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    • 3. 发明授权
    • Method of producing a layered arrangement and layered arrangement
    • 制造层叠布置和分层布置的方法
    • US07413971B2
    • 2008-08-19
    • US10498421
    • 2002-10-23
    • Werner SteinhöglFranz KreuplWolfgang Hönlein
    • Werner SteinhöglFranz KreuplWolfgang Hönlein
    • H01L21/44
    • H01L21/7682B82Y10/00H01L51/0048H01L2221/1047Y10S977/742
    • An arrangement and process for producing a circuit arrangement is disclosed. The process includes having a layer arrangement, in which two electrically conductive interconnects running substantially parallel to one another are formed on a substrate. At least one auxiliary structure is formed on the substrate and between the two interconnects, running in a first direction, which first direction includes an angle of between 45 degrees and 90 degrees with a connecting axis of the interconnects, running orthogonally with respect to the two interconnects, the at least one auxiliary structure being produced from a material which allows the at least one auxiliary structure to be selectively removed from a dielectric layer. The dielectric layer is formed between the two interconnects, in such a manner that the at least one auxiliary structure is at least partially covered by the dielectric layer.
    • 公开了一种用于制造电路装置的装置和方法。 该方法包括具有层布置,其中在基板上形成基本上彼此平行延伸的两个导电互连。 至少一个辅助结构形成在基板上并且在两个互连之间并且在第一方向上延伸,该第一方向与互连件的连接轴线成45度到90度之间的角度,相对于两个互连件正交地运行 所述至少一个辅助结构由允许所述至少一个辅助结构从电介质层选择性地去除的材料制成。 介电层形成在两个互连之间,使得至少一个辅助结构至少部分地被电介质层覆盖。