日：2010-12-30
申请号：US12734467
申请日：2008-10-13
申请人： Peter Tauber , Tuncay Sentuerk , Ulrich Speh
发明人： Peter Tauber , Tuncay Sentuerk , Ulrich Speh
IPC分类号： H05K3/00
CPC分类号： H05K3/1225 , H01L21/486 , H01L21/4867 , H05K1/0306 , H05K3/0029 , H05K3/4061 , H05K2203/0191 , H05K2203/107 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method for producing a circuit board layer, in particular for a multilayer circuit board, a ceramic foil upon which a carrier foil is disposed being used, the carrier foil being perforated by laser to form at least one circuit trace, and/or the carrier foil and the ceramic foil being perforated together by laser to form at least one feedthrough, the circuit trace and/or the feedthrough subsequently being created by printing, the carrier foil constituting a printing screen, and the carrier foil subsequently being removed from the ceramic foil.
摘要翻译：一种用于制造电路板层的方法，特别是用于多层电路板的陶瓷箔，其上使用载体箔，所述载体箔被激光穿孔以形成至少一个电路迹线，和/或载体箔和陶瓷箔通过激光穿孔在一起以形成至少一个馈通，随后通过印刷形成电路迹线和/或馈通，构成印刷丝网的载体箔，随后从陶瓷箔中去除载体箔。

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