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    • 3. 发明授权
    • Error compensation in three-dimensional mapping
    • 三维映射中的误差补偿
    • US09330324B2
    • 2016-05-03
    • US13541775
    • 2012-07-05
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • H04N5/228G01B11/30G06K9/20G06T7/00H04N13/02
    • G06K9/2036G06K2209/40G06T7/521G06T2207/30196H04N13/254H04N13/271
    • A method for forming a three-dimensional (3D) map of an object, including illuminating the object from a light source so as to project a pattern onto the object, capturing an image of the pattern using an array of detector elements, and processing the captured image so as to measure respective offsets of elements of the pattern in the captured image relative to a reference pattern, the offsets including at least a first offset of a first element of the pattern and a second offset of a second element of the pattern, measured respectively in first and second, mutually-perpendicular directions in a plane of the array. The method further includes computing a correction factor in response to the first offset, applying the correction factor to the second offset so as to find a corrected offset, and computing depth coordinates of the object in response to the corrected offset.
    • 一种用于形成物体的三维(3D)地图的方法,包括从光源照射物体以将图案投射到物体上,使用检测器元件的阵列捕获图案的图像,并且处理 拍摄图像,以便相对于参考图案测量所捕获的图像中的图案的元素的相应偏移,所述偏移包括图案的第一元素的第一偏移和图案的第二元素的第二偏移的至少第一偏移, 分别在阵列的平面中的第一和第二,相互垂直的方向测量。 所述方法还包括:响应于所述第一偏移来计算校正因子,将所述校正因子应用于所述第二偏移,以便找到校正的偏移量,以及响应于校正的偏移来计算所述物体的深度坐标。
    • 6. 发明申请
    • Error Compensation in Three-Dimensional Mapping
    • 三维映射误差补偿
    • US20120281240A1
    • 2012-11-08
    • US13541775
    • 2012-07-05
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • G01B11/25
    • G06K9/2036G06K2209/40G06T7/521G06T2207/30196H04N13/254H04N13/271
    • A method for forming a three-dimensional (3D) map of an object, including illuminating the object from a light source so as to project a pattern onto the object, capturing an image of the pattern using an array of detector elements, and processing the captured image so as to measure respective offsets of elements of the pattern in the captured image relative to a reference pattern, the offsets including at least a first offset of a first element of the pattern and a second offset of a second element of the pattern, measured respectively in first and second, mutually-perpendicular directions in a plane of the array. The method further includes computing a correction factor in response to the first offset, applying the correction factor to the second offset so as to find a corrected offset, and computing depth coordinates of the object in response to the corrected offset.
    • 一种用于形成物体的三维(3D)地图的方法,包括从光源照射物体以将图案投射到物体上,使用检测器元件的阵列捕获图案的图像,并且处理 拍摄图像,以便相对于参考图案测量所捕获的图像中的图案的元素的相应偏移,所述偏移包括图案的第一元素的第一偏移和图案的第二元素的第二偏移的至少第一偏移, 分别在阵列的平面中的第一和第二,相互垂直的方向测量。 所述方法还包括:响应于所述第一偏移来计算校正因子,将所述校正因子应用于所述第二偏移,以便找到校正的偏移量,以及响应于校正的偏移来计算所述物体的深度坐标。
    • 7. 发明申请
    • Error Compensation in Three-Dimensional Mapping
    • 三维映射误差补偿
    • US20110096182A1
    • 2011-04-28
    • US12605340
    • 2009-10-25
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • Daniel CohenDmitri RaisErez SaliNiv GalezerAlexander Shpunt
    • H04N5/228G06K9/36G06T17/00
    • G06K9/2036G06K2209/40G06T7/521G06T2207/30196H04N13/254H04N13/271
    • A method for forming a three-dimensional (3D) map of an object, including illuminating the object from a light source so as to project a pattern onto the object, capturing an image of the pattern using an array of detector elements, and processing the captured image so as to measure respective offsets of elements of the pattern in the captured image relative to a reference pattern, the offsets including at least a first offset of a first element of the pattern and a second offset of a second element of the pattern, measured respectively in first and second, mutually-perpendicular directions in a plane of the array. The method further includes computing a correction factor in response to the first offset, applying the correction factor to the second offset so as to find a corrected offset, and computing depth coordinates of the object in response to the corrected offset.
    • 一种用于形成物体的三维(3D)地图的方法,包括从光源照射物体以将图案投射到物体上,使用检测器元件的阵列捕获图案的图像,并且处理 拍摄图像,以便相对于参考图案测量所捕获的图像中的图案的元素的相应偏移,所述偏移包括图案的第一元素的第一偏移和图案的第二元素的第二偏移的至少第一偏移, 分别在阵列的平面中的第一和第二,相互垂直的方向测量。 所述方法还包括:响应于所述第一偏移来计算校正因子,将所述校正因子应用于所述第二偏移,以便找到校正的偏移量,以及响应于校正的偏移来计算所述物体的深度坐标。
    • 9. 发明申请
    • DEFECT DETECTION THROUGH IMAGE COMPARISON USING RELATIVE MEASURES
    • 通过使用相对措施的图像比较缺陷检测
    • US20080100844A1
    • 2008-05-01
    • US11590650
    • 2006-10-31
    • Erez SaliOren Cohen
    • Erez SaliOren Cohen
    • G01N21/00G01B11/00
    • G01N21/95607G06T7/001G06T2207/30148
    • Inspection of objects such as semiconductor wafers can include comparisons of shapes between inspection and reference images. As part of the inspection process, relative values may be assigned to pixels within each image based on comparison of such pixels to neighboring pixels. For instance, the pixels may be ranked by relative brightness in each image. Alternatively, directional vectors may be defined based on slopes between pixels and their neighbors. Various comparison metrics may be utilized to determine the degree of correlation between the relative values for pixels in the inspection image and corresponding pixels in the reference image. Relative values may be combined with conventional techniques as part of an inspection process. The inspection may be performed using an optical inspection tool that uses conventional techniques to identify defect candidates, with relative value analysis performed on areas containing defect candidates to confirm or deny the existence of a defect.
    • 检查诸如半导体晶片的物体可以包括检查和参考图像之间的形状的比较。 作为检查过程的一部分,可以基于这些像素与相邻像素的比较将相对值分配给每个图像内的像素。 例如,像素可以通过每个图像中的相对亮度进行排序。 或者,可以基于像素与其邻居之间的斜率来定义方向向量。 可以使用各种比较度量来确定检查图像中的像素和参考图像中的对应像素的相对值之间的相关度。 作为检查过程的一部分,相对值可以与常规技术相结合。 可以使用使用常规技术来识别缺陷候选的光学检查工具进行检查,对包含缺陷候选的区域进行相对值分析以确认或拒绝存在缺陷。