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1. 发明申请

US20070060351A1 Method and apparatus for teaching music concepts 失效
标题翻译：教学音乐概念的方法和装置
公开(公告)号：US20070060351A1
公开(公告)日：2007-03-15
申请号：US11512992
申请日：2006-08-30
申请人： Bernardo Paratore , Richard Brewer
发明人： Bernardo Paratore , Richard Brewer
IPC分类号： A63F9/24
CPC分类号： A63F13/814 , A63F13/005 , A63F2300/8047 , G09B15/00 , G09B15/003
摘要： The present invention describes a method for playing a music game. The game is played by having each player move along a game path that includes a plurality of spaces, each of which is associated with a key signature. Each player advances along the path when he or she correctly identifies the elements of music structures. A random or pseudorandom event generator may be used to select the music structure elements and an event verifier may be used to correct the construction of the music structures. Each player may earn royalties play money in the course of a game.
摘要翻译：本发明描述了一种用于播放音乐游戏的方法。通过使每个玩家沿着包括多个空格的游戏路径移动游戏，每个空格与键签名相关联。当他或她正确地识别音乐结构的元素时，每个玩家沿着路径前进。可以使用随机或伪随机事件发生器来选择音乐结构元素，并且事件验证器可以用于校正音乐结构的构造。每个玩家可能会在游戏过程中赚取版税费用。

2. 发明申请

US20070256815A1 Scalable liquid cooling system with modular radiators 审中-公开
标题翻译：具有模块化散热器的可扩展液体冷却系统
公开(公告)号：US20070256815A1
公开(公告)日：2007-11-08
申请号：US11800275
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , James Hom
发明人： Bruce Conway , Richard Brewer , James Hom
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , G06F1/185 , G06F2200/201
摘要： A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
摘要翻译：公开了可扩展和模块化的冷却系统。冷却系统包括具有多个膨胀槽的空气增压室。每个扩展槽被配置成接收模块化配置的流体对空气热交换器，例如散热器。空气增压室还包括用于通过膨胀槽吹送空气的一个或多个空气推动器，因此通过安装在膨胀槽内的任何散热器。对于那些未使用的扩展槽，每个未使用的扩展槽都安装一个挡板。每个挡板以类似于模块化配置的散热器的方式被模块化地配置。以这种方式，基本上防止了空气旁路。每个散热器是独立冷却回路的一部分，直接或间接地用于冷却发热装置。

3. 发明申请

US20080013278A1 Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles 审中-公开
标题翻译：用于液体冷却系统的水箱用于提供补充液和捕集气泡
公开(公告)号：US20080013278A1
公开(公告)日：2008-01-17
申请号：US11823525
申请日：2007-06-27
申请人： Fredric Landry , Bruce Conway , Richard Brewer , Norman Chow , Peng Zhou , Tien-Chih (Eric) Lin
发明人： Fredric Landry , Bruce Conway , Richard Brewer , Norman Chow , Peng Zhou , Tien-Chih (Eric) Lin
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , F28D15/00 , G06F1/20 , G06F2200/201
摘要： A fluid compensation apparatus is configured to provide replacement fluid to a fluid-based cooling loop, while removing dissolved gas or gas in gross bubbles from the cooling loop. Removal or reduction of gas from the cooling loop reduces or prevents pump vapor lock. The removed gas is retained within the fluid compensation apparatus. The fluid compensation apparatus is configured to prevent the trapped gas from being re-introduced to the fluid-based cooling loop, regardless of the orientation of the fluid compensation apparatus. Additionally, the fluid compensation apparatus is configured to remove gas from and add fluid to the cooling loop with limited or no pressure drop between the inlet port and the outlet port of the fluid compensation apparatus. As a result, the pump does not require additional power to compensate for such a pressure differential.
摘要翻译：液体补偿装置被配置为向基于流体的冷却回路提供更换流体，同时从冷却回路中除去大气泡中的溶解气体或气体。从冷却回路中去除或还原气体会降低或防止泵蒸气锁定。去除的气体保留在流体补偿装置内。流体补偿装置被配置为防止被捕获的气体被重新引入基于流体的冷却回路，而与流体补偿装置的取向无关。此外，流体补偿装置构造成在流体补偿装置的入口和出口之间有限或没有压力降，从而从流体中除去气体并向流体补充流体。因此，泵不需要额外的功率来补偿这种压力差。

4. 发明申请

US20070256825A1 Methodology for the liquid cooling of heat generating components mounted on a daughter card/expansion card in a personal computer through the use of a remote drive bay heat exchanger with a flexible fluid interconnect 审中-公开
标题翻译：通过使用具有柔性流体互连的远程驱动室热交换器来安装在个人计算机的子卡/扩展卡上的发热部件的液体冷却的方法
公开(公告)号：US20070256825A1
公开(公告)日：2007-11-08
申请号：US11800303
申请日：2007-05-03
申请人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
发明人： Bruce Conway , Richard Brewer , Paul Tsao , James Hom , Douglas Werner , Peng Zhou , Girish Upadhya , Madhav Datta , Ali Firouzi , Fredric Landry
IPC分类号： G05D23/00 , H01L23/467
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

5. 发明授权

US08157001B2 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US08157001B2
公开(公告)日：2012-04-17
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： G05D23/00 , F28F7/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
摘要翻译：集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

6. 发明申请

US20070227708A1 Integrated liquid to air conduction module 有权
标题翻译：集成液体到空气传导模块
公开(公告)号：US20070227708A1
公开(公告)日：2007-10-04
申请号：US11731484
申请日：2007-03-30
申请人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
发明人： James Hom , Girish Upadhya , Douglas E. Werner , Mark Munch , Paul Tsao , Bruce Conway , Peng Zhou , Richard Brewer
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。另外，流体路径可以包括微通道板结构。该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。储存器可以连接到流体路径。

7. 发明申请

US20060079461A1 Treatment of multiple myeloma by inhibition of p38 MAP kinase 审中-公开
标题翻译：通过抑制p38 MAP激酶治疗多发性骨髓瘤
公开(公告)号：US20060079461A1
公开(公告)日：2006-04-13
申请号：US11207542
申请日：2005-08-19
申请人： Richard Brewer , Linda Higgins
发明人： Richard Brewer , Linda Higgins
IPC分类号： A61K38/06 , A61K38/05 , A61K31/454 , A61K31/445
CPC分类号： A61K31/404 , A61K31/407
摘要： The present invention provides a method to treat multiple myeloma by the administration of one or more p38 MAP kinase inhibitor(s).
摘要翻译：本发明提供了通过施用一种或多种p38 MAP激酶抑制剂治疗多发性骨髓瘤的方法。

8. 发明申请

US20050268626A1 Method and apparatus for controlling freezing nucleation and propagation 有权
标题翻译：用于控制冷冻成核和传播的方法和装置
公开(公告)号：US20050268626A1
公开(公告)日：2005-12-08
申请号：US11049202
申请日：2005-02-01
申请人： Girish Upadhya , Richard Brewer , Mark McMaster
发明人： Girish Upadhya , Richard Brewer , Mark McMaster
IPC分类号： A21D2/00 , A21D8/02 , F25D21/00 , F28F3/12
CPC分类号： F28F3/12 , F28F2265/14
摘要： An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.
摘要翻译：公开了一种在液体系统中控制冷冻的装置和方法。该装置包括具有以表面积与体积比为特征的初始区的热交换器。该设备还包括用于启动来自初始区域的流体冷冻的装置，以便在以最终区域表面积与体积比为特征的最终区域的方向的冷冻期间促进体积膨胀。该设备还可以包括位于初始区域和最终区域之间的多个区域，其中针对每个区域计算区域表面积与体积比。优选地，每个区域的区域表面积与体积比逐渐从初始区域沿最终区域的方向减小。优选地，最终的冷冻区具有最低的表面积与体积比，并且具有足够的弹性以适应从初始区域冻结的所有流体的体积膨胀。

9. 发明申请

US20050270742A1 Semi-compliant joining mechanism for semiconductor cooling applications 有权
标题翻译：半合规半导体冷却应用的连接机制
公开(公告)号：US20050270742A1
公开(公告)日：2005-12-08
申请号：US10945807
申请日：2004-09-20
申请人： Richard Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
发明人： Richard Brewer , Paul Tsao , Richard Herms , Mark Munch , Mark McMaster , Dave Corbin
IPC分类号： H01L23/40 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
摘要翻译：热收集装置使用包括万向接头的万向板安装在热源上。万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。保持力沿着与热源的热界面的面心法线向量共线的矢量施加。这导致保持力在热界面区域上的平衡和集中应用。万向节板使用弹簧装置直接安装到电路板上。弹簧意味着调节通过万向节接头到集热装置的配合力的量。由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。以这种方式，产生高性能的TIM接口。

10. 发明申请

US20050269061A1 Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效流体输送的装置和方法
公开(公告)号：US20050269061A1
公开(公告)日：2005-12-08
申请号：US11049313
申请日：2005-02-01
申请人： Richard Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
发明人： Richard Brewer , Girish Upadhya , Peng Zhou , Mark McMaster , Paul Tsao
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

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